Patents by Inventor Shinya Sasaki

Shinya Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10185238
    Abstract: A carrier core material is provided that is formed with ferrite particles which can uniformly adhere a coupling agent to the entire surface. A carrier core material is formed with ferrite particles, and the powder pH of the ferrite particles is equal to or more than 9. Here, the ferrite particles are preferably formed of Mn ferrite or Mn—Mg ferrite. The ferrite particles preferably contain 45 wt % or more but 65 wt % or less of Fe, 15 wt % or more but 30 wt % or less of Mn and 5 wt % or less of Mg.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: January 22, 2019
    Assignees: DOWA ELECTRONICS MATERIALS CO., LTD., DOWA IP CREATION CO., LTD.
    Inventors: Yuto Kamai, Shinya Sasaki
  • Publication number: 20180155646
    Abstract: A gas oil composition comprising at least 20.0% by volume total aromatic content, at least 1.0% by volume bicyclic aromatic content, at least 0.2% by volume trior higher cyclic aromatic content, no more than 18.0% by mass naphthenobenzenes, and no more than 10 ppm by mass sulfur content, and having a density (15° C.) of at least 0.8200 g/cm3, and an ASTM colour of at least 0.2, characterised in that the gas oil composition is obtained by hydrogenation-desulfurisation of the stock oil described below, which contains cracked gas oil fraction: stock oil comprising at least 25.0% by volume total aromatic content, at least 15.0% by mass total naphthene content, at least 4.0% by mass bicyclic naphthene content, at least 1.0% by mass tricyclic naphthene content, and at least 0.50% by mass sulfur content, and having a 90% distillation temperature of at least 340.0° C. The gas oil composition of the present invention has excellent oxidative stability.
    Type: Application
    Filed: January 30, 2018
    Publication date: June 7, 2018
    Inventors: Shinya Sasaki, Shun Kumagai
  • Patent number: 9964878
    Abstract: A carrier core material is represented by a composition formula MxFe3-xO4 (where M is Mn and/or Mg, and X is a total of Mn and Mg and is a substitution number of Fe by Mn and Mg, 0<X?1), in which 5 to 20 number percent of bound particles where 2 to 5 spherical particles are bound together are contained and in which the maximum peak-to-trough depth Rz of the surface of normal spherical particles other than the bound particles is equal to or more than 1.5 ?m but equal to or less than 2.1 ?m. In this way, it is possible to increase the amount of toner supplied to a development region, and the surface of a photosensitive member is prevented from being scratched by a magnetic brush.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: May 8, 2018
    Assignees: DOWA ELECTRONICS MATERIALS CO., LTD., DOWA IP CREATION CO., LTD.
    Inventors: Yohei Ishikawa, Shinya Sasaki
  • Publication number: 20180107129
    Abstract: A carrier core material is represented by a composition formula MxFe3-xO4 (where M is Mn and/or Mg, and X is a total of Mn and Mg and is a substitution number of Fe by Mn and Mg, 0<X?1), in which 5 to 20 number percent of bound particles in which 2 to 5 spherical particles are bound together are contained, and in which the absolute value of a difference between lattice constants before and after milling which are calculated from a peak position of plane indices in a powder X-ray diffraction pattern is equal to or less than 0.005. In this way, it is possible to increase the amount of toner supplied to a development region, and even when cracking or chipping occurs in the carrier core material, an image failure such as black spots or white spots is prevented from being generated.
    Type: Application
    Filed: March 3, 2016
    Publication date: April 19, 2018
    Applicants: DOWA ELECTRONICS MATERIALS CO., LTD., DOWA IP CREATION CO., LTD.
    Inventors: Yohei ISHIKAWA, Shinya SASAKI
  • Patent number: 9935061
    Abstract: A resin interposer having a semiconductor chip mounted thereon to couple the semiconductor chip to a printed circuit board, the resin interposer includes a wiring layer having a front surface to which the semiconductor chip is coupled and formed by alternately laminating an insulating resin and a metal wiring, and a pressure-sensitive adhesive layer formed on a rear surface of the wiring layer and having a through via formed therein to couple the wiring layer and the printed circuit board to each other.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: April 3, 2018
    Assignee: FUJITSU LIMITED
    Inventor: Shinya Sasaki
  • Publication number: 20180068787
    Abstract: An inductor apparatus includes: a substrate including an electrical insulation property and a non-magnetic material; and a plurality of inductors disposed in the substrate so as to extend from a first surface of the substrate to a second surface of the substrate, each of the plurality of inductors including: an inductor conductive part that has an electrical conductivity and extends in a thickness direction of the substrate; and a magnetic layer that covers a side of the inductor conductive part and include a relative permeability and a soft magnetic material.
    Type: Application
    Filed: October 27, 2017
    Publication date: March 8, 2018
    Applicant: FUJITSU LIMITED
    Inventors: Hiroshi NAKAO, Yu Yonezawa, Takahiko Sugawara, Yoshiyasu Nakashima, Yoshikatsu Ishizuki, Shinya Sasaki, Shinya Iijima
  • Publication number: 20180063960
    Abstract: A semiconductor device includes a printed circuit board that includes a first electrode, a resin substrate that includes a first face directed toward the printed circuit board, a second electrode formed in a second portion surrounding a first portion of the first face, a second face opposite the first face, and a third electrode formed in a third portion of the second face, the third portion overlapping the first portion in a plan view, a semiconductor chip that includes a coupling terminal joined to the third electrode, a conductive member that is formed between the printed circuit board and the resin substrate and contains a conductive particle and resin, and a solder bump that is formed between the printed circuit board and the resin substrate and is joined to the first electrode and the second electrode.
    Type: Application
    Filed: August 14, 2017
    Publication date: March 1, 2018
    Applicant: FUJITSU LIMITED
    Inventors: Shinya Sasaki, Tsuyoshi Kanki
  • Publication number: 20180052405
    Abstract: A carrier core material is represented by a composition formula MxFe3-xO4 (where M is Mn and/or Mg, and X is a total of Mn and Mg and is a substitution number of Fe by Mn and Mg, 0<X?1), in which 5 to 20 number percent of bound particles where 2 to 5 spherical particles are bound together are contained and in which the maximum peak-to-trough depth Rz of the surface of normal spherical particles other than the bound particles is equal to or more than 1.5 ?m but equal to or less than 2.1 ?m. In this way, it is possible to increase the amount of toner supplied to a development region, and the surface of a photosensitive member is prevented from being scratched by a magnetic brush.
    Type: Application
    Filed: March 1, 2016
    Publication date: February 22, 2018
    Applicants: DOWA ELECTRONICS MATERIALS CO., LTD., DOWA IP CREATION CO., LTD.
    Inventors: Yohei ISHIKAWA, Shinya SASAKI
  • Publication number: 20180024455
    Abstract: A carrier core material is provided that is formed with ferrite particles which can uniformly adhere a coupling agent to the entire surface. A carrier core material is formed with ferrite particles, and the powder pH of the ferrite particles is equal to or more than 9. Here, the ferrite particles are preferably formed of Mn ferrite or Mn—Mg ferrite. The ferrite particles preferably contain 45 wt % or more but 65 wt % or less of Fe, 15 wt % or more but 30 wt % or less of Mn and 5 wt % or less of Mg.
    Type: Application
    Filed: July 21, 2017
    Publication date: January 25, 2018
    Applicants: DOWA ELECTRONICS MATERIALS CO., LTD., DOWA IP CREATION CO., LTD.
    Inventors: Yuto KAMAI, Shinya SASAKI
  • Publication number: 20170373020
    Abstract: A resin interposer having a semiconductor chip mounted thereon to couple the semiconductor chip to a printed circuit board, the resin interposer includes a wiring layer having a front surface to which the semiconductor chip is coupled and formed by alternately laminating an insulating resin and a metal wiring, and a pressure-sensitive adhesive layer formed on a rear surface of the wiring layer and having a through via formed therein to couple the wiring layer and the printed circuit board to each other.
    Type: Application
    Filed: June 9, 2017
    Publication date: December 28, 2017
    Applicant: FUJITSU LIMITED
    Inventor: Shinya Sasaki
  • Publication number: 20170365545
    Abstract: A resin board includes: a resin layer and a through electrode buried in the resin layer, wherein the through electrode has an electrode surface exposed from a front surface or a back surface of the resin layer and a lateral surface, and the electrode surface and the lateral surface form an obtuse angle.
    Type: Application
    Filed: June 12, 2017
    Publication date: December 21, 2017
    Applicant: FUJITSU LIMITED
    Inventors: Yasushi Kobayashi, Yoshihiro NAKATA, Yoshikatsu Ishizuki, Daijiro Ishibashi, Shinya Sasaki
  • Patent number: 9837208
    Abstract: An inductor apparatus includes: a substrate including an electrical insulation property and a non-magnetic material; and a plurality of inductors disposed in the substrate so as to extend from a first surface of the substrate to a second surface of the substrate, each of the plurality of inductors including: an inductor conductive part that has an electrical conductivity and extends in a thickness direction of the substrate; and a magnetic layer that covers a side of the inductor conductive part and include a relative permeability and a soft magnetic material.
    Type: Grant
    Filed: November 13, 2014
    Date of Patent: December 5, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Hiroshi Nakao, Yu Yonezawa, Takahiko Sugawara, Yoshiyasu Nakashima, Yoshikatsu Ishizuki, Shinya Sasaki, Shinya Iijima
  • Patent number: 9740129
    Abstract: Ferrite particles have, as a main component, a material represented by a composition formula MxFe3?xO4 (where M is at least one type of metal selected from a group made of Mg, Mn, Ca, Ti, Cu, Zn, Sr and Ni, 0<x<1), where the maximum height Rz of the particles falls within a range of 1.40 ?m to 1.90 ?m, and the degree of distortion Rsk of the particles falls within a range of ?0.25 to ?0.07. In this way, when the ferrite particles are used as the carrier of an electrophotographic image forming apparatus, even if an image formation speed is increased, the occurrence of a failure is reduced for a long period of time.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: August 22, 2017
    Assignees: DOWA ELECTRONICS MATERIALS CO., LTD., DOWA IP CREATION CO., LTD.
    Inventors: Shinya Sasaki, Yohei Ishikawa, Haruka Seki
  • Patent number: 9496134
    Abstract: Provided is a substrate processing apparatus capable of suppressing accumulation of reaction products or decomposed matters on an inner wall of a nozzle and suppressing scattering of foreign substances in a process chamber. The substrate processing apparatus includes a process chamber, a heating unit, a source gas supply unit, a source gas nozzle, an exhaust unit, and a control unit configured to control at least the heating unit, the source gas supply unit and the exhaust unit. The source gas nozzle is disposed at a region in the process chamber, in which a first process gas is not decomposed even under a temperature in the process chamber higher than a pyrolysis temperature of the first process gas, and the control unit supplies the first process gas into the process chamber two or more times at different flow velocities to prevent the first process gas from being mixed.
    Type: Grant
    Filed: November 4, 2011
    Date of Patent: November 15, 2016
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Shinya Sasaki, Yuji Takebayashi, Shintaro Kogura
  • Patent number: 9465164
    Abstract: Disclosed is an electronic apparatus including a circuit element including a first main surface, a first electrode provided in the first main surface, an optical element including a second main surface and being configured to either transmit or receive an optical signal, a second electrode provided in the second main surface, a window which is provided in the second main surface and through which the optical signal passes, a wiring layer provided on the first main surface and the second main surface, the wiring layer electrically connecting the first electrode and the second electrode, and an optical waveguide, which is provided on the second main surface and optically connected to the window, the optical signal passing through the optical waveguide.
    Type: Grant
    Filed: March 5, 2014
    Date of Patent: October 11, 2016
    Assignee: FUJITSU LIMITED
    Inventors: Shinya Sasaki, Akio Sugama
  • Publication number: 20160266510
    Abstract: There are provided ferrite particles that have, as a main component, a material represented by a composition formula MxFe3-xO4 (where M is at least one type of metal selected from a group consisting of Mg, Mn, Ca, Ti, Cu, Zn, Sr and Ni, 0<x<1), where the maximum height Rz of the particles falls within a range of 1.40 to 1.90, and the degree of distortion Rsk of the particles falls within a range of ?0.25 to ?0.07. In this way, when the ferrite particles are used as the carrier of an electrophotographic image forming apparatus, even if an image formation speed is increased, the occurrence of a failure is reduced for a long period of time.
    Type: Application
    Filed: October 29, 2014
    Publication date: September 15, 2016
    Applicants: DOWA ELECTRONICS MATERIALS CO., LTD., DOWA IP CREATION CO., LTD.
    Inventors: Shinya SASAKI, Yohei ISHIKAWA, Haruka SEKI
  • Patent number: 9417392
    Abstract: An optical waveguide component includes: an optical fiber mounting substrate provided with optical fiber alignment grooves having either, for alignment of optical fibers, V-grooves or inverted trapezoidal grooves in which inverted top sections of the V-grooves are truncated; an optical waveguide substrate in which optical waveguides are formed; a resin layer that is aligned and fixed in a state in which the optical fiber mounting substrate and the optical waveguide substrate are flush or have a predetermined amount of offset; and a transparent resin that is filled in a gap in which the optical fiber mounting substrate and the optical waveguide substrate face each other.
    Type: Grant
    Filed: September 5, 2014
    Date of Patent: August 16, 2016
    Assignee: FUJITSU LIMITED
    Inventors: Akio Sugama, Shinya Sasaki
  • Patent number: 9380747
    Abstract: The present invention provides a method for selecting a marker for diagnosis of the nutritional status capable of reflecting the status of a particular nutrient in a plant without being influenced by various stresses in environmental factors, etc., and a method for diagnosing the status of a particular nutrient in a plant using a marker for diagnosis of the nutritional status selected by the method. A metabolite quantitatively changed depending on only the amount of a particular nutrient in a plant is selected as a marker for diagnosis of the nutritional status reflecting the status of the nutrient in the plant.
    Type: Grant
    Filed: May 26, 2010
    Date of Patent: July 5, 2016
    Assignee: OJI HOLDINGS CORPORATION
    Inventors: Shinya Sasaki, Shigeru Sato
  • Patent number: 9312151
    Abstract: A method of manufacturing a semiconductor device, includes: providing a first adhesive layer on a support member; providing a film on the first adhesive layer; arranging a semiconductor element on the film; providing a resin layer on the film on which the semiconductor element is arranged, and forming a substrate including the semiconductor element and the resin layer on the film; and separating the film and the substrate from the first adhesive layer.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: April 12, 2016
    Assignee: FUJITSU LIMITED
    Inventors: Shinya Sasaki, Yoshikatsu Ishizuki, Motoaki Tani
  • Patent number: 9273235
    Abstract: A bonding material using silver nanoparticles considerably changes in coating-material property in response to a slight change in composition, and the stability thereof has been insufficient for large-amount application. A bonding material which uses silver nanoparticles, meets the requirements for mass printing, attains dimensional stability, and gives a smooth printed surface is provided. The bonding material includes silver nanoparticles which have at least an average primary particle diameter of 1 nm to 200 nm and have been coated with an organic substance having 8 or less carbon atoms, a dispersion medium, and a viscosity modifier composed of an organic substance, and has a viscosity (measured at a shear rate of 15.7 [1/s]) of 100 Pa·s or lower and a thixotropic ratio (measured at a shear rate of 3.1 [1/s]/measured at a shear rate of 15.7 [1/s]) of 4 or lower.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: March 1, 2016
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Satoru Kurita, Takashi Hinotsu, Shinya Sasaki