Patents by Inventor Shinya Sasaki

Shinya Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11018033
    Abstract: There is provided a technique that includes a process chamber including a gate valve that opens and closes a loading and unloading port configured to load and unload a substrate, and configured to heat and process the substrate by a heater using a microwave; a substrate transfer chamber including a purge gas distribution mechanism configured to distribute a purge gas supplied from a clean unit capable of introducing the purge gas; a transfer machine installed inside the substrate transfer chamber and configured to transfer the substrate into the process chamber; and a substrate cooling mounting tool configured to cool the substrate transferred from the process chamber by the transfer machine.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: May 25, 2021
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Yukitomo Hirochi, Kazuhiro Yuasa, Tetsuo Yamamoto, Yoshihiko Yanagisawa, Shinya Sasaki, Noriaki Michita
  • Publication number: 20210135669
    Abstract: A semiconductor relay module includes first to third semiconductor relays, first to third input terminals, first to third output terminals, and a first connection line. A first input circuit of the first semiconductor relay and a second input circuit of the second semiconductor relay are connected to the first and second input terminals. The first and second input circuits are connected in series. A third input circuit of the third semiconductor relay is connected to the first or second input terminal and the third input terminal. A first output circuit of the first semiconductor relay is connected to the first output terminal and the first connection line. A second output circuit of the second semiconductor relay is connected to the second output terminal and the first connection line. A third output circuit of the third semiconductor relay is connected to the third output terminal and the first connection line.
    Type: Application
    Filed: October 12, 2020
    Publication date: May 6, 2021
    Inventors: Toshinobu AKUTAGAWA, Shigenari OKADA, Shinya SASAKI
  • Publication number: 20210135668
    Abstract: A semiconductor relay module includes first to third semiconductor relays, first to third input terminals, first to third output terminals, a first connection line, and a first monitor terminal connected to the first connection line. A first input circuit of the first semiconductor relay and a second input circuit of the second semiconductor relay are connected to the first and second input terminals. A third input circuit of the third semiconductor relay is connected to the first or second input terminal and the third input terminal. A first output circuit of the first semiconductor relay is connected to the first output terminal and the first connection line. A second output circuit of the second semiconductor relay is connected to the second output terminal and the first connection line. A third output circuit of the third semiconductor relay is connected to the third output terminal and the first connection line.
    Type: Application
    Filed: October 12, 2020
    Publication date: May 6, 2021
    Inventors: Shinya SASAKI, Toshinobu AKUTAGAWA, Shigenari OKADA
  • Patent number: 10968408
    Abstract: It is an object of the present invention to provide a gasoline composition utilizing lignocellulosic biomass, which is a plant-derived resource that does not cause competition with food production, the gasoline composition satisfying properties required for use in gasoline engines, and a process for producing the gasoline composition. The gasoline composition contains 0.3 to 10.0 vol % of hemicellulose-derived pentene.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: April 6, 2021
    Assignee: IDEMITSU KOSAN CO., LTD
    Inventors: Yasuyo Okuyama, Akio Imai, Mitsuru Koike, Shinya Sasaki
  • Publication number: 20210013178
    Abstract: An electronic module includes: a plurality of heat generating members provided over a first surface of a board; a frame joined to the first surface of the board and provided between the plurality of heat generating members that are arranged; and a lid configured to cover the first surface of the board and thermally coupled to each of the plurality of heat generating members, the frame being a grid-shaped frame or a mesh-shaped frame.
    Type: Application
    Filed: July 8, 2020
    Publication date: January 14, 2021
    Applicant: FUJITSU LIMITED
    Inventors: TERU NAKANISHI, Daijiro Ishibashi, Shinya Sasaki, Yukiko Oshikubo, Yoshihiro NAKATA
  • Publication number: 20200395336
    Abstract: A semiconductor apparatus includes: a substrate; a plurality of semiconductor devices mounted on a first surface of the substrate; a heat spreader coupled to a second side opposite to a first side, which is coupled to the substrate, of the plurality of semiconductor devices; an underfill provided in a gap between the substrate and the plurality of semiconductor devices; and a heat conductive resin provided between the heat spreader and the underfill.
    Type: Application
    Filed: June 15, 2020
    Publication date: December 17, 2020
    Applicant: FUJITSU LIMITED
    Inventors: Ayumi Okano, Shinya Sasaki, Yoshihiro Nakata, Teru Nakanishi
  • Patent number: 10859175
    Abstract: A flow control valve apparatus includes: a housing including two pump ports, two tank ports, a first supply/discharge port, a second supply/discharge port, and a spool hole; a first spool configured to switch a connection status among one of the pump ports, one of the tank ports, and the first supply/discharge port depending on a position of the first spool; a first actuator configured to move the first spool to each of a first supply position and a first discharge position; a second spool configured to switch a connection status among the other pump port, the other tank port, and the second supply/discharge port depending on a position of the second spool; and a second actuator configured to move the second spool to each of a second supply position and a second discharge position. The first spool and second spool are inserted in the spool hole so as to reciprocate.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: December 8, 2020
    Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Hideki Tanaka, Akihiro Kondo, Shinya Sasaki
  • Patent number: 10804110
    Abstract: Described herein is a technique capable of heating a substrate uniformly by electromagnetic waves. According to one aspect of the technique, there is provided a substrate processing apparatus including: a process chamber where a substrate is processed; a heating device configured to heat the substrate by electromagnetic waves; a gas supply mechanism including a hydrogen-containing gas supply system configured to supply a hydrogen-containing gas into the process chamber; a plasma generator configured to excite the hydrogen-containing gas by plasma; and a controller configured to control the heating device, the gas supply mechanism and the plasma generator to modify the substrate by performing: (a) adding hydrogen atom to a surface of the substrate by supplying the hydrogen-containing gas excited by the plasma generator onto the substrate; and (b) intermittently supplying the electromagnetic waves to heat the substrate after performing (a).
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: October 13, 2020
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinya Sasaki, Noriaki Michita
  • Publication number: 20200181309
    Abstract: A clearance narrowing material containing a brush-shaped polymer chain aggregate funned of multiple polymer chains immobilized on a substrate. The invention provides a clearance narrowing material which can effectively prevent fluid leakage through a clearance and which does not disturb relative movement of members to form a clearance, and can realize an article in which fluid leakage through a clearance can be effectively prevented and the members to form a clearance can move smoothly.
    Type: Application
    Filed: April 25, 2018
    Publication date: June 11, 2020
    Inventors: Chiharu TADOKORO, Takuo NAGAMINE, Yoshinobu TSUJII, Keita SAKAKIBARA, Ken NAKANO, Hitoshi HATTORI, Shinya SASAKI, Takaya SATO
  • Patent number: 10595412
    Abstract: A semiconductor device includes a printed circuit board that includes a first electrode, a resin substrate that includes a first face directed toward the printed circuit board, a second electrode formed in a second portion surrounding a first portion of the first face, a second face opposite the first face, and a third electrode formed in a third portion of the second face, the third portion overlapping the first portion in a plan view, a semiconductor chip that includes a coupling terminal joined to the third electrode, a conductive member that is formed between the printed circuit board and the resin substrate and contains a conductive particle and resin, and a solder bump that is formed between the printed circuit board and the resin substrate and is joined to the first electrode and the second electrode.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: March 17, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Shinya Sasaki, Tsuyoshi Kanki
  • Publication number: 20200056108
    Abstract: A gasoline fuel composition includes 1.0 vol % or less of benzene, 2.8 to 30.0 vol % of aromatics having a carbon number of 9, 0.5 to 3.0 vol % of aromatics having a carbon number of 10, and olefins. The olefins include a linear olefin having a terminal double bond, the liner olefin being included in a proportion of 1.0 to 2.0 vol % in the gasoline fuel composition.
    Type: Application
    Filed: November 24, 2017
    Publication date: February 20, 2020
    Inventors: Yuuichirou Miura, Shinya Sasaki
  • Publication number: 20200013646
    Abstract: There is provided a technique includes: a process chamber in which a substrate is processed; a plurality of microwave supply sources configured to supply predetermined microwaves for heating the substrate in the process chamber; and a controller configured to control the microwave supply sources such that while keeping constant a sum of outputs of the microwaves respectively supplied to the substrate from the plurality of microwave supply sources, at least one of the plurality of microwave supply sources is turned off, and periods in which the at least one of the plurality of microwave supply sources is turned off are different from each other.
    Type: Application
    Filed: August 28, 2019
    Publication date: January 9, 2020
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinya SASAKI, Yukitomo HIROCHI, Noriaki MICHITA
  • Publication number: 20190393056
    Abstract: There is provided a technique that includes a process chamber including a gate valve that opens and closes a loading and unloading port configured to load and unload a substrate, and configured to heat and process the substrate by a heater using a microwave; a substrate transfer chamber including a purge gas distribution mechanism configured to distribute a purge gas supplied from a clean unit capable of introducing the purge gas; a transfer machine installed inside the substrate transfer chamber and configured to transfer the substrate into the process chamber; and a substrate cooling mounting tool configured to cool the substrate transferred from the process chamber by the transfer machine.
    Type: Application
    Filed: September 6, 2019
    Publication date: December 26, 2019
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventors: Yukitomo HIROCHI, Kazuhiro YUASA, Tetsuo YAMAMOTO, Yoshihiko YANAGISAWA, Shinya SASAKI, Noriaki MICHITA
  • Patent number: 10483195
    Abstract: A resin board includes: a resin layer and a through electrode buried in the resin layer, wherein the through electrode has an electrode surface exposed from a front surface or a back surface of the resin layer and a lateral surface, and the electrode surface and the lateral surface form an obtuse angle.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: November 19, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Yasushi Kobayashi, Yoshihiro Nakata, Yoshikatsu Ishizuki, Daijiro Ishibashi, Shinya Sasaki
  • Publication number: 20190225899
    Abstract: It is an object of the present invention to provide a gasoline composition utilizing lignocellulosic biomass, which is a plant-derived resource that does not cause competition with food production, the gasoline composition satisfying properties required for use in gasoline engines, and a process for producing the gasoline composition. The gasoline composition contains 0.3 to 10.0 vol % of hemicellulose-derived pentene.
    Type: Application
    Filed: July 24, 2017
    Publication date: July 25, 2019
    Inventors: Yasuyo Okuyama, Akio Imai, Mitsuru Koike, Shinya Sasaki
  • Publication number: 20190198331
    Abstract: Described herein is a technique capable of heating a substrate uniformly by electromagnetic waves. According to one aspect of the technique, there is provided a substrate processing apparatus including: a process chamber where a substrate is processed; a heating device configured to heat the substrate by electromagnetic waves; a gas supply mechanism including a hydrogen-containing gas supply system configured to supply a hydrogen-containing gas into the process chamber; a plasma generator configured to excite the hydrogen-containing gas by plasma; and a controller configured to control the heating device, the gas supply mechanism and the plasma generator to modify the substrate by performing: (a) adding hydrogen atom to a surface of the substrate by supplying the hydrogen-containing gas excited by the plasma generator onto the substrate; and (b) intermittently supplying the electromagnetic waves to heat the substrate after performing (a).
    Type: Application
    Filed: March 1, 2019
    Publication date: June 27, 2019
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinya SASAKI, Noriaki MICHITA
  • Publication number: 20190162324
    Abstract: A flow control valve apparatus includes: a housing including two pump ports, two tank ports, a first supply/discharge port, a second supply/discharge port, and a spool hole; a first spool configured to switch a connection status among one of the pump ports, one of the tank ports, and the first supply/discharge port depending on a position of the first spool; a first actuator configured to move the first spool to each of a first supply position and a first discharge position; a second spool configured to switch a connection status among the other pump port, the other tank port, and the second supply/discharge port depending on a position of the second spool; and a second actuator configured to move the second spool to each of a second supply position and a second discharge position. The first spool and second spool are inserted in the spool hole so as to reciprocate.
    Type: Application
    Filed: May 18, 2017
    Publication date: May 30, 2019
    Applicant: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Hideki TANAKA, Akihiro KONDO, Shinya SASAKI
  • Patent number: D841065
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: February 19, 2019
    Assignee: NACHI-FUJIKOSHI CORP.
    Inventors: Takeshi Hontani, Shinya Sasaki
  • Patent number: D841712
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: February 26, 2019
    Assignee: NACHI-FUJIKOSHI CORP.
    Inventors: Takeshi Hontani, Shinya Sasaki
  • Patent number: D911408
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: February 23, 2021
    Assignee: NACHI-FUJIKOSHI CORP.
    Inventors: Toshinori Okada, Shinya Sasaki