Abstract: Provided is a method for manufacturing a transfer sheet which can impart a sufficient function to an adherend. The method for manufacturing a transfer sheet includes performing the following steps (1) and (2) in order: (1) applying a coating liquid for forming a transfer layer onto a release substrate 1 to form a transfer layer comprising at least one functional layer; and (2) laminating a release substrate 2 onto the transfer layer to obtain a transfer sheet A comprising the release substrate 1, the transfer layer and the release substrate 2 in the presented order and having a peel strength 2 between the release substrate 2 and the transfer layer larger than a peel strength 1 between the release substrate 1 and the transfer layer.

Abstract: The present invention provides, for example, a laminated film for molding, which not only has a hard coating ability equal to or more than conventional one, but also is improved in shape followability of the entire laminated film. The laminated film for molding of the present invention includes at least a substrate film, a hard coating layer, and a functional layer in the listed order, in which the hard coating layer includes at least a resin and 1 to 50 parts by mass of an inorganic oxide particle based on 100 parts by mass of the entire resin component included in the hard coating layer.

Abstract: To provide a hard coating film and a display device which are enhanced in feeling of uniformity of designability between a display area of a display and an area therearound and which are according to a new design concept. A smoke hard coating film 100 including at least a hard coating layer 21 containing a curing resin and a colorant dispersed in the curing resin, and a print layer 41 for partition and formation of a frame area FA and a display area DA disposed in the frame area FA in planar view, and having a total light transmittance (according to JIS K7361-1) of the display area DA, of 0.5% or more and less than 75%, is used in a display device 200 provided with a light-emitting display D. A difference (|RDA-RF|) between a reflectance of the display area DA (RDA) at 550 nm in a SCI mode and a reflectance of the frame area FA (RFA) at 550 nm in the SCI mode in turn off of the display is 5% or less in a state where the smoke hard coating film 100 is provided on the display surface.

Abstract: A connector includes: a circuit board; a first heat transfer material arranged on a principal surface of the circuit board; a first shell having an end mated with a mating connector in a state in which the terminal end portion of the circuit board protrudes from the end, and includes an opposite opposed to at least a part of a target region which is a region other than the terminal end portion, covers at least a part of the target region, and is conductive; a second shell connected to an end of the first shell, covers at least a part of the target region of the principal surface, and is thermally conductably connected to the circuit board in contact with the first heat transfer material; and a third shell engaged with the second shell, covers at least a part of the target region of a principal surface, and is conductive.

Abstract: A component includes a main member that includes a first surface that opposes a circuit board, the component being mounted to the circuit board during an assembly procedure, and a plurality of legs that protrude from the first surface, the plurality of legs having ends, wherein the component is mounted on the circuit board with the ends of the plurality of legs fixed to the circuit board, each of the ends of the plurality of legs includes an end surface that opposes the circuit board at time of the assembly procedure, and also includes a bevel that is continuous with the end surface and inclined with respect to the end surface, and an interior angle formed between the end surface and the bevel is larger than or equal to 120° and smaller than or equal to 170°.

Abstract: A connector device comprising a first connector and a second connector. The first connector comprises: a plurality of conductive first contacts; an insulating first contact holding portion holding the plurality of first contacts; a conductive partition wall partitioning the first contact holding portion into a first grouping area that holds two or more first contacts and a first individual area that holds one first contact; and a conductive first surrounding wall disposed around an outer periphery of the first individual area so that the first surrounding wall and the partition wall at least partially surround the first individual area. The second connector comprises: a plurality of conductive second contacts; and a conductive second surrounding wall. When the first connector and the second connector are fitted to each other, the second surrounding wall is disposed inside or outside the first surrounding wall around the outer periphery of the first individual area.

Abstract: Photoelectric conversion apparatus includes semiconductor layer in which first photoelectric converters are arranged in light-receiving region and second photoelectric converters are arranged in light-shielded region, light-shielding wall arranged above the semiconductor layer and defining apertures respectively corresponding to the first photoelectric converters, and light-shielding film arranged above the semiconductor layer. The light-shielding film includes first portion extending along principal surface of the semiconductor layer to cover the second photoelectric converters. The first portion has lower surface and upper surface. The light-shielding wall includes second portion whose distance from the semiconductor layer is larger than distance between the upper surface and the principal surface. Thickness of the first portion in direction perpendicular to the principal surface is larger than thickness of the second portion in direction parallel to the principal surface.

Abstract: To provide an antireflection member which not only has a low reflectance, but also is enhanced in scratch resistance, and an image display device comprising the antireflection member. An antireflection member 100 comprising a low refractive index layer 130 on a transparent substrate 110, in which the low refractive index layer 130 includes a binder resin and silica particles 132 and 134, a ratio of Si element attributed to the silica particles, obtained by analysis of a surface region of the low refractive index layer 130 by X-ray photoelectron spectroscopy, is 10.0 atomic percent or more and 18.0 atomic percent or less and a ratio of C element under the assumption that the ratio of Si element is defined to be 100 atomic percent is 180 atomic percent or more and 500 atomic percent or less.

Abstract: A transmission line (12) includes a multilayer substrate (20), a signal pattern line (30), a ground pattern conductor (50), and an intermediate ground pattern conductor (40) that is arranged between the signal pattern line (30) and the ground pattern conductor (50) and that is electrically connected to the ground pattern conductor (50). The signal pattern line (30) has a first connection point (30c) to which a signal conductor extending in a laminating direction of the multilayer substrate (20) is connected. A first cavity portion (41h) is formed in the intermediate ground pattern conductor (40) at a position overlapped with a first end portion (30a) of the signal pattern line (30) in a plan view of the multilayer substrate (20). A first end edge (41e) of the first cavity portion (41h) has a first overlapping portion (41a) overlapped with the signal pattern line (30).

Abstract: Photoelectric conversion apparatus includes semiconductor layer in which first photoelectric converters are arranged in light-receiving region and second photoelectric converters are arranged in light-shielded region, light-shielding wall arranged above the semiconductor layer and defining apertures respectively corresponding to the first photoelectric converters, and light-shielding film arranged above the semiconductor layer. The light-shielding film includes first portion extending along principal surface of the semiconductor layer to cover the second photoelectric converters. The first portion has lower surface and upper surface. The light-shielding wall includes second portion whose distance from the semiconductor layer is larger than distance between the upper surface and the principal surface. Thickness of the first portion in direction perpendicular to the principal surface is larger than thickness of the second portion in direction parallel to the principal surface.

Abstract: A photoelectric conversion apparatus includes a plurality of units each including a charge generation region disposed in a semiconductor layer. Each of a first unit and a second unit of the plurality of units includes a charge storage region configured to store charges transferred thereto from the charge generation region, a dielectric region located above the charge generation region and surrounded by an insulator layer, and a first light-shielding layer covering the charge storage region that is located between the insulator layer and the semiconductor layer, and the first light-shielding layer having an opening located above the charge generation region. The charge generation region of the first unit is able to receive light through the opening of the first light-shielding layer. The charge generation region of the second unit is covered with a second light-shielding layer.

Abstract: Photoelectric conversion apparatus includes semiconductor layer having photoelectric converters in light-receiving region and photoelectric converters in light-shielded region, light-shielding part arranged above the semiconductor layer in the light-receiving region to surround light paths of the photoelectric converters in the light-receiving region, and light-shielding film arranged above the semiconductor layer in the light-shielded region to cover the photoelectric converters in the light-shielded region. The light-shielding part includes lower and upper ends. The light-shielding film includes lower and upper surfaces. Distance between the upper end and the semiconductor layer is larger than that between the upper surface and the semiconductor layer. Distance between the lower end and the semiconductor layer is smaller than that between the upper surface and the semiconductor layer and is larger than that between the lower surface and the semiconductor layer.

Abstract: In an electric connector, a waterproof member having an internal waterproof portion and an external waterproof portion is provided in a main body portion. The internal waterproof portion and the external waterproof portion are integrated. Accordingly, the internal waterproof portion covers exposed portions of an upper contact and a lower contact and prevents water intrusion along the upper contact and the lower contact. In addition, the external waterproof portion prevents water intrusion between the electric connector and an inner wall of an accommodating space of an electronic device by surrounding the entire circumference of the main body portion. Since the internal waterproof portion and the external waterproof portion are integrated in this manner, both internal waterproofing and external waterproofing can be realized with the simple configuration of the single waterproof member in the electric connector.

Abstract: In an electrical connector, a connecting portion has a first resin holding a lower contact with respect to an intermediate ground plate and a second resin holding an upper contact with respect to the intermediate ground plate and separate from the first resin. Also provided is a third resin covering the first resin and the second resin and separate from the first resin and the second resin. When the electrical connector is manufactured, deflection can be suppressed based on division into a step of forming the first resin and a step of forming the second resin and by means of a mold suppressing deflection of the upper contact and the lower contact.

Abstract: The insertion loss of a multilayer substrate and an antenna element is reduced. A multilayer substrate according to an embodiment of the present disclosure includes a multilayer body, a wire conductor, and a first ground electrode. The multilayer body is formed by dielectric layers being layered. The wire conductor is formed in the multilayer body, and a radio frequency signal passes through the wire conductor. The first ground electrode is formed in or on the multilayer body and includes a first surface that faces the wire conductor. The first surface includes a first region and a second region. The surface roughness of the first region is lower than the surface roughness of the second region. The first region overlaps at least part of the wire conductor in plan view in a direction normal to the first ground electrode.

Abstract: A photoelectric conversion apparatus includes a plurality of units each including a charge generation region disposed in a semiconductor layer. Each of a first unit and a second unit of the plurality of units includes a charge storage region configured to store charges transferred thereto from the charge generation region, a dielectric region located above the charge generation region and surrounded by an insulator layer, and a first light-shielding layer covering the charge storage region that is located between the insulator layer and the semiconductor layer, and the first light-shielding layer having an opening located above the charge generation region. The charge generation region of the first unit is able to receive light through the opening of the first light-shielding layer. The charge generation region of the second unit is covered with a second light-shielding layer.

Abstract: In an electrical connector, a connecting portion has a first resin holding a lower contact with respect to an intermediate ground plate and a second resin holding an upper contact with respect to the intermediate ground plate and separate from the first resin. Also provided is a third resin covering the first resin and the second resin and separate from the first resin and the second resin. When the electrical connector is manufactured, deflection can be suppressed based on division into a step of forming the first resin and a step of forming the second resin and by means of a mold suppressing deflection of the upper contact and the lower contact.

Abstract: A photoelectric conversion apparatus includes a plurality of units each including a charge generation region disposed in a semiconductor layer. Each of a first unit and a second unit of the plurality of units includes a charge storage region configured to store charges transferred thereto from the charge generation region, a dielectric region located above the charge generation region and surrounded by an insulator layer, and a first light-shielding layer covering the charge storage region that is located between the insulator layer and the semiconductor layer, and the first light-shielding layer having an opening located above the charge generation region. The charge generation region of the first unit is able to receive light through the opening of the first light-shielding layer. The charge generation region of the second unit is covered with a second light-shielding layer.

Abstract: A transmission line (12) includes a multilayer substrate (20), a signal pattern line (30), a ground pattern conductor (50), and an intermediate ground pattern conductor (40) that is arranged between the signal pattern line (30) and the ground pattern conductor (50) and that is electrically connected to the ground pattern conductor (50). The signal pattern line (30) has a first connection point (30c) to which a signal conductor extending in a laminating direction of the multilayer substrate (20) is connected. A first cavity portion (41h) is formed in the intermediate ground pattern conductor (40) at a position overlapped with a first end portion (30a) of the signal pattern line (30) in a plan view of the multilayer substrate (20). A first end edge (41e) of the first cavity portion (41h) has a first overlapping portion (41a) overlapped with the signal pattern line (30).

Abstract: In an electric connector, a waterproof member having an internal waterproof portion and an external waterproof portion is provided in a main body portion. The internal waterproof portion and the external waterproof portion are integrated. Accordingly, the internal waterproof portion covers exposed portions of an upper contact and a lower contact and prevents water intrusion along the upper contact and the lower contact. In addition, the external waterproof portion prevents water intrusion between the electric connector and an inner wall of an accommodating space of an electronic device by surrounding the entire circumference of the main body portion. Since the internal waterproof portion and the external waterproof portion are integrated in this manner, both internal waterproofing and external waterproofing can be realized with the simple configuration of the single waterproof member in the electric connector.