Abstract: A vibrator device includes a package including a base that is a semiconductor substrate and a lid that is a semiconductor substrate and has a housing section, a vibrator element and a passive element housed in the housing section and placed at the base, an oscillation circuit placed at the base and electrically coupled to the vibrator element, and a mounting terminal placed at the package and electrically coupled to the passive element, and at least one of the base and the lid is coupled to fixed potential.

Abstract: A resonator device includes: a resonator; an integrated circuit device configured to oscillate the resonator and to generate an oscillation signal; a container accommodating the resonator and the integrated circuit device; and a metal bump bonded to the integrated circuit device and electrically coupling the integrated circuit device and the container. The integrated circuit device includes a pad bonded to the metal bump, and a circuit disposed at a position overlapping the metal bump in a plan view of the pad, and W1/W2?1.08, where W1 represents a width of the pad, and W2 represents a width of the metal bump.

Abstract: An oscillator includes a package having a plurality of external terminals disposed on a mounting surface, a circuit element housed in the package, and a resonator which is housed in the package, and is electrically coupled to the circuit element, wherein the circuit element is electrically coupled to the package with a plurality of pads each of which is bonded to the package via a bump member, the circuit element overlaps at least one of the external terminals in a plan view, and each of the bump members is bonded to the package at a position where at least a part of the bump member does not overlap the plurality of external terminals in the plan view.

Abstract: An oscillator includes a package having a plurality of external terminals disposed on a mounting surface, a circuit element housed in the package, and a resonator which is housed in the package, and is electrically coupled to the circuit element, wherein the circuit element is electrically coupled to the package with a plurality of pads each of which is bonded to the package via a bump member, the circuit element has a rectangular shape in a plan view, and at least three of closest ones to four corners of the circuit element out of the bump members are bonded to the package at respective positions overlapping the plurality of external terminals in the plan view.

Abstract: An integrated circuit apparatus includes an oscillation circuit that generates an oscillation signal by using a resonator, an output buffer circuit that outputs a clock signal based on the oscillation signal, a DC voltage generation circuit that generates a DC voltage used to generate the oscillation signal or the clock signal, a power source pad to which a power source voltage is supplied, a ground pad to which a ground voltage is supplied, and a clock pad via which the clock signal is outputted. The ground pad and the DC voltage generation circuit are disposed so as to overlap with each other in the plan view.

Abstract: In the oscillator, a quartz crystal resonator and an oscillation circuit formed in an IC incorporating an inductor are electrically coupled to each other with a resonator interconnection disposed on a surface of a substrate to form an oscillation loop. A conductor layer disposed as an intermediate layer of the substrate is disposed so as to overlap the resonator interconnection and not to overlap the inductor incorporated in the IC in a plan view.

Abstract: An integrated circuit apparatus includes an oscillation circuit that generates an oscillation signal by using a resonator, an output buffer circuit that outputs a clock signal based on the oscillation signal, a DC voltage generation circuit that generates a DC voltage used to generate the oscillation signal or the clock signal, a power source pad to which a power source voltage is supplied, a ground pad to which a ground voltage is supplied, and a clock pad via which the clock signal is outputted. The ground pad and the DC voltage generation circuit are disposed so as to overlap with each other in the plan view.

Abstract: An oscillator includes a package having a plurality of external terminals disposed on a mounting surface, a circuit element housed in the package, and a resonator which is housed in the package, and is electrically coupled to the circuit element, wherein the circuit element is electrically coupled to the package with a plurality of pads each of which is bonded to the package via a bump member, the circuit element overlaps at least one of the external terminals in a plan view, and each of the bump members is bonded to the package at a position where at least a part of the bump member does not overlap the plurality of external terminals in the plan view.

Abstract: An oscillator includes a package having a plurality of external terminals disposed on a mounting surface, a circuit element housed in the package, and a resonator which is housed in the package, and is electrically coupled to the circuit element, wherein the circuit element is electrically coupled to the package with a plurality of pads each of which is bonded to the package via a bump member, the circuit element has a rectangular shape in a plan view, and at least three of closest ones to four corners of the circuit element out of the bump members are bonded to the package at respective positions overlapping the plurality of external terminals in the plan view.

Abstract: A vibrator device includes a package including a base that is a semiconductor substrate and a lid that is a semiconductor substrate and has a housing section, a vibrator element and a passive element housed in the housing section and placed at the base, an oscillation circuit placed at the base and electrically coupled to the vibrator element, and a circuit that is placed at the base or the lid, is electrically coupled to the passive element, and operates based on an oscillation signal from the oscillation circuit.

Abstract: A vibrator device includes a package including a base that is a semiconductor substrate and a lid that is a semiconductor substrate and has a housing section, a vibrator element and a passive element housed in the housing section and placed at the base, an oscillation circuit placed at the base and electrically coupled to the vibrator element, and a mounting terminal placed at the package and electrically coupled to the passive element, and at least one of the base and the lid is coupled to fixed potential.

Abstract: In the oscillator, a quartz crystal resonator and an oscillation circuit formed in an IC incorporating an inductor are electrically coupled to each other with a resonator interconnection disposed on a surface of a substrate to form an oscillation loop. A conductor layer disposed as an intermediate layer of the substrate is disposed so as to overlap the resonator interconnection and not to overlap the inductor incorporated in the IC in a plan view.

Abstract: An oscillator includes a resonator and an integrated circuit element. The resonator includes a resonator element and a resonator element container accommodating the resonator element. The integrated circuit element includes an inductor. The resonator and the integrated circuit element are stacked on each other. The resonator includes a metal member, and the metal member does not overlap the inductor when viewed in a plan view.

Abstract: An oscillator includes a resonator and an integrated circuit element. The resonator includes a resonator element and a resonator element container accommodating the resonator element. The integrated circuit element includes an inductor. The resonator and the integrated circuit element are stacked on each other. The resonator includes a metal member, and the metal member does not overlap the inductor when viewed in a plan view.

Abstract: In order to reduce crosstalk between analog and digital signals, a circuit device includes a vibrator element, a semiconductor device, and a package. In the semiconductor device, an analog pad is provided along a first side facing in a first direction when the semiconductor device is seen in plan view. In addition, a digital pad is provided along aside facing in a second direction opposite to the first direction, that is, a second side facing the first side. In the package, an analog terminal which is connected to the analog pad is provided on a first side of the package facing in the first direction. In addition, a digital terminal which is connected to the digital pad is provided on a second side of the package facing in the second direction.

Abstract: In order to achieve a circuit device capable of stably supplying an antenna with electric power in a broad power range to output a transmission signal, the circuit device includes a current source adapted to supply a first current in a first operation mode, and supply a second current higher than the first current in a second operation mode, and a drive section supplied with the electric power from the current source, and adapted to perform drive for outputting a transmission signal to an antenna via a matching circuit.

Abstract: In order to achieve a circuit device capable of stably supplying an antenna with electric power in a broad power range to output a transmission signal, the circuit device includes a current source adapted to supply a first current in a first operation mode, and supply a second current higher than the first current in a second operation mode, and a drive section supplied with the electric power from the current source, and adapted to perform drive for outputting a transmission signal to an antenna via a matching circuit.

Abstract: In order to reduce crosstalk between analog and digital signals, a circuit device includes a vibrator element, a semiconductor device, and a package. In the semiconductor device, an analog pad is provided along a first side facing in a first direction when the semiconductor device is seen in plan view. In addition, a digital pad is provided along aside facing in a second direction opposite to the first direction, that is, a second side facing the first side. In the package, an analog terminal which is connected to the analog pad is provided on a first side of the package facing in the first direction. In addition, a digital terminal which is connected to the digital pad is provided on a second side of the package facing in the second direction.

Abstract: An integrated circuit device includes a common transceiver macrocell including a circuit necessary for host operation and a circuit necessary for device operation. The common transceiver macrocell includes an analog front-end circuit and a high-speed logic circuit. The high-speed logic circuit includes a parallel/serial conversion circuit, a first parallel interface which serves as an interface between an external circuit and the parallel/serial conversion circuit, a sampling clock generation circuit, a serial/parallel conversion circuit, and a second parallel interface which serves as an interface between the serial/parallel conversion circuit and the external circuit.

Abstract: A host controller includes a disconnection detection circuit 52 which compares a voltage level of a first differential signal DP of first and second differential signals DP and DM making up a differential signal pair corresponding to a given range in a frame packet with a comparison voltage CV, compares a voltage level of the second differential signal DM corresponding to a given range in the frame packet with the comparison voltage CV, and detects that a host and a device have been disconnected when the voltage level of at least one of the first and second differential signals DP and DM corresponding to the given range is higher than the comparison voltage CV.