Patents by Inventor Shinsuke Suzuki

Shinsuke Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060011533
    Abstract: The present invention is to provide a method of producing a separating agent for an enantiomeric isomer having high optical resolution power together with sufficient solvent resistance. That is, a method of producing a separating agent for an enantiomeric isomer comprising the steps of allowing the porous carrier to carry the optically active polymer compound by bringing the porous carrier into contact with a dope of the optically active polymer compound; and exposing a product to radiation.
    Type: Application
    Filed: November 13, 2003
    Publication date: January 19, 2006
    Inventors: Shinsuke Suzuki, Atsushi Onishi, Kazumi Suzuki
  • Publication number: 20050218194
    Abstract: A wire bonding apparatus includes a heat block (121) and a heat plate (122) provided on the heat block (121). A recess (1221) is provided in the heat plate (122) to receive the first semiconductor chip (41) and wires (51) without contact therewith when the lead frame (50) is provided on the heat plate (122) such that the first main surface (501) of the lead frame (50) faces toward heat plate. A duct (13) is provided in the heat plate (122) to connect the recess (1221) to the outside of the heat plate (122). A gas supplied through the duct (13) is heated by a heater (14) and discharged into the recess (1221).
    Type: Application
    Filed: January 13, 2005
    Publication date: October 6, 2005
    Inventor: Shinsuke Suzuki
  • Publication number: 20050198374
    Abstract: Without changing an existing network and terminals, means for preventing improper use of the network is introduced at low costs. An address management server having a topology database of Layer 2 devices (hub, switch, and wireless station in the case of Ethernet) that configure an intranet is used. Within the server, with respect to each Layer 2 device, an address/port number correspondence acquisition means and a packet filtering specification means are stored. The address management server, according to topology information, recursively calls the address/port number correspondence acquisition means of each Layer 2 device from the upstream of the network, thereby obtaining a Layer 2 device accommodating a given Layer 2 address and its port number. By recursively calling the packet filtering specification means from the Layer 2 device in the upstream direction of the network, the Layer 2 device obtained above and its port number are filtered in a Layer device nearest to the terminal.
    Type: Application
    Filed: August 10, 2004
    Publication date: September 8, 2005
    Applicant: Hitachi, Ltd.
    Inventor: Shinsuke Suzuki
  • Publication number: 20050172891
    Abstract: A dies bonding apparatus is provided with a nozzle unit for supplying an adhesive agent to a rectangular bonding area of a chip mounting surface. The nozzle unit includes a central nozzle for discharging an adhesive agent to the center of the bonding area, and a plurality of peripheral nozzles provided around the central nozzle and whose amount of discharge of the adhesive agent is smaller than the amount of discharge of the adhesive agent from the central nozzle.
    Type: Application
    Filed: July 16, 2004
    Publication date: August 11, 2005
    Inventors: Shinsuke Suzuki, Shinji Muraki
  • Patent number: 6882056
    Abstract: A multi-chip package type semiconductor device includes an insulating substrate having first and second conductive patterns thereon, a first semiconductor chip on the insulating substrate and having a first terminal pad and a relay pad isolated from the first terminal pad. The device further includes a second semiconductor chip on the first semiconductor chip having a second terminal pad. The first semiconductor chip is connected to the first pattern by a first bonding wire. The second semiconductor chip is connected to the second pattern by a second bonding wire, which connects the second pattern to the relay pad, and a third bonding wire, which connects the relay pad to the second terminal pad. The lengths of the first, second and third bonding wire are approximately the same.
    Type: Grant
    Filed: June 17, 2002
    Date of Patent: April 19, 2005
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Mitsuru Komiyama, Shinsuke Suzuki
  • Publication number: 20050041671
    Abstract: A first internetwork apparatus connected to a network retains a plurality of IPv6 address prefixes and gives notice of an arbitrary IPv6 address prefix to a second internetwork apparatus in response to a request from the second internetwork apparatus. A second internetwork apparatus requests an IPv6 address prefix from the first internetwork apparatus, and generates a second prefix required to create an IPv6 address in a user apparatus, on the basis of one or more IPv6 address prefixes given as notice by the first internetwork apparatus. The second internetwork apparatus gives notice of the generated second prefix to the user apparatus.
    Type: Application
    Filed: July 26, 2004
    Publication date: February 24, 2005
    Inventors: Naoya Ikeda, Shuji Ono, Shinsuke Suzuki, Mika Mizutani
  • Publication number: 20040205211
    Abstract: Due to the mobility of mobile node devices including for example a laptop computer used on a work network and also on a home network with different home addresses, a mobile node (MN) home address and HA (home agent) address may need to be dynamically changed when using prefix communication functions and HA address discovery functions so methods for manually setting the IPsec SA security for encryption between the MN and HA are not practical in this environment. The current Mobile IPv6 protocol also has no function allowing recognition of the MN itself.
    Type: Application
    Filed: February 23, 2004
    Publication date: October 14, 2004
    Inventors: Yukiko Takeda, Hidenori Inouchi, Shinsuke Suzuki, Keisuke Takeuchi
  • Patent number: 6803458
    Abstract: The present invention provides a cellulose acetate satisfying at least one requirement selected from the following requirements (A), (B) and (C), provided that the case where (B) alone is satisfied is excluded. Requirement (A): Bright spotty matters in sizes of 20 &mgr;m or more are not more than 20 units/mm3. Requirement (B): Blocking constant (K) is not more than 60. Requirement (C): The ratio (G′/G″) of storage modulus (G′) to loss modulus (G″) at a measuring frequency of 0.016 Hz is not more than 0.2.
    Type: Grant
    Filed: September 20, 2002
    Date of Patent: October 12, 2004
    Assignee: Daicel Chemical Industries, Ltd.
    Inventors: Toru Ozaki, Hirofumi Sasai, Hiroki Taniguchi, Michiyo Nakai, Shinsuke Suzuki
  • Publication number: 20040179539
    Abstract: Disclosed is a communication method allowing MN (mobile nodes) to acquire a home address in a visited network. A communication system comprises a home network installed with a home agent for holding mobile terminal location information and, a visited network installed with a radio communications device for communicating with that mobile terminal, and gateway equipment in the visited network for forming an interface with the home network. The radio communication device contains an access request transfer means for forwarding access requests from a mobile terminal of the visited network to the gateway equipment, and the gateway equipment makes an acquisition request to the home agent for an identifier of that mobile terminal, and forwards that acquired identifier to that mobile terminal.
    Type: Application
    Filed: July 16, 2003
    Publication date: September 16, 2004
    Inventors: Yukiko Takeda, Hidenori Inouchi, Keisuke Takeuchi, Shinsuke Suzuki
  • Publication number: 20040158643
    Abstract: By using combinations of a plurality of firewall techniques and making these techniques work together appropriately, problems presented with popular use of always-on Internet connections and end-to-end communications using IPv6 are resolved. This flexible manner of applying access control techniques grants favors to corporate network users, resulting from the popular use of always-on Internet connections and IPv6, e.g., the promotion of teleworking and virtual offices. A traffic control computing device which processes control requests from traffic control devices, provided in a network, coordinates the control actions of the individual traffic control devices appropriately.
    Type: Application
    Filed: January 16, 2004
    Publication date: August 12, 2004
    Applicant: Hitachi, Ltd.
    Inventors: Shinsuke Suzuki, Yoshifumi Atarashi, Naoya Ikeda
  • Patent number: 6762490
    Abstract: A semiconductor device, wherein contact between bonding wires is prevented, and a method for producing the same are disclosed. A contact prevention member is placed on outer bonding wires so as to be interposed between the outer bonding wires and inner bonding wires, thereby preventing the inner wires and the outer wires from coming into contact with each other.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: July 13, 2004
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Shinsuke Suzuki
  • Publication number: 20040100983
    Abstract: In a multicast network which permits client nodes to join only a source-specific multicast group, when a multicast group join request is received from a client node provided with an any-source multicast management protocol, a multicast router translates the join request into a join request for a source-specific multicast group by applying a source server address of the multicast group searched from a multicast source address table on the basis of an address of an incoming line of the join request and the multicast group address designated in the join request.
    Type: Application
    Filed: June 27, 2003
    Publication date: May 27, 2004
    Inventor: Shinsuke Suzuki
  • Patent number: 6736967
    Abstract: A separating agent for enantiomeric isomers has an enantiomerically active polymer compound supported thereon. The polymer compound has an exothermic peak before a decomposition temperature of the polymer compound supported is reached in a differential calorimetric curve obtained in a process of temperature elevation in differential scanning calorimetry (DSC) on the separating agent. Also, disclosed is a method of evaluating asymmetry recognition ability of a separating agent for enantiomeric isomers. The method includes performing the differential scanning calorimetry (DSC) of a separating agent for enantiomeric isomers having supported thereon an enantiomerically active polymer compound to obtain a differential calorimetric curve in a process of temperature elevation therein, and observing presence or absence of an exothermic peak of the polymer compound in the differential calorimetric curve before a decomposition temperature of the supported polymer compound is reached.
    Type: Grant
    Filed: June 4, 2002
    Date of Patent: May 18, 2004
    Assignee: Daicel Chemical Industries, Ltd.
    Inventors: Atsushi Ohnishi, Shinsuke Suzuki, Masato Sakai
  • Publication number: 20030198214
    Abstract: A highly-expandable router configuration technology which flexibly meets the need to increase lines as a network grows. A network information sharing unit is provided in a route calculation unit of each router in a clustered router. The network information sharing unit receives an update notification of network information collected by routing protocol units and sends this update information to all other routers in the clustered router as a network information notification packet. The network information sharing units in the receiving router notifies the routing protocol units of the contents of the received updated information. The routing protocol unit updates the network information thereof based on the notified contents, thereby allowing the network information obtained from all routers outside the clustered router to be shared and the clustered router to be recognized externally as a single router.
    Type: Application
    Filed: April 30, 2003
    Publication date: October 23, 2003
    Inventors: Masato Tsukakoshi, Shinsuke Suzuki, Shigeki Morimoto
  • Patent number: 6577634
    Abstract: A highly-expandable router configuration technology which flexibly meets the need to increase lines as a network grows. A network information sharing unit is provided in a route calculation unit of each router in a clustered router. The network information sharing unit receives an update notification of network information collected by routing protocol units and sends this update information to all other routers in the clustered router as a network information notification packet. The network information sharing units in the receiving router notifies the routing protocol units of the contents of the received updated information. The routing protocol unit updates the network information thereof based on the notified contents, thereby allowing the network information obtained from all routers outside the clustered router to be shared and the clustered router to be recognized externally as a single router.
    Type: Grant
    Filed: June 30, 1999
    Date of Patent: June 10, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Masato Tsukakoshi, Shinsuke Suzuki, Shigeki Morimoto
  • Publication number: 20030092906
    Abstract: The present invention provides a cellulose acetate satisfying at least one requirement selected from the following requirements (A), (B) and (C), provided that the case where (B) alone is satisfied is excluded.
    Type: Application
    Filed: September 20, 2002
    Publication date: May 15, 2003
    Inventors: Toru Ozaki, Hirofumi Sasai, Hiroki Taniguchi, Michiyo Nakai, Shinsuke Suzuki
  • Publication number: 20030080405
    Abstract: A semiconductor device, wherein contact between bonding wires is prevented, and a method for producing the same are disclosed. A contact prevention member is placed on outer bonding wires so as to be interposed between the outer bonding wires and inner bonding wires, thereby preventing the inner wires and the outer wires from coming into contact with each other.
    Type: Application
    Filed: September 19, 2002
    Publication date: May 1, 2003
    Inventor: Shinsuke Suzuki
  • Publication number: 20030010696
    Abstract: A separating agent for enantiomeric isomers has an enantiomerically active polymer compound supported thereon. The polymer compound has an exothermic peak before a decomposition temperature of the polymer compound supported is reached in a differential calorimetric curve obtained in a process of temperature elevation in differential scanning calorimetry (DSC) on the separating agent. Also, disclosed is a method of evaluating asymmetry recognition ability of a separating agent for enantiomeric isomers. The method includes performing the differential scanning calorimetry (DSC) of a separating agent for enantiomeric isomers having supported thereon an enantiomerically active polymer compound to obtain a differential calorimetric curve in a process of temperature elevation therein, and observing presence or absence of an exothermic peak of the polymer compound in the differential calorimetric curve before a decomposition temperature of the supported polymer compound is reached.
    Type: Application
    Filed: June 4, 2002
    Publication date: January 16, 2003
    Inventors: Atsushi Ohnishi, Shinsuke Suzuki, Masato Sakai
  • Publication number: 20020153615
    Abstract: A multi-chip package type semiconductor device includes an insulating substrate having first and second conductive patterns thereon, a first semiconductor chip on the insulating substrate and having a first terminal pad and a relay pad isolated from the first terminal pad. The device further includes a second semiconductor chip on the first semiconductor chip having a second terminal pad. The first semiconductor chip is connected to the first pattern by a first bonding wire. The second semiconductor chip is connected to the second pattern by a second bonding wire, which connects the second pattern to the relay pad, and a third bonding wire, which connects the relay pad to the second terminal pad. The lengths of the first, second and third bonding wire are approximately the same.
    Type: Application
    Filed: June 17, 2002
    Publication date: October 24, 2002
    Inventors: Mitsuru Komiyama, Shinsuke Suzuki
  • Publication number: 20020047213
    Abstract: A multi-chip package type semiconductor device includes an insulating substrate having first and second conductive patterns thereon, a first semiconductor chip on the insulating substrate and having a first terminal pad and a relay pad isolated from the first terminal pad. The device further includes a second semiconductor chip on the first semiconductor chip having a second terminal pad. The first semiconductor chip is connected to the first pattern by a first bonding wire. The second semiconductor chip is connected to the second pattern by a second bonding wire, which connects the second pattern to the relay pad, and a third bonding wire, which connects the relay pad to the second terminal pad. The lengths of the first, second and third bonding wire are approximately the same.
    Type: Application
    Filed: September 27, 2001
    Publication date: April 25, 2002
    Inventors: Mitsuru Komiyama, Shinsuke Suzuki