Abstract: A communication terminal includes a memory in which identification information associated with a user is stored, a controller that carries out authentication of the user, and a communication interface that transmits a signal including the identification information. When user authentication is successful, the controller sets the communication terminal to a first state in which the signal is transmitted to an external apparatus, and when user authentication is not successful, the controller sets the communication terminal to a second state in which the signal is not transmitted to the external apparatus.

Abstract: There are provided a substrate holder that holds a plurality of substrates, a reaction tube that houses the substrate holder, a gas supplier that has a plurality of supply holes corresponding one-to-one to the plurality of substrates and supplies gas to the plurality of substrates, and a plurality of plates provided in substantially parallel to the plurality of substrates, in which at least part of each of the plurality of plates is disposed between the gas supplier and the substrate holder.

Abstract: Described herein is a technique capable of properly attaching a nozzle to a reaction tube. According to one aspect thereof, there is provided a nozzle installation jig including: a lower plate configured to make contact with a process vessel in a vicinity of a lower end opening of the process vessel in which a nozzle is provided; a frame fixed to the lower plate and extending upward with respect to the lower plate; an upper plate fixed to the frame and provided with a sensor configured to detect a position of the nozzle in the process vessel; and a notification device configured to transmit a notification to an operator according to a detection result of the sensor.

Abstract: There is provided a technique that includes a first annealing step of annealing the reaction tube; a first cleaning step of cleaning an inner surface of the reaction tube, after the first annealing step, with a liquid including a fluorine compound having a first concentration; a first rinsing step of washing away the fluorine compound used in the first cleaning step with pure water; a second annealing step of annealing the reaction tube; a second cleaning step of cleaning the inner surface of the reaction tube, after the second annealing step, with a liquid including a fluorine compound having a second concentration higher than the first concentration; and a second rinsing step of washing away the fluorine compound used in the second cleaning step with pure water.

Abstract: A technique makes it possible to prevent direct contact between a nozzle outer periphery and a nozzle adapter and to prevent generation of particles due to the direct contact. The technique includes: a nozzle that has an attaching portion formed on one end and discharges, into a processing chamber, a gas supplied to the attaching portion; a nozzle adapter that is disposed in the processing chamber and is clearance-fitted to an outer peripheral surface of the attaching portion with a predetermined gap; and a plurality of annular buffer members that is disposed in the attaching portion and abuts on the nozzle adapter, in which at least one of the annular buffer members is compressed and deformed in a radial direction of the corresponding annular buffer member in a state where the attaching portion of the nozzle is attached to the nozzle adapter.

Abstract: Provided is a semiconductor device enabling the flatness of a glass substrate to be maintained and enabling the end portion of the glass substrate to be sufficiently protected. A semiconductor device according to the present disclosure includes a glass substrate that includes a first surface, a second surface provided on the opposite side of the first surface, and a first side surface provided between the first surface and the second surface, a wiring that is provided on the first and second surfaces, a metal film that covers the first side surface, and a frame that is provided further on the outer side than the metal film, and that is bonded to the metal film at the first side surfaces.

Abstract: Described herein is a technique capable of properly attaching a nozzle to a reaction tube. According to one aspect thereof, there is provided a nozzle installation jig including: a lower plate configured to make contact with a process vessel in a vicinity of a lower end opening of the process vessel in which a nozzle is provided; a frame fixed to the lower plate and extending upward with respect to the lower plate; an upper plate fixed to the frame and provided with a sensor configured to detect a position of the nozzle in the process vessel; and a notification device configured to transmit a notification to an operator according to a detection result of the sensor.

Abstract: A technique for connecting a nozzle to a reaction tube while preventing the nozzle from collapsing includes a substrate processing apparatus including: a gas introduction structure comprising a non-metallic material penetrating a side wall of a process vessel and integrated with the side wall as a single structure, wherein a front end thereof protrudes into the process vessel; a nozzle made of a non-metallic material and including: a first straight portion inserted into the gas introduction structure and fluidically communicating with the gas introduction structure; and a second straight portion fluidically communicating with the first straight portion and extending along an inner wall of the process vessel; and a fixing block provided at an inner side of the process vessel and above the gas introduction structure, wherein the fixing block has a groove where the nozzle can be moved in a radial direction of the process vessel.

Abstract: There is provided a technique capable of capable of preventing a substrate from being metal-contaminated by a component constituting a furnace opening. According to one aspect thereof, there is provided a furnace opening structure including: an upper inlet structure connected to a first protrusion provided at a lower portion of a reaction tube via a first seal, and configured to support the reaction tube; a lower inlet structure connected to the upper inlet structure via a second seal; and a fixing structure connected to the upper inlet structure and configured to fix the first protrusion, wherein the upper inlet structure is provided below an exhaust pipe provided at the lower portion of the reaction tube, and wherein the first protrusion is configured to be capable of being cooled by circulating a cooling medium through flow paths provided inside the upper inlet structure and the fixing structure, respectively.

Abstract: A semiconductor device includes: a semiconductor material layer forming a channel layer; a pair of source/drain electrodes formed on the semiconductor material layer; and a gate electrode arranged between the pair of source/drain electrodes and formed on the semiconductor material layer via a gate insulating film, wherein a connection path using a capacitor in which an insulating film formed in the same layer as the gate insulating film is sandwiched by a pair of electrodes and that undergoes dielectric breakdown at a voltage lower than a dielectric breakdown voltage of the gate insulating film is formed between at least one of the pair of source/drain electrodes and the gate electrode.

Abstract: An AFE chip for a smoke detector includes a DC/DC boost converter having a boost input, a boost output, and a boost upper power supply input. The boost input is coupled to a first pin that is adapted for coupling to a battery through an inductor and the boost output is coupled to a second pin. The DC/DC boost converter is configured to not switch when a voltage on the second pin is greater than a programmed boost voltage. A set of power regulator circuits have a power input, which is coupled to a third pin, and a power output. The third pin is adapted for receiving an input voltage, the power output is coupled to provide an internal voltage, and the set of power regulator circuits are further coupled to the boost upper power supply input.

Abstract: Provided is an antenna device capable of efficiently transmitting millimeter wave band signals. The antenna device includes plural antennas, a first Butler matrix circuit, and a second Butler matrix circuit. The plural antennas are disposed apart from each other. The first Butler matrix circuit is connected to each of the plural antennas. The second Butler matrix circuit is connected to each of the plural antennas. In each of the plural antennas, a first feed point connected to the first Butler matrix circuit and a second feed point connected to the second Butler matrix circuit are disposed apart from each other.

Abstract: There is provided a technique capable of reducing a tilt of a nozzle. According to one aspect of the technique, there is provided a substrate processing apparatus including: a process vessel constituted by a reaction tube and a manifold supporting the reaction tube from thereunder and in which a substrate is processed; a nozzle through which a process gas is supplied to the substrate; a metal adapter configured to hold the nozzle vertically in the process vessel; a support base arranged below the metal adapter and fixed to the manifold; and a fixing bolt engaging with the support base and screwed into the metal adapter.

Abstract: Provided is a technique capable of suppressing the occurrence of by-products by suppressing adhesion of the by-products. A substrate processing apparatus includes: a reaction tube where a substrate is processed; a furnace opening unit disposed at a lower end of the reaction tube and having an upper surface and an inner circumferential surface, the furnace opening unit including: a concave portion disposed on the upper surface; and a convex portion having at least one notch connecting the concave portion to the inner circumferential surface; a cover covering at least the inner circumferential surface with a predetermined gap therebetween; and a gas supply unit configured to supply a gas to the concave portion.

Abstract: [Object] There is provided a Butler matrix circuit that makes it possible to further reduce volume and power consumption and to obtain symmetrical radiation characteristics. [Solution] There is provided a Butler matrix circuit including: four processing-circuit-side terminals; four antenna-side terminals; a first 90° hybrid coupler coupled to a first processing-circuit-side terminal and a second processing-circuit-side terminal; a second 90° hybrid coupler coupled to a third processing-circuit-side terminal and a fourth processing-circuit-side terminal; a third 90° hybrid coupler coupled to a first antenna-side terminal and a third antenna-side terminal; a fourth 90° hybrid coupler coupled to a second antenna-side terminal and a fourth antenna-side terminal; a first 90° delay circuit provided between the first 90° hybrid coupler and the third 90° hybrid coupler; and a second 90° delay circuit provided between the first 90° hybrid coupler and the fourth 90° hybrid coupler.

Abstract: A bumper reinforcement includes an aluminum alloy extrusion body having a pair of flanges to be positioned on a vehicle body side and on a collision side and a pair of webs to be positioned in a vehicle vertical direction. The pair of webs connect the pair of flanges at joint portions such that the pair of webs and the pair of flanges form a closed cross section, and the pair of webs do not have a welded portion.

Abstract: A system on a chip (SoC) for smoke detection includes power regulator circuits coupled to respective pins and analog sensor amplifier circuits that are each coupled to a respective pin of the pins coupled to the power regulator circuits. A first analog sensor amplifier circuit of the analog sensor amplifier circuits has a photoelectric amplifier circuit, a first LED driver and a second LED driver. The SoC also has a digital core that includes a digital logic circuit, register bits, and an MCU communication circuit. The MCU communication circuit is coupled to a data pin, the register bits are coupled to control or modify operation of the power regulator circuits and the analog sensor amplifier circuits, and the register bits are operable to be written to by an MCU.

Abstract: A gas supply structure capable of suppressing damage to a structure provided in a reaction tube and made of the non-metallic material such as quartz includes: a gas supply nozzle through which a process gas is supplied into a process chamber in a reaction tube via an opening; a first seal provided so as to cover at least a gap between the opening of the reaction tube and the gas supply nozzle; a holder connected to the gas supply nozzle so as to provide a gap between the gas supply nozzle and the holder; an adapter connected to the holder; a first fixing structure configured to hold the holder and the adapter; and a second seal provided so as to cover at least a gap between the gas supply nozzle and the adapter and maintain a space between the gas supply nozzle and the adapter in an airtight state.