Patents by Inventor Shinsuke Watanabe

Shinsuke Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9009898
    Abstract: When pressure detected by a pressure sensor connected to a calibration standard cell has continuously fallen within a regulated pressure range at calibration for a regulated duration at calibration, zero-adjustment is performed based on the pressure value detected by the pressure sensor. Then, communication between the plurality of cells is created to perform internal pressure adjustment of the plurality of cells to a predetermined internal pressure value, based on the pressure value detected by the pressure sensor connected to the calibration standard cell and calibrate each of pressure sensors connecting to the plurality of cells, based on the adjusted internal pressure. With this scheme, it is possible to a mattress and the like that can perform zero-point adjustment efficiently by adjusting the zero point in the same manner even if the mattress is formed of a plurality of branches, without releasing the pressure sensor of each cell to atmospheric pressure.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: April 21, 2015
    Assignee: Paramount Bed Co., Ltd.
    Inventors: Hisao Morimura, Makoto Tanaka, Shinsuke Watanabe
  • Publication number: 20150000044
    Abstract: When pressure detected by a pressure sensor connected to a calibration standard cell has continuously fallen within a regulated pressure range at calibration for a regulated duration at calibration, zero-adjustment is performed based on the pressure value detected by the pressure sensor. Then, communication between the plurality of cells is created to perform internal pressure adjustment of the plurality of cells to a predetermined internal pressure value, based on the pressure value detected by the pressure sensor connected to the calibration standard cell and calibrate each of pressure sensors connecting to the plurality of cells, based on the adjusted internal pressure. With this scheme, it is possible to a mattress and the like that can perform zero-point adjustment efficiently by adjusting the zero point in the same manner even if the mattress is formed of a plurality of branches, without releasing the pressure sensor of each cell to atmospheric pressure.
    Type: Application
    Filed: November 20, 2012
    Publication date: January 1, 2015
    Inventors: Hisao Morimura, Makoto Tanaka, Shinsuke Watanabe
  • Patent number: 8905256
    Abstract: A resin-coated metal sheet includes resin layers formed on both surfaces thereof and composed of a polyester as a main component, wherein the resin layer covering the inner surface of a container after the formation thereof has an interfacial free energy with water of 30 mN/m or more. The container formed from the resin-coated metal sheet exhibits an excellent content release property for contents with a high protein content.
    Type: Grant
    Filed: July 26, 2006
    Date of Patent: December 9, 2014
    Assignee: JFE Steel Corporation
    Inventors: Yoichiro Yamanaka, Junichi Kitagawa, Yoshihiko Yasue, Yasuhide Oshima, Hiroshi Kubo, Hiroki Iwasa, Shinsuke Watanabe, Katsunori Nakai
  • Publication number: 20140346025
    Abstract: A low travel switch assembly and systems and methods for using the same are disclosed. The low travel dome may include a domed surface having upper and lower portions, and a set of tuning members integrated within the domed surface between the upper and lower portions. The tuning members may be operative to control a force-displacement curve characteristic of the low travel dome.
    Type: Application
    Filed: May 27, 2014
    Publication date: November 27, 2014
    Applicant: Apple Inc.
    Inventors: Keith J. Hendren, Thomas W. Wilson, JR., John M. Brock, Craig C. Leong, James J. Niu, Satoshi Okuma, Shinsuke Watanabe
  • Publication number: 20140318943
    Abstract: Provided is a push switch that can be made thin without requiring that a notch be made into a mounting board. The push switch includes a substrate having a L-shaped cross section and wherein the substrate has a front surface, a back surface and a side face, an accommodating recess provided on the front surface, a center contact provided so as to be substantially centralized in the accommodating recess, a pair of peripheral contacts each provided at a circumferential edge of the accommodating recess, a movable contact spring constructed so as to extend across the pair of peripheral contacts and designed to be brought into contact with the center contact when pressed, a connection pad provided on the back surface and electrically connected to the mounting substrate, and an electrode provided on the side face and electrically connected to the connection pad.
    Type: Application
    Filed: July 12, 2014
    Publication date: October 30, 2014
    Inventor: Shinsuke Watanabe
  • Publication number: 20140305445
    Abstract: A bed apparatus includes: a mattress mounted on a bed body; and, first cells arranged on both left and right sides in a longitudinal direction of the bed body and is configured to change the body position of a patient on the mattress by inflating the first cells alternately. When the first cells on the left and right sides are inflated, and when a difference in pressure between the first cells on the left and right sides has continuously fallen within a decision pressure value range for a decision pressure value continuation time, the body position of the patient is changed, whereas when the difference has not continuously fallen within the pressure value range for the continuation time or when the difference has continuously fallen out of the pressure value range for the continuation time, change of the body position of the patient will not be performed.
    Type: Application
    Filed: December 12, 2012
    Publication date: October 16, 2014
    Inventors: Hisao Morimura, Makoto Tanaka, Shinsuke Watanabe
  • Publication number: 20140292440
    Abstract: Disclosed is a directional coupler including a first hollow portion 1301 that is disposed in a first ground conductor 1201 and is arranged directly above a first signal conductor 1001 and a second signal conductor 1002, and that is constructed of a discontinuous structure that has a function of delaying the phase and that is small with respect to the one-quarter wavelength of an operating frequency.
    Type: Application
    Filed: March 25, 2014
    Publication date: October 2, 2014
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Akimichi HIROTA, Tetsu OWADA, Kazuhiro IYOMASA, Shinsuke WATANABE, Kazuya YAMAMOTO
  • Publication number: 20140292439
    Abstract: Disclosed is a directional coupler including a broadside coupled line 1031 provided with a main signal line conductor 1001 and a secondary signal line conductor 1011 arranged in parallel with the main signal line conductor 1001, and an offset broadside coupled line 1032 provided with a main signal line conductor 1002 having an end portion connected to an end portion of the main signal line conductor 1001 and a second secondary signal line conductor 1012 having an end portion connected to an end portion of the secondary signal line conductor 1011, and arranged in parallel with the main signal line conductor 1002, in which a coupled line impedance in the broadside coupled line 1031 is lower than a terminal impedance and a coupled line impedance in the offset broadside coupled line 1032 is higher than the terminal impedance.
    Type: Application
    Filed: March 25, 2014
    Publication date: October 2, 2014
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hideharu YOSHIOKA, Akimichi HIROTA, Tetsu OWADA, Shinsuke WATANABE, Kazuhiro IYOMASA, Kazuya YAMAMOTO
  • Patent number: 8809709
    Abstract: Provided is a pushbutton switch that can be made thin without requiring that a notch be made into a mounting board. The pushbutton switch is provided with a first substrate having a housing recess part located on a surface of the first substrate, a center contact provided at roughly the center of the interior of the housing recess part, a pair of peripheral contacts provided on peripheral edge parts of the housing recess part, a movable contact spring that is installed on the pair of peripheral contacts and that touches the center contact upon being pressed, and a second substrate, which is provided with a pair of connection pads electrically connected to the first substrate. A cross section of the first and second substrates is formed as a whole into an ā€œLā€-like shape.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: August 19, 2014
    Assignees: Citizen Electronics Co., Ltd., Citizen Holdings Co., Ltd.
    Inventor: Shinsuke Watanabe
  • Publication number: 20140151213
    Abstract: Provided is a pushbutton switch that can be made thin without requiring that a notch be made into a mounting board. The pushbutton switch is provided with a first substrate having a housing recess part located on a surface of the first substrate, a center contact provided at roughly the center of the interior of the housing recess part, a pair of peripheral contacts provided on peripheral edge parts of the housing recess part, a movable contact spring that is installed on the pair of peripheral contacts and that touches the center contact upon being pressed, and a second substrate, which is provided with a pair of connection pads electrically connected to the first substrate.
    Type: Application
    Filed: February 22, 2013
    Publication date: June 5, 2014
    Applicant: CITIZEN ELECTRONCIS CO., LTD.
    Inventor: Shinsuke Watanabe
  • Patent number: 8728866
    Abstract: A method for manufacturing a semiconductor device comprises: forming a circuit pattern and a first metal film on a first major surface of a body wafer; forming a through-hole penetrating the body wafer from a second major surface of the body wafer and reaching the first metal film; forming a second metal film on a part of the second major surface of the body wafer, on an inner wall of the through-hole, and on the first metal film exposed in the through-hole; forming a recess on a first major surface of a lid wafer; forming a third metal film on the first major surface of the lid wafer including inside the recess of the lid wafer; with the recess facing the circuit pattern, and the first metal film contacting the third metal film, joining the lid wafer to the body wafer; and dicing the joined body wafer and lid wafer along the through-hole.
    Type: Grant
    Filed: April 4, 2011
    Date of Patent: May 20, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Ko Kanaya, Yoshihiro Tsukahara, Shinsuke Watanabe
  • Patent number: 8653888
    Abstract: A high-frequency signal amplifier includes an amplifier having an input terminal and an output terminal, and amplifying a high-frequency signal; a signal line connected between the output terminal of the amplifier and an antenna; coupled lines arranged in parallel and coupled to the signal line and having different line lengths or differently terminated ends; and phase shifters shifting phase of high-frequency signals applied via the signal line and the coupled lines, supplying the high-frequency signals to the input terminal of the amplifier, and having different amounts of phase change.
    Type: Grant
    Filed: June 5, 2012
    Date of Patent: February 18, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventor: Shinsuke Watanabe
  • Publication number: 20130093510
    Abstract: A high-frequency signal amplifier includes an amplifier having an input terminal and an output terminal, and amplifying a high-frequency signal; a signal line connected between the output terminal of the amplifier and an antenna; coupled lines arranged in parallel and coupled to the signal line and having different line lengths or differently terminated ends; and phase shifters shifting phase of high-frequency signals applied via the signal line and the coupled lines, supplying the high-frequency signals to the input terminal of the amplifier, and having different amounts of phase change.
    Type: Application
    Filed: June 5, 2012
    Publication date: April 18, 2013
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Shinsuke WATANABE
  • Publication number: 20120025366
    Abstract: A method for manufacturing a semiconductor device comprises: forming a circuit pattern and a first metal film on a first major surface of a body wafer; forming a through-hole penetrating the body wafer from a second major surface of the body wafer and reaching the first metal film; forming a second metal film on a part of the second major surface of the body wafer, on an inner wall of the through-hole, and on the first metal film exposed in the through-hole; forming a recess on a first major surface of a lid wafer; forming a third metal film on the first major surface of the lid wafer including inside the recess of the lid wafer; with the recess facing the circuit pattern, and the first metal film contacting the third metal film, joining the lid wafer to the body wafer; and dicing the joined body wafer and lid wafer along the through-hole.
    Type: Application
    Filed: April 4, 2011
    Publication date: February 2, 2012
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Ko Kanaya, Yoshihiro Tsukahara, Shinsuke Watanabe
  • Publication number: 20120023206
    Abstract: A system is disclosed that includes a plurality of node devices arranged in sequence; a first node device operable to generate a device count frame with a device count number and transmit the device count frame to the next node device in the sequence; a control device in communication with at least the first node device; wherein each node device is operable to increase the device count number of the device count frame upon receipt of the device count frame and transmit the device count frame to the next node device in sequence; and wherein the control device operable to receive the device count frame to the first node device after each node device has increased the device count number of the device count frame and assign an IP address for each node device, the number of IP addresses determined by the device count number.
    Type: Application
    Filed: April 8, 2011
    Publication date: January 26, 2012
    Inventors: Katsumi Kusama, Atsushi Takahashi, Taro Takahashi, Shinsuke Watanabe
  • Publication number: 20110175686
    Abstract: A high frequency second harmonic oscillator includes a transistor, a first signal line connected at a first end to the base or gate of the transistor, a first shunt capacitor connected at a first end to a second end of the first signal line and at a second end to ground, a second signal line connected at a first end to the collector or drain of the transistor, a second shunt capacitor connected at a first end to a second end of the second signal line and at a second end to ground, and a high capacitance capacitor connected between the first signal line and the second signal line. The first signal line has a length equal to an odd integer multiple of one quarter of the wavelength of a fundamental signal, plus or minus one-sixteenth of the wavelength of the fundamental signal.
    Type: Application
    Filed: October 26, 2010
    Publication date: July 21, 2011
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shinsuke Watanabe, Yoshihiro Tsukahara, Ko Kanaya, Shinichi Miwa
  • Patent number: 7777571
    Abstract: A high frequency power amplifier comprises: a multi-finger transistor with transistor cells electrically connected in parallel; an input side matching circuit connected to gate electrodes of the transistor cells; and resonant circuits respectively connected between the gate electrode of a transistor cell and the input side matching circuit. The resonant circuit resonates at a second harmonic of the operating frequency of the transistor or within a predetermined range of frequencies having a center at the second harmonic of the operating frequency, and becomes a high-impedance load at the second harmonic, or an open load.
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: August 17, 2010
    Assignee: Mitsubishi Electric Corporation
    Inventors: Seiki Gotou, Akira Inoue, Ko Kanaya, Shinsuke Watanabe
  • Patent number: 7714664
    Abstract: A cascode circuit for a high-gain or high-output millimeter-wave device that operates with stability. The cascode circuit including two cascode-connected transistors includes: a first high electron mobility transistor (HEMT) including a source that is grounded; a second HEMT including a source connected to a drain of the first HEMT; a reflection gain restricting resistance connected to the gate of the second HEMT, for restricting reflection gain; and an open stub connected to a side of the reflection gain restricting resistance which is opposite the side connected to the second HEMT, for short-circuiting high-frequency signals at a predetermined frequency and nearby frequencies.
    Type: Grant
    Filed: April 10, 2009
    Date of Patent: May 11, 2010
    Assignee: Mitsubishi Electric Corporation
    Inventors: Ko Kanaya, Seiki Goto, Shinsuke Watanabe
  • Patent number: 7701296
    Abstract: A current limiting circuit is connected to the gate (input terminal) of an amplifying transistor. The current limiting circuit includes a protecting transistor, a first protecting resistor connecting the drain to the gate of the protecting transistor, and a second protecting resistor connecting the source to the gate of the protecting transistor. The current limiting circuit limits current, so that electric power larger than the maximum electric power allowable for the amplifying transistor does not pass.
    Type: Grant
    Filed: October 19, 2007
    Date of Patent: April 20, 2010
    Assignee: Mitsubishi Electric Corporation
    Inventors: Akira Inoue, Seiki Goto, Kou Kanaya, Shinsuke Watanabe
  • Patent number: 7691483
    Abstract: The resin-coated metal sheet is composed of: a metal sheet; a lower resin layer containing a hydrophilic copolyester, formed on at least one side of the metal sheet; and an upper resin layer containing a polyester containing a diol component composed of a diol derivative of 1 to 10% by mole of alicyclic compound and 99 to 90% by mole of ethylene glycol, and a dicarboxylic acid component consisting of terephthalic acid, formed on the lower resin layer. The sum of cyclic trimer of alkylene terephthalate existing in the upper resin layer and the lower resin layer is 0.9% or less by mass. Since the manufacture of food cans using the resin-coated metal sheet does not induce white haze phenomenon and retort blushing phenomenon on outer surface of the can even after retorting, the decorative appearance on outer surface of the can is not deteriorated.
    Type: Grant
    Filed: March 30, 2005
    Date of Patent: April 6, 2010
    Assignee: JFE Steel Corporation
    Inventors: Yoichiro Yamanaka, Takeshi Suzuki, Hiroki Iwasa, Junichi Kitagawa, Toyofumi Watanabe, Shinsuke Watanabe, Mitsunori Ota