Abstract: A coating treatment apparatus for applying a coating solution to a peripheral portion of a substrate, includes: a holding and rotating part holding and rotating the substrate; a coating solution supply nozzle supplying the coating solution to the peripheral portion of the substrate; a moving mechanism moving the coating solution supply nozzle; and a controller controlling the holding and rotating part, coating solution supply nozzle, and moving mechanism, wherein the controller performs control of, while rotating the holding and rotating part: by controlling the moving mechanism while supplying the coating solution by the coating solution supply nozzle, both moving the coating solution supply nozzle from an outside of a perimeter of the substrate to a predetermined position at a periphery on the substrate at a first speed and then moving the coating solution supply nozzle from the predetermined position to the outside of the perimeter at a higher second speed.

Abstract: A substrate processing apparatus for forming a coating film on a peripheral edge portion including a peripheral edge of a front surface and a side surface of a substrate, includes: a substrate holder for rotatably holding the substrate; a first chemical liquid supplier for supplying a first chemical liquid onto the peripheral edge including a rear surface of the substrate; a partial removing part for removing the first chemical liquid adhering to at least a portion of the front and side surfaces; a second chemical liquid supplier for supplying a second chemical liquid for forming the coating film onto the front and side surfaces; a first chemical liquid removing part for removing the first chemical liquid remaining on the substrate to which the second chemical liquid adheres; and a controller for controlling the parts described above.

Abstract: A substrate processing apparatus for forming a coating film on a peripheral edge portion including a peripheral edge of a front surface and a side surface of a substrate, includes: a substrate holder for rotatably holding the substrate; a first chemical liquid supplier for supplying a first chemical liquid onto the peripheral edge including a rear surface of the substrate; a partial removing part for removing the first chemical liquid adhering to at least a portion of the front and side surfaces; a second chemical liquid supplier for supplying a second chemical liquid for forming the coating film onto the front and side surfaces; a first chemical liquid removing part for removing the first chemical liquid remaining on the substrate to which the second chemical liquid adheres; and a controller for controlling the parts described above.

Abstract: A structure forming method according to an aspect is a structure forming method for forming a first hole and a second hole having width smaller than width of the first hole in a substrate with dry etching and forming a structure. The structure forming method includes forming an etching mask on the substrate, etching a portion of the etching mask overlapping a first hole forming region where the first hole is formed, etching a portion of the etching mask overlapping a second hole forming region where the second hole is formed, and performing the dry etching of the substrate using the etching mask as a mask.

Abstract: A coating film forming method includes: rotating a substrate at a first rotation speed in a coating cup with an upper surface open, and supplying and diffusing a coating solution for forming a coating film on the substrate; and after the supplying and diffusing the coating solution, drying the substrate by exhausting air through a gap between an annular member arranged above the substrate with centers thereof being located on a same axis and the front surface of the substrate, while rotating the substrate at a second rotation speed lower than the first rotation speed, wherein at the drying the substrate, a flow velocity of the air exhausted through the gap is higher than a flow velocity of air supplied from above the substrate in the coating cup to the substrate.

Abstract: A substrate processing apparatus for forming a coating film on a peripheral edge portion including a peripheral edge of a front surface and a side surface of a substrate, includes: a substrate holder for rotatably holding the substrate; a first chemical liquid supplier for supplying a first chemical liquid onto the peripheral edge including a rear surface of the substrate; a partial removing part for removing the first chemical liquid adhering to at least a portion of the front and side surfaces; a second chemical liquid supplier for supplying a second chemical liquid for forming the coating film onto the front and side surfaces; a first chemical liquid removing part for removing the first chemical liquid remaining on the substrate to which the second chemical liquid adheres; and a controller for controlling the parts described above.

Abstract: A method for coating a top of a substrate with a coating solution includes supplying, before a solution film of the coating solution formed on the substrate dries, a solvent for the coating solution to a peripheral portion on the solution film of the coating solution on the substrate while rotating the substrate at a predetermined rotation speed to form a mixed layer of the coating solution and the solvent at the peripheral portion. The method includes, then, controlling a film thickness of the coating solution after drying by rotating the substrate at a rotation speed higher than the predetermined rotation speed to push the mixed layer to an outer peripheral side.

Abstract: A physical quantity sensor includes a substrate, an element portion disposed so as to overlap the substrate, a conductor pattern disposed on the substrate so as to face the element portion, and a protection film covering at least a part of an exposed portion of the conductor pattern exposed from element portion in a plan view from a direction in which the substrate and the element portion overlap.

Abstract: A structure forming method according to an aspect is a structure forming method for forming a first hole and a second hole having width smaller than width of the first hole in a substrate with dry etching and forming a structure. The structure forming method includes forming an etching mask on the substrate, etching a portion of the etching mask overlapping a first hole forming region where the first hole is formed, etching a portion of the etching mask overlapping a second hole forming region where the second hole is formed, and performing the dry etching of the substrate using the etching mask as a mask.

Abstract: A coating film forming method includes: rotating a substrate at a first rotation speed in a coating cup with an upper surface open, and supplying and diffusing a coating solution for forming a coating film on the substrate; and after the supplying and diffusing the coating solution, drying the substrate by exhausting air through a gap between an annular member arranged above the substrate with centers thereof being located on a same axis and the front surface of the substrate, while rotating the substrate at a second rotation speed lower than the first rotation speed, wherein at the drying the substrate, a flow velocity of the air exhausted through the gap is higher than a flow velocity of air supplied from above the substrate in the coating cup to the substrate.

Abstract: A method for coating a top of a substrate with a coating solution, the method includes: supplying, before a solution film of the coating solution formed on the substrate dries, a solvent for the coating solution to a peripheral portion on the solution film of the coating solution on the substrate while rotating the substrate at a predetermined rotation speed to form a mixed layer of the coating solution and the solvent at the peripheral portion; and then, controlling a film thickness of the coating solution after drying by rotating the substrate at a rotation speed higher than the predetermined rotation speed to push the mixed layer to an outer peripheral side.

Abstract: Provided is a development processing apparatus including a rotary holding unit configured to hold and rotate a wafer, a developer supply unit including a nozzle having a liquid contact surface facing a surface of the wafer and an ejection port opening to the liquid contact surface, and a controller. The controller is configured to: while the wafer rotates, execute a control of causing a developer to be ejected from the ejection port and moving the nozzle from an circumference side to a rotation center side of the wafer; after execution of the control, execute a control of moving the nozzle from the rotation center side to the outer circumference side of the wafer; and during execution of the control, execute a control of gradually reducing the rotation speed of the wafer as the center of the liquid contact surface approaches the outer circumference.

Abstract: Provided is a development processing apparatus including a rotary holding unit configured to hold and rotate a wafer, a developer supply unit including a nozzle having a liquid contact surface facing a surface of the wafer and an ejection port opening to the liquid contact surface, and a controller. The controller is configured to: while the wafer rotates, execute a control of causing a developer to be ejected from the ejection port and moving the nozzle from an circumference side to a rotation center side of the wafer; after execution of the control, execute a control of moving the nozzle from the rotation center side to the outer circumference side of the wafer; and during execution of the control, execute a control of gradually reducing the rotation speed of the wafer as the center of the liquid contact surface approaches the outer circumference.

Abstract: A physical quantity sensor includes a substrate, an element portion disposed so as to overlap the substrate, a conductor pattern disposed on the substrate so as to face the element portion, and a protection film covering at least a part of an exposed portion of the conductor pattern exposed from element portion in a plan view from a direction in which the substrate and the element portion overlap.

Abstract: A MEMS structure includes: a substrate; a lower electrode disposed on the substrate; an upper electrode including a movable portion disposed facing and spaced from the lower electrode; and a reinforcing portion disposed in the upper electrode so as to extend along an extending direction of the movable portion, the reinforcing portion being composed of a material having a higher Young's modulus than the upper electrode.

Abstract: A MEMS structure includes: a substrate; a lower electrode disposed above the substrate; an upper electrode including a movable portion disposed facing and spaced from the lower electrode; and a projection projecting from a surface of the movable portion on a side facing the lower electrode, the projection being composed of a material different from that of the movable portion.

Abstract: A sensor includes a flexible wafer substrate and an oscillator provided on a principal surface of the wafer substrate, and the oscillator deforms when an external force is applied to the wafer substrate.

Abstract: An MEMS vibrator includes a substrate, a fixation section disposed above a principal surface of the substrate, a support section extending from the fixation section, and a vibrating body (an upper electrode) separated from the substrate and supported by the support section in a node part of a vibration, and the vibrating body is a 2n-fold rotationally symmetric body having 2n beams radially extending from a node part of a vibration, wherein n is a natural number.

Abstract: A MEMS vibrator includes a substrate, a lower electrode provided on a main surface of the substrate, a fixed portion provided on the main surface, and an upper electrode which is separated from the substrate and is supported by the fixed portion. The upper electrode is a vibrating body having a region overlapping the lower electrode when the substrate is seen in plan view, and includes a weight portion in a region provided with an antinode portion of vibration of the upper electrode as the vibrating body.

Abstract: An electronic device according to the invention includes: a substrate; an MEMS structure formed above the substrate; and a covering structure defining a cavity in which the MEMS structure is arranged, wherein the covering structure has a first covering layer covering from above the cavity and having a through-hole in communication with the cavity and a second covering layer formed above the first covering layer and closing the through-hole, the first covering layer has a first region located above at least the MEMS structure and a second region located around the first region, the first covering layer is thinner in the first region than in the second region, and a distance between the substrate and the first covering layer in the first region is longer than a distance between the substrate and the first covering layer in the second region.