Abstract: A semiconductor 110 device includes an array of like base cells wherein each base cell includes at least one source 132 and at least one drain 130 region formed in a semiconductor substrate. At least one gate 126 is formed over and insulated from a channel region 118 which separates the source 132 and drain 130 regions. An insulating layer 190 overlies the structure. A plurality of contacts are formed in the insulating layer in a plurality of substantially parallel, evenly spaced grid lines G1-G5. In addition, at least one additional contact 150 formed between two adjacent ones G2 and G3 of the substantially parallel grid lines is formed. A plurality of interconnect lines 142 and 144 are formed over the insulating layer such that each contact is connected to at least one of the interconnect lines. Modifications, variations, circuit configurations and an illustrative fabrication method are also disclosed.

Abstract: A system (10) is provided for approximating a nonlinear function. The system (10) comprises first and second multiple generating circuits (12) and (14) for multiplying a first quantity and a second quantity by up to three integer powers of two. First and second function generating circuits (16) and (18) generate first and second functions of the first and the second quantities by combining the multiples generated in first and second multiple generating circuits (12) and (14). First and second approximation generating circuits (20) and (22) generate first and second approximations of the nonlinear function by shifting the output of first and second function generating circuits (16) and (18). Approximation selecting circuit (24) outputs the appropriate approximation generated in first and second approximation generating circuits (20) and (22).

Abstract: A variable frequency oscillator (19) and method of producing an oscillating signal are provided in which a current mirror (12) receives a control current and generates a mirrored current. A capacitor (20) is coupled to the current mirror (12) and charges and discharges through the current mirror (12) based on the direction of the mirrored current. A trigger (22) is coupled to the capacitor (20) and outputs a first voltage level when the capacitor (20) charges to a first voltage threshold and outputs a second voltage level when the capacitor (20) discharges to a second voltage threshold. A switch (14) is coupled to the current mirror (12) and the trigger (22) for changing the direction of the mirrored current based on the output voltage of the trigger (22).

Abstract: A new class of CMOS integrated circuits, wherein the PMOS and NMOS devices are both configured as vertical transistors. One trench can contain a PMOS device, an NMOS device, and a gate which is coupled to control both the PMOS device and the NMOS device. Latchup problems do not arise, and n+ to p+ spacing rules are not required.

Abstract: An improved memory cell (118) is provided which may be incorporated into an array (202) of memory cells. Array (202) includes a first gate conductor region (224) and a second gate conductor region (238), wherein the first and second gate conductor regions are orthogonal to one another. Each one-half of the cell may include two series transistors connected to a cross-coupled trench transistor. Cross-coupling of the trench transistors is effected through the use of parallel local interconnect regions (256) and (258).

Abstract: A gate array base cell which can easily be configured as high conductivity transistor device or a low conductivity transistor device comprises a moat region of first conductivity type, typically heavily doped n-type silicon or heavily doped p-type silicon, for example. A channel region of a different conductivity type separates the moat region into at least three portions. An insulating layer, such as silicon dioxide, for example, and a gate are formed above the channel region. The gate may be formed of polysilicon, for example. Modifications, variations, circuit configurations and an illustrative fabrication method are also disclosed.

Abstract: A scanning electron microscope (28) is connected to a test structure (48) formed on a semiconductor wafer. The test structure (48) comprises a plurality of first parallel structures (54) and a plurality of second parallel structure (56) transverse to and interlocking with the first structures (54). An island (60) is formed within a grid (58) formed by the structures (54-56) and is separated therefrom. An electron beam (38) from the scanning electron microscope (28) is aimed at the structure (48) and secondary electrons emitted therefrom are visually displayed on a monitor (44). The visual display (47) provides information on whether the island (60) is electrically separated from the mesh (58) or shorted thereto by comparing the intensity of the various islands (60).

Abstract: A test set socket adaptor (20) comprises a substrate (28), a plurality of cantilever beams (32) and a package (30). A bare chip (22) may be inserted into and held by the test socket adaptor (20) for insertion into a standard test socket. The cantilevers (32) are designed to deflect and compensate for variations in solder bumps (26) on the bare chip (22). The deflection of the cantilever beams (32) allows a positive contact between the solder bumps (26) and the cantilever beams for an AC and a burn-in test.

Abstract: A new class of CMOS integrated circuits, wherein the PMOS and NMOS devices are both configured as vertical transistors. One trench can contain a PMOS device, an NMOS device, and a gate which is coupled to control both the PMOS device and the NMOS device. Latchup problems do not arise, and n+ to p+ spacing rules are not required.

Abstract: An improved memory cell 118 is provided utilizing transistor pairs 142, 144 ands 160, 162 as dual purpose transistor pairs for the two modes of operation of the cell. During the first or non-access mode of operation, the transistor pairs operate as switched capacitive elements in order to provide an equivalent resistance between bit line 140 and first node 26 and inverted bit line 158 and second node 130. Control circuit 119 maintains bit lines 140 and inverted bit line 158 high during this non-access mode. During the second or access mode of operation, each transistor pair operates as a respective pass transistor for connecting bit line 140 to first node 126 and inverted bit line 158 to second node 130 so that data may be read from, or written to, the cross-coupled transistors 120 and 122.

Abstract: A test set socket adapter (20) comprises a substrate (28), a plurality of cantilever beams (32) and a package (30). A bare chip (22) may be inserted into and held by the test socket adapter (20) for insertion into a standard test socket. The cantilevers (32) are designed to deflect and compensate for variations in solder bumps (26) on the bare chip (22). The deflection of the cantilever beams (32) allows a positive contact between the solder bumps (26) and the cantilever beams for an AC and a burn-in test.

Abstract: A scanning electron microscope (28) is connected to a test structure (48) formed on a semiconductor wafer. The test structure (48) comprises a plurality of first parallel structures (54) and a plurality of second parallel structure (56) transverse to and interlocking with the first structures (54). An island (60) is formed within a grid (58) formed by the structures (54-56) and is separated therefrom. An electron beam (38) from the scanning electron microscope (28) is aimed at the structure (48) and secondary electrons emitted therefrom are visually displayed on a monitor (44). The visual display (47) provides information on whether the island (60) is electrically separated from the mesh (58) or shorted thereto by comparing the intensity of the various islands (60).

Abstract: A combination inverter chain and ring oscillator (200) is used to measure the capacitance of a field effect transistor device (12, 85, 202) by measuring the current associated with propagating a signal through the circuit at a certain signal frequency. Where the device (12) is a CMOS pair, the capacitance thus obtained is reduced by a constant factor to take crowbar current (52) into account. Once the capacitance for a basic or reference device (84) has been determined, the basic structure may be modified to derive incremental per-unit area capacitances for various components of the device structure.

Abstract: Column decoding is performed using multiply decoded subsets of column address bits bussed across the array to multiple first stage and second stage column multiplexers. That is, for example, in an 8k by 9 memory wherein each subarray contains 16 selectable columns at each bit position, two of the address bits would be fully decoded to provide four buss lines across the chip. Each column has a primary sense amplifier, controlled by one of these four decoded lines. The outputs of each set of four primary sense amplifiers are multiplexed into a secondary sense amplifier, (preferably on a local three-scale buss) and the output of each secondary sense amplifier is selected or deselected by four buss lines which are the decoded signals corresponding to the other two address bits which select one of 16 columns. Preferably multiplexing of the output of the secondary sense amplifiers is accomplished by a three-state buffer, so that the output of these buffers can be accomplished as a wired-or function.

Abstract: A memory including various selectively configurable peripherals which provide on-chip low-level control features and a configuration RAM storing bits which both provide unclocked full logic-level outputs to control the selectively configurable peripherals and can also be accessed and read out. That is, each cell in the configuration RAM has two output modes: a digital continuous output, which is provided as a continuous control signal to various peripheral circuits and a selectable analog output which is used to read the information stored in the configuration RAM.

Abstract: A byte-wide memory with column redundancy. The redundant columns can each be substituted for any column in the half-array, without regard to which bit position the defective column relates to. Fuses store the address information of the defective columns, and when a match between the externally received column address and the stored defective-column-address is found, the sense amplifier for the bit position which contains that defective column is disabled, and the output of the redundant column (selected by whichever word line is activated) is multiplexed into the I-O buss. Thus, before the row address signal has even been decoded, the defective column has been disabled and one of the redundant columns has effectively been substituted. This configuration means that it is not necessary to have one redundant column for every bit position, but each redundant column can substitute for a defective column in any bit position, and more than one defective column in a single bit position can each be replaced.