Patents by Inventor Shinya Tanaka

Shinya Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200316687
    Abstract: A lamination molding apparatus of the present disclosure includes: a recoater head that forms a material powder layer by uniformly spreading metal material powder on a modeling table at a predetermined height; a laser light irradiation device that irradiates the material powder layer with laser light, and heats and melts the material powder to form a sintered layer; and a control device that forms a sintered body, which is an three-dimensional molded object, by repeatedly driving and controlling the recoater head and the laser light irradiation device; the control device reads sintered body data, that is configured by the shape of a base part in which at least a plurality of support members with constricted central portion are arranged continuously and the shape of a main body part which is a final molded product, and drives and controls the laser light irradiation device and the recoater head to form the sintered body.
    Type: Application
    Filed: March 31, 2020
    Publication date: October 8, 2020
    Applicant: SODICK CO., LTD.
    Inventors: Satoru INOUE, Soichiro TANAKA, Shinya MORIYAMA
  • Publication number: 20200316906
    Abstract: Provided is a nonwoven fabric and a laminated nonwoven fabric suitable as the skin material of a composite sound-absorbing material. The nonwoven fabric and laminated nonwoven fabric are easily formable, thin, and lightweight and excel in form stability, and can nevertheless be controlled within a given range of aeration after being formed into shape. A nonwoven fabric having a laminate structure in which at least one ultra-fine fiber layer (M) having an average fiber diameter of 0.3 to 7 ?m (inclusive) and a basis weight of 1 g/m2 to 40 g/m2 (inclusive) and at least one continuous filament layer (S) having an average fiber diameter of 10 to 30 ?m (inclusive) are integrated together by partial thermocompression bonding.
    Type: Application
    Filed: December 13, 2018
    Publication date: October 8, 2020
    Applicant: Asahi Kasei Kabushiki Kaisha
    Inventors: Shinya Yamamuro, Rumina Obi, Kazufumi Kato, Tomoya Tanaka, Chie Okamura, Yasushi Isono, Junki Saito
  • Patent number: 10781177
    Abstract: The present invention provides a compound represented by formula (I) (in the formula, R1 to R4 each represent a hydrogen atom, an unsubstituted or G1-substituted C1-6 alkyl group or the like, A represents an oxygen atom or the like, Cy represents a C6-10 aryl group or the like), an N-oxide compound thereof, a tautomer or salt thereof. The present invention also provides an agricultural and horticultural fungicide, harmful organism control agent and insecticidal/acaricidal agent containing at least one compound selected from the group consisting of a compound represented by formula (I), a tautomer and salt thereof, as an active ingredient.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: September 22, 2020
    Assignee: Nippon Soda Co., Ltd.
    Inventors: Takaaki Teranishi, Shinya Uesusuki, Jun Iwata, Takuya Kamada, Youhei Munei, Satoshi Nishimura, Hiroki Inoue, Tetsuya Tanaka, Yuka Nakamura, Yusuke Fukushima, Tomomi Kobayashi, Shinya Koubori
  • Patent number: 10784075
    Abstract: An apparatus provided with a wafer processing chamber that houses a wafer supporting mechanism supporting a wafer and is used to irradiate the wafer supported by the wafer supporting mechanism with an ion beam and a transport mechanism housing chamber that houses a transport mechanism provided underneath the wafer processing chamber and used for moving the wafer supporting mechanism in a substantially horizontal direction, wherein an aperture used for moving the wafer supporting mechanism along with a coupling member coupling the wafer supporting mechanism to the transport mechanism is formed in the direction of movement of the transport mechanism in a partition wall separating the wafer processing chamber from the transport mechanism housing chamber.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: September 22, 2020
    Assignee: NISSIN ION EQUIPMENT CO., LTD.
    Inventors: Shinya Hisada, Kohei Tanaka, Shigehisa Tamura, Makoto Nakaya
  • Patent number: 10774420
    Abstract: According to an embodiment, a flow passage structure includes a member. The member has a surface and is provided with a first passage, a plurality of first openings, a second passage, and a plurality of second openings. The first passage includes a plurality of first closed path portions connected to each other. The first openings is connected to the first passage and is opened in the surface. The second passage includes a plurality of second closed path portions connected to each other. The second openings is connected to the second passage and is opened in the surface. The first closed path portions pass through the second closed path portions while being isolated from the second closed path portions. The second closed path portions pass through the first closed path portions while being isolated from the first closed path portions.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: September 15, 2020
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takahiro Terada, Shiguma Kato, Shinya Higashi, Masayuki Tanaka, Takuya Matsuda
  • Patent number: 10775681
    Abstract: Provided is an ultrasonic motor including an annular vibrator and an annular moving member that is brought into pressure-contact with the vibrator. The vibrator includes an annular vibrating plate and an annular piezoelectric element. The piezoelectric element includes an annular lead-free piezoelectric ceramic piece, a common electrode arranged on one surface of the piezoelectric ceramic piece, and a plurality of electrodes arranged on the other surface of the piezoelectric ceramic piece. The plurality of electrodes include two drive phase electrodes, one or more non-drive phase electrodes, and one or more detection phase electrodes. A second surface of the vibrating plate includes a plurality of groove regions extending radially, and the depths of the groove regions change in a circumferential direction along a curve obtained by superimposing one or more sine waves on one another. The ultrasonic motor exhibits a sufficient drive speed while suppressing generation of an unnecessary vibration wave.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: September 15, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventors: Makoto Kubota, Akira Uebayashi, Tatsuo Furuta, Shinya Koyama, Jumpei Hayashi, Hidenori Tanaka
  • Publication number: 20200283294
    Abstract: A hydrogen generator having a reforming catalyst that causes hydrocarbon gas and steam to carry out a reforming reaction and reform into a hydrogen rich reformed gas, a reformer that is filled with said reforming catalyst and in which said reforming reaction is carried out, and a combustion chamber for combusting a fuel gas and obtaining reaction heat that is applied to said reforming reaction. At least the reforming region carrying out the reforming reaction is disposed inside the combustion chamber. A steam generator that introduces steam into the reformer is provided outside the combustion chamber.
    Type: Application
    Filed: October 26, 2018
    Publication date: September 10, 2020
    Inventors: Tatsuya KAWAMOTO, Masako TANAKA, Yoshiro NITTA, Shinya KAWAHARA
  • Publication number: 20200282709
    Abstract: A resealable packaging container, which is a resealable package including a lid material that uses a multilayer film including three layers in which a substrate layer (A), an intermediate layer (B), and a heat seal layer (C) are laminated in the sequence (A)/(B)/(C); and a bottom material that uses a single-layer or multilayer sheet having an adherend (D) that can adhere to the heat seal layer (C), wherein the substrate layer (A), the intermediate layer (B), and the heat seal layer (C) all include a polyolefin resin, and when the heat seal layer (C) and the adherend (D) are heat-sealed to form a heat seal part, and the multilayer film is subsequently peeled from the heat seal part, the intermediate layer (B) and the heat seal layer (C) are delaminated and exposed in a resealable state.
    Type: Application
    Filed: February 2, 2017
    Publication date: September 10, 2020
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Tatsuya OKU, Shinya TANAKA, Makoto EGAWA
  • Publication number: 20200277475
    Abstract: The present invention is a resin composition including: a resin component; zinc oxide; and an acetic acid remover, wherein the resin component includes an ethylene-vinylacetate copolymer and a content of the ethylene-vinylacetate copolymer in the resin component is greater than or equal to 10% by mass, wherein the acetic acid remover is an acid acceptor, a nitrogen-containing aromatic heterocyclic compound having a mercapto group, or a combination thereof, and wherein a mass ratio of the zinc oxide to the ethylene-vinylacetate copolymer is greater than or equal to 0.06 and less than or equal to 0.20.
    Type: Application
    Filed: December 22, 2017
    Publication date: September 3, 2020
    Inventors: Shigeyuki TANAKA, Taro FUJITA, Shinya NISHIKAWA, Takaya KOHORI, Motoi MATSUDA, Hiroyuki OKAWA
  • Patent number: 10763354
    Abstract: A semiconductor device of an embodiment includes a silicon carbide layer having a first and a second plane, a trench, a gate electrode in the trench, an n-type first silicon carbide region, a p-type second silicon carbide region and a p-type third silicon carbide region provided between the first silicon carbide region and the first plane and interposing the trench therebetween, a p-type sixth silicon carbide region between the first silicon carbide region and the second silicon carbide region, a p-type seventh silicon carbide region between the first silicon carbide region and the third silicon carbide region, an eighth silicon carbide region between the first silicon carbide region and the sixth silicon carbide region, and a ninth silicon carbide region between the first silicon carbide region and the seventh silicon carbide region. The eighth silicon carbide region has a plurality of first regions extending toward the ninth silicon carbide region.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: September 1, 2020
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Shinya Kyogoku, Katsuhisa Tanaka, Ryosuke Iijima
  • Publication number: 20200273606
    Abstract: Provided are a core electric wire for multi-core cable that is superior in flex resistance at low temperature, and a multi-core cable employing the same. A core electric wire for multi-core cable according to an aspect of the present invention comprises a conductor obtained by twisting element wires, and an insulating layer that covers an outer periphery of the conductor, in which, in a transverse cross section of the conductor, a percentage of an area occupied by void regions among the element wires is from 5% to 20%. An average area of the conductor in the transverse cross section is preferably from 1.0 mm2 to 3.0 mm2. An average diameter of the element wires in the conductor is preferably from 40 ?m to 100 ?m, and the number of the element wires is preferably from 196 to 2,450. The conductor is preferably obtained by twisting stranded element wires obtained by twisting subsets of element wires.
    Type: Application
    Filed: April 30, 2020
    Publication date: August 27, 2020
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Shigeyuki TANAKA, Shinya NISHIKAWA, Hiroyuki OKAWA, Takaya KOHORI, Yuhei MAYAMA, Takayuki HIRAI
  • Patent number: 10741583
    Abstract: A semiconductor memory device includes a connecting member including a semiconductor material, a first electrode film, a first insulating film, a stacked body and three or more semiconductor pillars. The stacked body includes second electrode films and second insulating films that alternately stacked. The semiconductor pillars are arrayed along two or more directions, extend in a stacking direction, pierce through the stacked body and the first insulating film, and are connected to the connecting member. The device includes a third insulating film provided between the semiconductor pillars and the stacked body and between the connecting member and the first electrode film. A charge storage layer is provided at least between one of the second electrode films and the third insulating film.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: August 11, 2020
    Assignee: Toshiba Memory Corporation
    Inventors: Yoshiaki Fukuzumi, Shinya Arai, Masaki Tsuji, Hideaki Aochi, Hiroyasu Tanaka
  • Publication number: 20200237220
    Abstract: A biological information measurement device that performs sound wave communications with an external terminal including a microphone includes a housing; a measurement circuit that measures biological information; a modulation circuit that converts the biological information measured into a sound wave signal; and a vibration member that vibrates based on the sound wave signal transmitted from the modulation circuit. The measurement circuit, the modulation circuit and the vibration member are provided inside the housing. The housing includes a terminal placement surface on which the terminal is placed. The vibration member and the terminal placement surface are in contact with each other so that vibration of the vibration member is transmitted to the terminal placement surface.
    Type: Application
    Filed: January 28, 2020
    Publication date: July 30, 2020
    Applicant: OMRON HEALTHCARE CO., LTD.
    Inventors: Hideaki YOSHIDA, Shinya TANAKA
  • Publication number: 20200237239
    Abstract: In a main body of an upper-arm type sphygmomanometer that measures blood pressure of a subject by using a bag-shaped arm cuff to be wound around an arm of the subject, a main body housing includes an upper surface, and a first side surface and a second side surface on left and right sides. The first side surface includes a first side surface electrode region, the second side surface includes a second side surface electrode region, the upper surface includes a first upper surface electrode region, a first electrocardiogram waveform measurement electrode is provided in the first side surface electrode region, a second electrocardiogram waveform measurement electrode is provided in the second side surface electrode region, and a first reference electrode is provided in the first upper surface electrode region.
    Type: Application
    Filed: January 28, 2020
    Publication date: July 30, 2020
    Applicant: OMRON HEALTHCARE Co., Ltd.
    Inventors: Hideaki YOSHIDA, Takehiro HAMAGUCHI, Hiroko YOSHINO, Kengo NISHIYAMA, Asa HIRASAWA, Shinya TANAKA, Motofumi NAKANISHI, Kazuya MURASE, Mika EZOE, Kenji ONO
  • Patent number: 10727312
    Abstract: A nitride semiconductor device includes: an electron transit layer including GaxIn1-xN (0<x?1); an electron supply layer formed on the electron transit layer and including AlyIn1-yN (0<y?1); a gate insulating film formed to pass through the electron supply layer to contact the electron transit layer; and a gate electrode facing the electron transit layer with the gate insulating film interposed therebetween, wherein, in the electron transit layer, a portion contacting the gate insulating film and a portion contacting the electron transit layer are flush with each other.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: July 28, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Shinya Takado, Minoru Akutsu, Taketoshi Tanaka, Norikazu Ito
  • Publication number: 20200232095
    Abstract: According to an embodiment, a flow passage structure includes a member. The member has a surface and is provided with a first passage, a plurality of first openings, a second passage, and a plurality of second openings. The first passage includes a plurality of first closed path portions connected to each other. The first openings is connected to the first passage and is opened in the surface. The second passage includes a plurality of second closed path portions connected to each other. The second openings is connected to the second passage and is opened in the surface. The first closed path portions pass through the second closed path portions while being isolated from the second closed path portions. The second closed path portions pass through the first closed path portions while being isolated from the first closed path portions.
    Type: Application
    Filed: June 26, 2017
    Publication date: July 23, 2020
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Takahiro TERADA, Shiguma KATO, Shinya HIGASHI, Masayuki TANAKA, Takuya MATSUDA
  • Publication number: 20200224324
    Abstract: The present invention provides an additive for electrolytic plating solutions, containing at least one selected from compounds represented by the chemical formulas (1) to (4) given in the present description, an electrolytic plating solution containing the additive for electrolytic plating solutions, and an electrolytic plating method that uses the electrolytic plating solution.
    Type: Application
    Filed: August 23, 2018
    Publication date: July 16, 2020
    Applicant: ADEKA CORPORATION
    Inventors: Shinichi TANAKA, Shouhei TOYODA, Shinya ISHIWATA, Takuya TAKAHASHI, Yong Gyun KIM
  • Patent number: 10703889
    Abstract: An insulated electric wire includes a conductor and an insulating layer covering an outer periphery of the conductor. The insulating layer is formed of a crosslinked polymer of an insulating resin composition that contains a resin component containing a first copolymer which is a copolymer of ethylene and an unsaturated hydrocarbon having 4 or more carbon atoms and which has a density of less than 0.88 g/cm3, a second copolymer which is a copolymer of ethylene and an unsaturated hydrocarbon having 4 or more carbon atoms and which has a density of 0.88 g/cm3 or more and less than 0.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: July 7, 2020
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Nayu Yanagawa, Shigeyuki Tanaka, Taro Fujita, Shinya Nishikawa, Takumi Ooshima, Hiroyuki Okawa
  • Publication number: 20200207087
    Abstract: A liquid discharge apparatus includes a head including a nozzle plate having a plurality of nozzles lined in a row and configured to discharge a liquid, a conveyor configured to convey the liquid application target, and a liquid receptacle configured to receive the liquid discharged from the head. The conveyor defines a conveyance passage of a liquid application target to which the head applies the liquid. The liquid receptacle has an opening through which the liquid discharged from the head passes. A longitudinal direction of the opening is along a movement direction of the liquid application target. A width of the opening is greater than a width of the liquid application target in a direction orthogonal to the movement direction.
    Type: Application
    Filed: December 16, 2019
    Publication date: July 2, 2020
    Inventors: Shinya TANAKA, Hiroyuki YAMASHITA
  • Patent number: 10699824
    Abstract: Provided are a core electric wire for multi-core cable that is superior in flex resistance at low temperature, and a multi-core cable employing the same. A core electric wire for multi-core cable according to an aspect of the present invention comprises a conductor obtained by twisting element wires, and an insulating layer that covers an outer periphery of the conductor, in which, in a transverse cross section of the conductor, a percentage of an area occupied by void regions among the element wires is from 5% to 20%. An average area of the conductor in the transverse cross section is preferably from 1.0 mm2 to 3.0 mm2. An average diameter of the element wires in the conductor is preferably from 40 ?m to 100 ?m, and the number of the element wires is preferably from 196 to 2,450. The conductor is preferably obtained by twisting stranded element wires obtained by twisting subsets of element wires.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: June 30, 2020
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Shigeyuki Tanaka, Shinya Nishikawa, Hiroyuki Okawa, Takaya Kohori, Yuhei Mayama, Takayuki Hirai