Patents by Inventor Sho Suzuki

Sho Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210289090
    Abstract: A sheet separation device separates a non-bonding portion of a two-ply sheet in which two sheets are overlapped and bonded together at a bonding portion of the two-ply sheet. The sheet separation device includes a separator, an abnormality detection device, and circuitry. The separator is configured to move to be inserted into a gap formed between the two sheets of the two-ply sheet. The abnormality detection device is configured to detect an abnormal state in which the gap larger than a predetermined size is not formed between the two sheets before the separator is inserted into the gap. The circuitry is configured to control movement of the separator based on a result detected by the abnormality detection device.
    Type: Application
    Filed: February 15, 2021
    Publication date: September 16, 2021
    Applicant: Ricoh Company, Ltd.
    Inventors: Shinya MONMA, Tomohiro FURUHASHI, Wataru TAKAHASHI, Sho ASANO, Yoshito SUZUKI, Joji AKIYAMA, Yohsuke HARAGUCHI, Wataru NOZAKI
  • Patent number: 11121160
    Abstract: Photoelectric conversion apparatus includes semiconductor layer having photoelectric converters in light-receiving region and photoelectric converters in light-shielded region, light-shielding part arranged above the semiconductor layer in the light-receiving region to surround light paths of the photoelectric converters in the light-receiving region, and light-shielding film arranged above the semiconductor layer in the light-shielded region to cover the photoelectric converters in the light-shielded region. The light-shielding part includes lower and upper ends. The light-shielding film includes lower and upper surfaces. Distance between the upper end and the semiconductor layer is larger than that between the upper surface and the semiconductor layer. Distance between the lower end and the semiconductor layer is smaller than that between the upper surface and the semiconductor layer and is larger than that between the lower surface and the semiconductor layer.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: September 14, 2021
    Assignee: Canon Kabushiki Kaisha
    Inventors: Sho Suzuki, Takehito Okabe, Mitsuhiro Yomori, Takuya Hara, Keita Torii, Yukinobu Suzuki, Tomoyuki Tezuka, Norihiko Nakata, Daichi Seto, Kenji Togo
  • Patent number: 11105272
    Abstract: A throttle device includes a default mechanism. The default mechanism includes: a defining portion arranged on the body to define the default position; a first rotation body which rotates integrally with the valve shaft; a second rotation body which can rotate relative to the valve shaft and which engages with the defining portion to limit the rotation in a valve-closing direction; a first urging spring which is interposed between the first rotation body and the body and urges the first rotation body in the valve-closing direction; and a second urging spring which is interposed between the first rotation body and the second rotation body, and urges so as to draw the first rotation body in a valve-opening direction and draw the second rotation body in the valve-closing direction to engage the two with each other and to maintain the engagement during the non-operation of the drive source.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: August 31, 2021
    Assignee: MIKUNI CORPORATION
    Inventors: Sho Moriya, Keigo Suzuki, Masaki Hiei
  • Patent number: 11056823
    Abstract: In an electric connector, a waterproof member having an internal waterproof portion and an external waterproof portion is provided in a main body portion. The internal waterproof portion and the external waterproof portion are integrated. Accordingly, the internal waterproof portion covers exposed portions of an upper contact and a lower contact and prevents water intrusion along the upper contact and the lower contact. In addition, the external waterproof portion prevents water intrusion between the electric connector and an inner wall of an accommodating space of an electronic device by surrounding the entire circumference of the main body portion. Since the internal waterproof portion and the external waterproof portion are integrated in this manner, both internal waterproofing and external waterproofing can be realized with the simple configuration of the single waterproof member in the electric connector.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: July 6, 2021
    Inventors: Sho Suzuki, Atsushi Nara, Takashi Sasaki
  • Patent number: 11011866
    Abstract: In an electrical connector, a connecting portion has a first resin holding a lower contact with respect to an intermediate ground plate and a second resin holding an upper contact with respect to the intermediate ground plate and separate from the first resin. Also provided is a third resin covering the first resin and the second resin and separate from the first resin and the second resin. When the electrical connector is manufactured, deflection can be suppressed based on division into a step of forming the first resin and a step of forming the second resin and by means of a mold suppressing deflection of the upper contact and the lower contact.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: May 18, 2021
    Inventor: Sho Suzuki
  • Publication number: 20200344896
    Abstract: The insertion loss of a multilayer substrate and an antenna element is reduced. A multilayer substrate according to an embodiment of the present disclosure includes a multilayer body, a wire conductor, and a first ground electrode. The multilayer body is formed by dielectric layers being layered. The wire conductor is formed in the multilayer body, and a radio frequency signal passes through the wire conductor. The first ground electrode is formed in or on the multilayer body and includes a first surface that faces the wire conductor. The first surface includes a first region and a second region. The surface roughness of the first region is lower than the surface roughness of the second region. The first region overlaps at least part of the wire conductor in plan view in a direction normal to the first ground electrode.
    Type: Application
    Filed: June 23, 2020
    Publication date: October 29, 2020
    Inventors: Saneaki ARIUMI, Tomoshige FURUHI, Sho SUZUKI
  • Publication number: 20200335547
    Abstract: A photoelectric conversion apparatus includes a plurality of units each including a charge generation region disposed in a semiconductor layer. Each of a first unit and a second unit of the plurality of units includes a charge storage region configured to store charges transferred thereto from the charge generation region, a dielectric region located above the charge generation region and surrounded by an insulator layer, and a first light-shielding layer covering the charge storage region that is located between the insulator layer and the semiconductor layer, and the first light-shielding layer having an opening located above the charge generation region. The charge generation region of the first unit is able to receive light through the opening of the first light-shielding layer. The charge generation region of the second unit is covered with a second light-shielding layer.
    Type: Application
    Filed: July 6, 2020
    Publication date: October 22, 2020
    Inventors: Yu Nishimura, Sho Suzuki, Yasushi Matsuno, Yusuke Onuki, Masahiro Kobayashi, Takashi Okagawa, Yoshiyuki Nakagawa
  • Publication number: 20200295497
    Abstract: In an electrical connector, a connecting portion has a first resin holding a lower contact with respect to an intermediate ground plate and a second resin holding an upper contact with respect to the intermediate ground plate and separate from the first resin. Also provided is a third resin covering the first resin and the second resin and separate from the first resin and the second resin. When the electrical connector is manufactured, deflection can be suppressed based on division into a step of forming the first resin and a step of forming the second resin and by means of a mold suppressing deflection of the upper contact and the lower contact.
    Type: Application
    Filed: April 20, 2018
    Publication date: September 17, 2020
    Applicant: DAI-ICHI SEIKO CO.,LTD.
    Inventor: Sho SUZUKI
  • Patent number: 10763298
    Abstract: A photoelectric conversion apparatus includes a plurality of units each including a charge generation region disposed in a semiconductor layer. Each of a first unit and a second unit of the plurality of units includes a charge storage region configured to store charges transferred thereto from the charge generation region, a dielectric region located above the charge generation region and surrounded by an insulator layer, and a first light-shielding layer covering the charge storage region that is located between the insulator layer and the semiconductor layer, and the first light-shielding layer having an opening located above the charge generation region. The charge generation region of the first unit is able to receive light through the opening of the first light-shielding layer. The charge generation region of the second unit is covered with a second light-shielding layer.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: September 1, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Yu Nishimura, Sho Suzuki, Yasushi Matsuno, Yusuke Onuki, Masahiro Kobayashi, Takashi Okagawa, Yoshiyuki Nakagawa
  • Publication number: 20200274221
    Abstract: A transmission line (12) includes a multilayer substrate (20), a signal pattern line (30), a ground pattern conductor (50), and an intermediate ground pattern conductor (40) that is arranged between the signal pattern line (30) and the ground pattern conductor (50) and that is electrically connected to the ground pattern conductor (50). The signal pattern line (30) has a first connection point (30c) to which a signal conductor extending in a laminating direction of the multilayer substrate (20) is connected. A first cavity portion (41h) is formed in the intermediate ground pattern conductor (40) at a position overlapped with a first end portion (30a) of the signal pattern line (30) in a plan view of the multilayer substrate (20). A first end edge (41e) of the first cavity portion (41h) has a first overlapping portion (41a) overlapped with the signal pattern line (30).
    Type: Application
    Filed: May 15, 2020
    Publication date: August 27, 2020
    Inventors: Sho SUZUKI, Keisei TAKAYAMA
  • Publication number: 20200194926
    Abstract: In an electric connector, a waterproof member having an internal waterproof portion and an external waterproof portion is provided in a main body portion. The internal waterproof portion and the external waterproof portion are integrated. Accordingly, the internal waterproof portion covers exposed portions of an upper contact and a lower contact and prevents water intrusion along the upper contact and the lower contact. In addition, the external waterproof portion prevents water intrusion between the electric connector and an inner wall of an accommodating space of an electronic device by surrounding the entire circumference of the main body portion. Since the internal waterproof portion and the external waterproof portion are integrated in this manner, both internal waterproofing and external waterproofing can be realized with the simple configuration of the single waterproof member in the electric connector.
    Type: Application
    Filed: April 20, 2018
    Publication date: June 18, 2020
    Applicants: DAI-ICHI SEIKO CO.,LTD., NIPPON MEKTRON, LTD.
    Inventors: Sho SUZUKI, Atsushi NARA, Takashi SASAKI
  • Patent number: 10685932
    Abstract: A semiconductor substrate (1) has a front surface and a back surface that are opposite each other. A first metal layer (2) is formed on the front surface of the semiconductor substrate (1). A second metal layer (3) for soldering is formed on the first metal layer (2). A third metal layer (5) is formed on the back surface of the semiconductor substrate (1). A fourth metal layer (6) for soldering is formed on the third metal layer (5). The second metal layer (3) has a larger thickness than that of the fourth metal layer (6). The first, third, and fourth metal layers (2,5,6) are not divided in a pattern. The second metal layer (3) is divided in a pattern and has a plurality of metal layers electrically connected to each other via the first metal layer (2).
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: June 16, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Sho Suzuki, Tsuyoshi Osaga
  • Publication number: 20200144215
    Abstract: A semiconductor substrate (1) has a front surface and a back surface that are opposite each other. A first metal layer (2) is formed on the front surface of the semiconductor substrate (1). A second metal layer (3) for soldering is formed on the first metal layer (2). A third metal layer (5) is formed on the back surface of the semiconductor substrate (1). A fourth metal layer (6) for soldering is formed on the third metal layer (5). The second metal layer (3) has a larger thickness than that of the fourth metal layer (6). The first, third, and fourth metal layers (2, 5, 6) are not divided in a pattern. The second metal layer (3) is divided in a pattern and has a plurality of metal layers electrically connected to each other via the first metal layer (2).
    Type: Application
    Filed: June 8, 2016
    Publication date: May 7, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Sho SUZUKI, Tsuyoshi OSAGA
  • Publication number: 20200127031
    Abstract: Photoelectric conversion apparatus includes semiconductor layer having photoelectric converters in light-receiving region and photoelectric converters in light-shielded region, light-shielding part arranged above the semiconductor layer in the light-receiving region to surround light paths of the photoelectric converters in the light-receiving region, and light-shielding film arranged above the semiconductor layer in the light-shielded region to cover the photoelectric converters in the light-shielded region. The light-shielding part includes lower and upper ends. The light-shielding film includes lower and upper surfaces. Distance between the upper end and the semiconductor layer is larger than that between the upper surface and the semiconductor layer. Distance between the lower end and the semiconductor layer is smaller than that between the upper surface and the semiconductor layer and is larger than that between the lower surface and the semiconductor layer.
    Type: Application
    Filed: October 15, 2019
    Publication date: April 23, 2020
    Inventors: Sho Suzuki, Takehito Okabe, Mitsuhiro Yomori, Takuya Hara, Keita Torii, Yukinobu Suzuki, Tomoyuki Tezuka, Norihiko Nakata, Daichi Seto, Kenji Togo
  • Publication number: 20200127030
    Abstract: Photoelectric conversion apparatus includes semiconductor layer in which first photoelectric converters are arranged in light-receiving region and second photoelectric converters are arranged in light-shielded region, light-shielding wall arranged above the semiconductor layer and defining apertures respectively corresponding to the first photoelectric converters, and light-shielding film arranged above the semiconductor layer. The light-shielding film includes first portion extending along principal surface of the semiconductor layer to cover the second photoelectric converters. The first portion has lower surface and upper surface. The light-shielding wall includes second portion whose distance from the semiconductor layer is larger than distance between the upper surface and the principal surface. Thickness of the first portion in direction perpendicular to the principal surface is larger than thickness of the second portion in direction parallel to the principal surface.
    Type: Application
    Filed: October 14, 2019
    Publication date: April 23, 2020
    Inventors: Toshiyuki Ogawa, Sho Suzuki, Takehito Okabe, Mitsuhiro Yomori, Yukinobu Suzuki, Akihiro Kawano, Tsutomu Tange
  • Patent number: 10511751
    Abstract: A photoelectric conversion apparatus includes a photoelectric conversion unit having a light incident surface and including: a first electrode; a second electrode disposed further toward the light incident surface; and a photoelectric conversion layer disposed between the first and second electrodes. The photoelectric conversion apparatus includes a member in contact with the photoelectric conversion layer and constituting a light guide together with the layer. An area of a first surface parallel to the light incident surface at a portion of the photoelectric conversion layer surrounded by the member is smaller than an area of a second surface disposed between the first surface and the second electrode at a portion of the photoelectric conversion layer surrounded by the member, and an area of orthogonal projection to the light incident surface of the first electrode is smaller than an area of orthogonal projection to the light incident surface of the second surface.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: December 17, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takashi Matsuda, Sho Suzuki, Hidekazu Takahashi, Nobuhiko Sato
  • Patent number: 10461119
    Abstract: A solid-state imaging device includes a light-shielding layer that is disposed in a pixel region containing a pixel including a photoelectric conversion element and a charge holding portion and a peripheral region in which a signal from the pixel is processed and that is electrically connected to a substrate at a contact portion in the peripheral region, a first insulating layer that has an end portion between the charge holding portion and the contact portion in plan view and that is disposed between the substrate and the light-shielding layer, and a first insulating member that is disposed on a side surface of the end portion of the first insulating layer and that buffers a step due to the end portion. A portion of the light-shielding layer overlapping the first insulating member in the plan view has an upper surface having a shape following a shape of the first insulating member.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: October 29, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Sho Suzuki, Kentaro Suzuki, Takashi Okagawa
  • Patent number: 10398728
    Abstract: A jelly-like potassium iodide pharmaceutical composition exhibits excellent storage stability and excellent dissolution properties, and can be taken easily. The jelly-like potassium iodide pharmaceutical composition includes potassium iodide as an active ingredient, a gelling agent, and a dispersion medium.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: September 3, 2019
    Assignee: Nichi-Iko Pharmaceutical Co., Ltd.
    Inventors: Naoko Yoshizawa, Sho Suzuki
  • Publication number: 20190267421
    Abstract: Image capturing device includes semiconductor substrate having photoelectric converters in light-receiving area and light-shielded area, insulating film arranged above principal face of the substrate and having holes arranged above the photoelectric converters, waveguide portions arranged in the holes, connecting portion connecting the waveguide portions above the insulating film, light-shielding film arranged on the connecting portion having opening in the light-receiving area, SiN film arranged on the light-shielding film so that the opening is arranged between the SiN film and the substrate in the light-receiving area, and insulator film having portion located in the opening and having portion located between the light-shielding film and the SiN film. Distance between upper face of the light-shielding film and the principal face is smaller than distance between lower face of the SiN film and the principal face.
    Type: Application
    Filed: February 19, 2019
    Publication date: August 29, 2019
    Inventors: Sho Suzuki, Mitsuhiro Yomori, Takehito Okabe, Takashi Okagawa
  • Patent number: 10381389
    Abstract: A manufacturing method of a solid state imaging device according to one embodiment includes the steps of forming, on a substrate, a gate electrode of a first transistor and a gate electrode of a second transistor adjacent to the first transistor; forming an insulator film covering the gate electrode of the first transistor and the gate electrode of the second transistor such that a void is formed between the gate electrode of the first transistor and the gate electrode of the second transistor; forming a film on the insulator film; and forming a light shielding member by removing a part of the film by an etching.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: August 13, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Mari Isobe, Shunsuke Nakatsuka, Masatsugu Itahashi, Yasuhiro Sekine, Sho Suzuki