Abstract: A package structure includes: a substrate includes a first surface; a semiconductor chip disposed on the first surface; a support disposed on the first surface and surrounding the semiconductor chip comprises an electrical conducting member and penetrating the support; and an optical component disposed on the support and electrically connected to the substrate by the electrical conducting member.

Abstract: Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.

Abstract: The present invention is directed to an obstacle avoidance system for an unmanned vehicle, comprising: an obstacle sensing module provided at a vehicle body; a vehicle-mounted computer provided at the vehicle body and electrically connected to the obstacle sensing module; a control module provided at the vehicle body and electrically connected to the vehicle-mounted computer; and a power source provided at the vehicle body and electrically connected to the obstacle sensing module, the vehicle-mounted computer and the control module.

Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: In an embodiment, a device includes: a semiconductor device; and a redistribution structure including: a first dielectric layer; a first grounding feature on the first dielectric layer; a second grounding feature on the first dielectric layer; a first pair of transmission lines on the first dielectric layer, the first pair of transmission lines being laterally disposed between the first grounding feature and the second grounding feature, the first pair of transmission lines being electrically coupled to the semiconductor device; a second dielectric layer on the first grounding feature, the second grounding feature, and the first pair of transmission lines; and a third grounding feature extending laterally along and through the second dielectric layer, the third grounding feature being physically and electrically coupled to the first grounding feature and the second grounding feature, where the first pair of transmission lines extend continuously along a length of the third grounding feature.

Abstract: A dual-band antenna module includes a first antenna structure and a second antenna structure. The first antenna structure includes a first insulating substrate, a conductive metal layer, a plurality of grounding supports, and a first feeding pin. The second antenna structure includes a second insulating substrate, a top metal layer, a bottom metal layer, and a second feeding pin. The conductive metal layer is disposed on the first insulating substrate. The grounding supports are configured for supporting the first insulating substrate. The second insulating substrate is disposed above the first insulating substrate. The top metal layer and the bottom metal layer are respectively disposed on a top side and a bottom side of the second insulating substrate. The first frequency band signal transmitted or received by the first antenna structure is smaller than the second frequency band signal transmitted or received by the second antenna structure.

Abstract: A method for forming a DRAM includes forming a bit line contact over the active area, forming a bit line over the bit line contact, and forming a hard mask layer over the bit line. The method includes forming a semiconductor material layer over the active area and forming a metal layer over the semiconductor material layer and the hard mask layer. The method includes removing the metal layer over the hard mask layer and exposing the top surface of the hard mask layer, and the remaining portion of the metal layer is between hard mask layers. The method includes removing a portion of the hard mask layer after exposing a portion of the hard mask layer. The method includes forming a capacitor contact conductive layer over the remaining portion of the metal layer after removing the portion of the hard mask layer.

Abstract: Method and circuit for adaptive column-select line signal generation for a memory device are provided. The method comprises the following steps. A first signal is generated in response to a memory access command. A second signal is generated according to a candidate signal selected from a plurality of candidate signals including a first candidate signal and a second candidate signal, wherein after the first signal is asserted, the first candidate signal is asserted when a configurable time interval with respect to a parameter from a register set elapses and the second candidate signal is asserted when a specified time interval elapses, and the selected candidate signal is asserted before a remaining part of the candidate signals after the first signal is asserted. A column-select line signal is generated according to the first signal and the second signal.

Abstract: A graphene heating chip includes a substrate, an insulating layer, a graphene film, and a plurality of electrodes. The substrate has two opposite a first surface and a second surface, and the substrate defines a through hole. The insulating layer is suspended on the substrate. The insulating layer covering the through hole and not in direct contact with the first surface is defined as a window, and a plurality of grooves are formed on the window. The graphene film covers the window, and the graphene film includes a first graphene film portion and a second graphene film portion, and the first graphene film portion and the second graphene film portion are spaced apart from each other. The plurality of electrodes are located on the surface of the insulating layer away from the substrate. The present application also provides a method for making the graphene heating chip.

Abstract: A semiconductor device and a method of manufacture are provided. In particular, a semiconductor device using blocks, e.g., discrete connection blocks, having through vias and/or integrated passive devices formed therein are provided. Embodiments such as those disclosed herein may be utilized in PoP applications. In an embodiment, the semiconductor device includes a die and a connection block encased in a molding compound. Interconnection layers may be formed on surfaces of the die, the connection block and the molding compound. One or more dies and/or packages may be attached to the interconnection layers.

Abstract: A graphene heating chip includes a substrate, an insulating layer, a graphene film, and a plurality of electrodes. The substrate has two opposite a first surface and a second surface, and the substrate defines a through hole. The insulating layer is suspended on the substrate. The insulating layer covering the through hole and not in direct contact with the first surface is defined as a window, and a plurality of grooves are formed on the window. The graphene film covers the window, and the graphene film includes a first graphene film portion and a second graphene film portion, and the first graphene film portion and the second graphene film portion are spaced apart from each other. The plurality of electrodes are located on the surface of the insulating layer away from the substrate. The present application also provides a method for calibrating a temperature of the graphene heating chip.

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a conduit having an inlet to be coupled to a gas source, and a dispenser coupled to the conduit and having a convergent-divergent nozzle suspended over the platen to direct gas from the gas source onto the polishing surface of the polishing pad.

Abstract: In an embodiment, a current sensor unit includes: a rectification module, to convert an AC current to a pulsed DC current; a conversion module containing an energy storage element, to store energy based upon the pulsed DC current during a charging mode and generate a power supply current; a switching module, bypassed by the conversion module during the charging mode, and bypassing the conversion module during an energy release mode; a current sensor module, to detect a pulsed DC current; a control module, to acquire electrical energy from the power supply current, determine operation in the charging mode or energy release mode, and acquire a first detection value provided by the current sensor module; and a self-calibration module, to generate a current flowing through the current sensor module in a self-calibration process, the control module calibrating the first detection value based upon a second detection value of the current generated.

Abstract: A power supply is provided. The power supply includes a case, an electrical connector and a LED. The case includes a first side wall including an extension part. The extension part is extended from the first side wall toward a second side wall and has an aperture. Portion of the electrical connector is disposed in an accommodation space through an opening and includes a first base and a contacting ring. The first base is disposed in the accommodation space. The contacting ring is disposed on an exterior of the accommodation space. The LED is disposed in the aperture and includes a second base and a lens disposed on the second base. The second base and the contacting ring are located on different surfaces. The lens and portion of the second base are exposed from the opening. The other portion of the second base is covered by the contacting ring.

Abstract: Provided is a work machine capable of achieving both low fuel consumption and ensuring of workability. The work machine is configured to, in a state where an output of an engine or hydraulic pump has increased to an increase threshold (S12: Yes) with the rotational speed being at a first rotational speed (S11: Yes), raise the rotational speed from the first rotational speed to a second rotational speed (S13); in a process of raising the rotational speed to the second rotational speed, output, to a regulator, a signal instructing reduction in the discharge rate (S14) so as to keep the output of the engine or hydraulic pump constant; and after the rotational speed has reached the second rotational speed, output, to the regulator, a signal instructing increase in the discharge rate (S16) so as to make the output of the engine or hydraulic pump have a value corresponding to a request load.

Abstract: A method of making photolithography mask plate is provided. The method includes: providing a carbon nanotube composite structure, wherein the carbon nanotube composite structure comprises a carbon nanotube layer and a chrome layer coated on the carbon nanotube layer; locating the carbon nanotube composite structure on a substrate to expose partial surfaces of the substrate; and depositing a cover layer on the carbon nanotube composite structure.

Abstract: A data management system comprises: an outsourcer terminal outsourcing a fabrication by an instruction document; an outsourcee terminal receiving outsourcing and/or sub-outsourcing; and a server device. The server device comprises: a data management unit managing a proprietary authority of data stored in a data storage unit; an order container storage unit storing an order container with which data stored in the data storage unit is correlated, for each order created in an order creation unit of the outsourcer terminal and/or the outsourcee terminal; and an order container management unit managing sharing of the order container, based on an instruction from an order container sharing authority management unit of the outsourcer terminal and/or the outsourcee terminal. The server device, for each order, correlates any format of data element stored with the order container, for management.

Abstract: A method of making photolithography mask plate is provided. The method includes: providing a carbon nanotube layer on a substrate; depositing a chrome layer on the carbon nanotube layer, wherein the chrome layer includes a first patterned chrome layer and a second patterned chrome layer, the first patterned chrome layer is located on the carbon nanotube layer, and the second patterned chrome layer is deposited on the substrate corresponding to holes of the carbon nanotube layer; transferring the carbon nanotube layer with the first patterned chrome layer thereon from the substrate to a base, and the carbon nanotube layer being in contact with the base; and depositing a cover layer on the first patterned chrome layer.

Abstract: A method for making a field effect transistor includes providing a graphene nanoribbon composite structure. The graphene nanoribbon composite structure includes a substrate and a plurality of graphene nanoribbons spaced apart from each other. The substrate includes a plurality of protrusions spaced apart from each other, and one of the plurality of graphene nanoribbons is on the substrate and between two adjacent protrusions. An interdigital electrode is placed on the graphene nanoribbon composite structure, and the interdigital electrode covers the plurality of protrusions and is electrically connected to the plurality of graphene nanoribbons.

Abstract: A thermoset precursor composition includes a backbone comprising an imine bond bonding at least one of: 1) aromatic compounds together, or 2) bonding an aromatic compound to an aliphatic chain, and at least one of: an epoxy group terminating the backbone or an aldehyde group terminating the backbone. The thermoset precursor can have at least two epoxy groups, one epoxy group and one aldehyde group, or two aldehyde groups.