Abstract: A power supply system includes: a switching power supply configured to output a direct current; a control circuit configured to output a switching signal; an abnormality detection circuit configured to output an abnormality signal; an operation control unit connected to the control circuit and the abnormality detection circuit and configured to output an operation control signal, and a power supply control circuit configured to, when a first operation control signal is input, switch a state of the switching power supply to an operation state or a stop state. The operation control unit outputs the first operation control signal to the power supply control circuit when the switching signal is input. The operation control unit outputs a second operation control signal to the power supply control circuit when the abnormality signal is input.

Abstract: Provided is a sensor package that measures an internal temperature of a measurement object. A sensor package includes: a package including a bottomed tubular casing and plural leads substantially parallel to each other, each of the leads piercing the bottomed tubular casing; and a MEMS chip including at least one thermopile that measures a temperature difference in an identical direction. The MEMS chip is disposed in an inner bottom surface of the bottomed tubular casing of the package in a posture in which a measurement direction of the temperature difference measured with the thermopile is substantially orthogonal to a longitudinal direction of each lead.

Abstract: An internal temperature measuring apparatus includes: a sensor package in which a MEMS chip and a temperature sensor are disposed in a bottomed tubular package, the MEMS chip including one or a plurality of thermopiles each of which measures a heat flux passing through a region of a bottom of the bottomed tubular package, the temperature sensor measuring a reference temperature used as temperature of a predetermined portion of the MEMS chip; and a printed circuit board configured to calculate the internal temperature of the measurement object based on output of the sensor package. An outer bottom face of the sensor package projects from a plate face of the printed circuit board through a through-hole made in the printed circuit board.

Abstract: A method for manufacturing a light-emitting device includes: providing first and second substrates each including a plurality of packages, the packages each having a recess and a light-emitting element mounted in the recess; performing potting by supplying a resin member containing particles of a fluorescent material into the recess of each of the packages of the first substrate; spreading the resin member in the recess of each of the packages of the first substrate; measuring a height of an upper surface of the resin member spread in the recess of at least one of the packages of the first substrate; and adjusting a quantity of the resin member to be supplied into the recess of each of the packages of the second substrate depending on the measured height of the upper surface of the resin member.

Abstract: An internal temperature measuring apparatus includes a base and a MEMS device disposed on the base. The MEMS device includes a top face and a support. The top face includes a first thermopile configured to measure a first temperature difference used to calculate an internal temperature and a second thermopile configured to measure a second temperature difference used to calculate the internal temperature together with the first temperature difference. An orientation in which a cold junction of each thermocouple constituting the first thermopile is viewed from a hot junction coincides with an orientation in which a cold junction of each thermocouple constituting the second thermopile is viewed from a hot junction.

Abstract: A temperature difference measuring apparatus includes: a bottomed tubular package in which a top face side is opened; a MEMS device disposed on an inner bottom face of the package, the MEMS device comprising at least one thermopile that measures a temperature difference, which is generated in the MEMS device by inflow heat through a bottom of the package; and a heat quantity increasing unit configured to increase a heat quantity flowing out from the MEMS device onto the top face side of the bottomed tubular package.

Abstract: Provided is an internal temperature measurement device capable of measuring an internal temperature of a measuring object for which the thermal resistance value of a non-heating body present on the surface side of the object is unknown, more accurately with better responsiveness than hitherto. The internal temperature measurement device 10 includes a MEMS chip 12 including: two cells 20a, 20b for measuring two heat fluxes for calculating an internal temperature of a measuring object for which the thermal resistance value of a non-heating body is unknown; and a cell 20c for increasing a difference between the heat fluxes.

Abstract: PROBLEM: To provide a cover body (18) at a space X formed between a motor housing (14) and a sprocket (15) which are the components of a drive sprocket (10) of a base carrier (2) in a hydraulic shovel, so as to prevent foreign substances such as sand from entering into the space, and to be installed to the motor housing side (14) without forming a bolt hole. SOLUTION: A cover body (18) is formed to be a split-body divided to an upper half (19) and a lower half (20), and to be connected to each other to form a ring shape by connecting a connect bolt (23) formed at an adjacent part of the cover body (18). The cover body (18) is installed to the space X by inserting an adjust bolt (21) into a ring shaped main body part (19a and 20a) till abut the motor housing (14) tightly. An outlet (26) is formed as a notch on a cover body (19d and 20d) to discharge the foreign substances entering into the space X between the sprocket housing (15) and a tip end of the cover part.

Abstract: Carrier for image forming includes a core material particle including a magnetic material and a coating layer disposed on the surface of the core material particle, the coating layer including a resin, carbon black, an inorganic particulate A, and an inorganic particulate B. The carbon black has a concentration gradient along a thickness direction of the coating layer with a concentration from high to low toward a surface of the coating layer while the inorganic particulate A has a concentration gradient along a thickness direction of the coating layer with a concentration from low to high toward the surface of the coating layer. The volume ratio of the carbon black is 0-30 percent at a depth range of 0.0-0.1 ?m from the surface of the coating layer. The inorganic particulate A is electroconductive with a powder specific resistance of 200 ?·cm or less.

Abstract: A method includes measuring a first temperature difference between first heat entry and discharge parts on a first heat transfer path extending from a portion of a surface of the object to the first heat discharge part using a first thermopile, and measuring a second temperature difference between a second heat entry and discharge parts on a second heat transfer path extending from another portion of the surface of the object to the second heat discharge part using a second thermopile, and measuring a reference temperature at a predetermined position on the first or second heat transfer path using a temperature sensor, and calculating the internal temperature of the object using the measured first and second temperature differences, and the reference temperature, and at least one predetermined value excluding a physical property value of a non-heating part of the object located at a surface side of the object.

Abstract: An internal temperature sensor includes substrates with one surface to be placed in contact with a measurement surface of an object to measure an internal temperature of the object, a heat flux sensor on another surface of the substrates, and a temperature sensor. The heat flux sensor is fabricated through a MEMS process and includes first and second temperature measurement parts, and a thin film including a thermopile to detect a temperature difference between the first and second temperature measurement parts. The thin film is supported by a thermally conductive member to form a space between the first temperature measurement part and the substrates and to extend parallel to the substrates. The thermally conductive member conducts heat traveling from the object through the substrates to the second temperature measurement part. The temperature sensor measures the temperature of a part of the substrates that is in contact with the thermally conductive member.

Abstract: A carbon brush for a fuel pump includes a brush body and a lead wire connected to the brush body, and the brush body has carbon and polyether ether ketone as main components. Abnormal wear does not occur even if a fuel pump motor is operated at a high voltage.

Abstract: There is provided a semiconductor device having a converter circuit, a brake circuit and an inverter circuit and manufacturable by a simplified manufacturing process. The semiconductor device has a plurality of die pads, IGBTs, diodes, freewheel diodes, an HVIC and LVICs mounted on the plurality of die pads, a plurality of leads, and an encapsulation resin body that covers these component parts. In a manufacturing process, a single-plate lead frame having the above-described plurality of die pads and leads connected together can be prepared. The semiconductor device may be manufactured by using this single-plate lead frame.

Abstract: There is provided a semiconductor device having a converter circuit, a brake circuit and an inverter circuit and manufacturable by a simplified manufacturing process. The semiconductor device has a plurality of die pads, IGBTs, diodes, freewheel diodes, an HVIC and LVICs mounted on the plurality of die pads, a plurality of leads, and an encapsulation resin body that covers these component parts. In a manufacturing process, a single-plate lead frame having the above-described plurality of die pads and leads connected together can be prepared. The semiconductor device may be manufactured by using this single-plate lead frame.

Abstract: Converter output terminals of a converter are located adjacent to each other on a first side and an external terminal for external connection of a composite module is located adjacent to the converter output terminal. AC input terminals of the converter are located on a second side. Each of the distances between the converter output terminals and between the converter output terminal and the external terminal is set to a first formation pitch. Each of the distances between the AC input terminals is set to a second formation pitch. The first formation pitch is set to be equal to the second formation pitch.

Abstract: There is provided a semiconductor device having a converter circuit, a brake circuit and an inverter circuit and manufacturable by a simplified manufacturing process. the semiconductor device has a plurality of die pads, IGBTs, diodes, freewheel diodes, an HVIC and LVICs mounted on the plurality of die pads, a plurality of leads, and an encapsulation resin body that covers these component parts. In a manufacturing process, a single-plate lead frame having the above-described plurality of die pads and leads connected together can be prepared. The semiconductor device may be manufactured by using this single-plate lead frame.