Patents by Inventor Shou Yu
Shou Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9111928Abstract: A switch circuit package module includes a semiconductor switch unit and a capacitor unit. The semiconductor switch unit includes sub micro-switch elements. The capacitor unit is arranged at a periphery of the semiconductor switch unit or stacked on a surface of the semiconductor switch unit, such that impedances of commutation loops between the capacitor unit and the sub micro-switch elements are close to or the same with each other.Type: GrantFiled: February 6, 2013Date of Patent: August 18, 2015Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.Inventors: Zeng Li, Shou-Yu Hong, Jian-Hong Zeng
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Publication number: 20150228400Abstract: An electrical component is disclosed, the electrical component comprising: a magnetic body having a top surface, a bottom surface, wherein at least one first conductive through hole is formed from the top surface to bottom surface of the magnetic body; and a coil disposed in the magnetic body, wherein a first end of the coil is electrically connected to one of the at least one first conductive through hole.Type: ApplicationFiled: April 25, 2015Publication date: August 13, 2015Applicant: DELTA ELECTRONICS, INC.Inventors: Jian-Hong Zeng, Wei Yang, Shou-Yu Hong, Jian-Ping Ying
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Publication number: 20150180351Abstract: Disclosed herein is a power electronic circuit having a reference ground and a differential mode loop unit. The differential mode loop unit has a capacitance component, a switch and an electronic component, wherein the capacitance component has a first end, the switch has a first end connecting in series with the capacitance component, the electronic component has a first end, the electronic component connects in series with the capacitance component and the switch, the capacitance component and switch are packaged in a power module, the power module has a trace and at least one output pin connected to reference ground, wherein the first end of the switch or the first end of the electronic component is only connected to the first end of the capacitance component through the trace, and the first end of the capacitance component is connected to reference ground through the output pin.Type: ApplicationFiled: December 23, 2014Publication date: June 25, 2015Inventors: Zeng LI, Shou-Yu HONG, Jian-Hong ZENG, Yi-Cong XIE
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Patent number: 9030027Abstract: An assembled circuit is disclosed, wherein the assembled circuit comprises an inductor having a top surface, a bottom surface and side surfaces, wherein each of a plurality of conductors extends from the top surface to the bottom surface via one of the side surfaces of the inductor, wherein a circuit board is disposed over the top surface of the first electronic component and electrically connected to the plurality of conductors and a plurality of pins disposed on the bottom surface of the inductor for connecting to another circuit board.Type: GrantFiled: December 3, 2013Date of Patent: May 12, 2015Assignee: Delta Electronics, Inc.Inventors: Jian-Hong Zeng, Wei Yang, Shou-Yu Hong, Jian-Ping Ying
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Publication number: 20150085454Abstract: A power module is disclosed. The power module includes a first substrate, a first metal layer, at least one conductive structure and at least one power device. The first metal layer is disposed on the first substrate. The first metal layer has a first thickness d1. The first thickness d1 satisfies: 5 ?m?d1?50 ?m. The conductive structure is disposed at a position different to the first metal layer on the first substrate. The conductive structure has a second thickness d2. The second thickness d2 satisfies: d2?100 ?m. The power device is disposed on the first substrate, the first metal layer or the conductive structure. The driving electrode of the power device is electrically connected to the first metal layer. The power electrode of the power device is electrically coupled to the conductive structure.Type: ApplicationFiled: July 14, 2014Publication date: March 26, 2015Inventors: Shou-Yu HONG, Gan-Yu ZHOU, Jian-Hong ZENG, Zhen-Qing ZHAO
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Publication number: 20140117495Abstract: A switch circuit package module includes a semiconductor switch unit and a capacitor unit. The semiconductor switch unit includes sub micro-switch elements. The capacitor unit is arranged at a periphery of the semiconductor switch unit or stacked on a surface of the semiconductor switch unit, such that impedances of commutation loops between the capacitor unit and the sub micro-switch elements are close to or the same with each other.Type: ApplicationFiled: February 6, 2013Publication date: May 1, 2014Applicant: DELTA ELECTRONICS (SHANGHAI) CO., LTD.Inventors: Zeng LI, Shou-Yu HONG, Jian-Hong ZENG
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Publication number: 20140085848Abstract: An assembled circuit is disclosed, wherein the assembled circuit comprises an inductor having a top surface, a bottom surface and side surfaces, wherein each of a plurality of conductors extends from the top surface to the bottom surface via one of the side surfaces of the inductor, wherein a circuit board is disposed over the top surface of the first electronic component and electrically connected to the plurality of conductors and a plurality of pins disposed on the bottom surface of the inductor for connecting to another circuit board.Type: ApplicationFiled: December 3, 2013Publication date: March 27, 2014Applicant: DELTA ELECTRONICS, INC.Inventors: Jian-Hong Zeng, Wei Yang, Shou-Yu Hong, Jian-Ping Ying
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Patent number: 8624701Abstract: An assembled circuit comprising a substrate, a coil, a first conductive segment, a second conductive segment, a first through-hole connector and a second through-hole connector is disclosed. The first conductive segment is electrically connected to one end of the first through-hole connector, the other end of the first through-hole connector is electrically connected to one end of the second through-hole connector via the first conductive segment, and the other end of the second through-hole connector is electrically connected to the second conductive segment.Type: GrantFiled: September 4, 2012Date of Patent: January 7, 2014Assignee: Delta Electronics, Inc.Inventors: Jian-Hong Zeng, Wei Yang, Shou-Yu Hong, Jian-Ping Ying
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Patent number: 8593245Abstract: A coil assembly includes at least one insulated wire and an electromagnetic interference shielding layer. The insulated wire is wound into a winding coil part. The winding coil part includes a first wire-outlet segment, a second wire-outlet segment and a central through-hole. The electromagnetic interference shielding layer is formed on the winding coil part for shielding the insulated wire. The electromagnetic interference shielding layer has lateral projection profile on the winding coil part. The electromagnetic interference shielding layer has a radial gap such that the electromagnetic interference shielding layer is a non-conducting loop.Type: GrantFiled: May 26, 2010Date of Patent: November 26, 2013Assignee: Delta Electronics, Inc.Inventors: Jian-Hong Zeng, Shou-Yu Hong, Nan Ye, Wei Yang, Jian-Ping Ying
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Patent number: 8488316Abstract: A power module includes a first power chip and a second power chip, each of which has at least two electrodes. The power module is applied to a power converter having a power density higher than 15 W/inch3 and a maximum efficiency higher than 92%, or to a power converter having a power density higher than 20 W/inch3 or having a maximum efficiency higher than 93%. At least one of the power chips operates at a frequency higher than 25 kHz.Type: GrantFiled: March 29, 2011Date of Patent: July 16, 2013Assignee: Delta Electronics, Inc.Inventors: Jian-Hong Zeng, Shou-Yu Hong, Qi-Feng Ye, Xue-Tao Guo, Ai-Xing Tong
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Patent number: 8472196Abstract: A power module includes a first heat sink, first and second power chips, a thermo-conductive insulating layer, a lead frame and a molding compound. The first heat sink has a first area and a second area. The first power chip is disposed in the first area. The thermo-conductive insulating layer is disposed in the second area. The second power chip is disposed on the heat sink through the thermo-conductive insulating layer. The lead frame is electrically connected to at least one of the first and second power chips. The molding compound covers the first and second power chips, the thermo-conductive insulating layer and a portion of the lead frame. The first heat sink is electrically connected to at least one of the first and second power chips. Because the first power chip is not disposed on the first heat sink through the thermo-conductive insulating layer, the cost can be reduced.Type: GrantFiled: March 16, 2011Date of Patent: June 25, 2013Assignee: Delta Electronics, Inc.Inventors: Jian-Hong Zeng, Shou-Yu Hong, Qi-Feng Ye, Yi-Cheng Lin
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Patent number: 8426963Abstract: A power semiconductor package structure includes a carrier, a first power chip, a second power chip, a first conductive sheet, a second conductive sheet and a third conductive sheet. The first power chip has a first surface and a second surface opposing to the first surface. A first control electrode and a first main power electrode are disposed on the first surface, and a second main power electrode is disposed on the second surface. The second surface is disposed on the carrier, and electrically connected to the carrier through the second main power electrode. The second power chip has a third surface and a fourth surface opposing to the third surface. A third main power electrode is disposed on the third surface, and a fourth main power electrode is disposed on the fourth surface. The fourth surface is disposed on the first power chip. The first conductive sheet is electrically connected to the first main power electrode and the fourth main power electrode.Type: GrantFiled: April 11, 2011Date of Patent: April 23, 2013Assignee: Delta Electronics, Inc.Inventors: Jian-Hong Zeng, Shou-Yu Hong
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Publication number: 20120327625Abstract: An assembled circuit comprising a substrate, a coil, a first conductive segment, a second conductive segment, a first through-hole connector and a second through-hole connector is disclosed. The first conductive segment is electrically connected to one end of the first through-hole connector, the other end of the first through-hole connector is electrically connected to one end of the second through-hole connector via the first conductive segment, and the other end of the second through-hole connector is electrically connected to the second conductive segment.Type: ApplicationFiled: September 4, 2012Publication date: December 27, 2012Applicant: DELTA ELECTRONICS, INC.Inventors: Jian-Hong Zeng, Wei Yang, Shou-Yu Hong, Jian-Ping Ying
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Patent number: 8283789Abstract: An assembled circuit comprising an inductive component, a connecting conductor, and a first electronic component is disclosed. The connecting conductor is adapted to wrap a first surface of the inductive component. The first electronic component stacks on the inductive component. The assembled circuit is electrically connected to the carrier via the connecting conductor.Type: GrantFiled: January 2, 2009Date of Patent: October 9, 2012Assignee: Delta Electronics, Inc.Inventors: Jian-Hong Zeng, Wei Yang, Shou-Yu Hong, Jian-Ping Ying
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Publication number: 20120242329Abstract: A rotation spindle detection module includes a magnet retainer that retains at least one precision magnet and is mounted to a rotation spindle; at least one Hall device that detects the precision magnet and is arranged at a fixed position adjacent to the magnet retainer; a circuit board that is coupled to the Hall device and forms a circuit to receive a detection signal from the Hall device. As such, components that are used to detect a rotation spindle, including a Hall device, a precision magnet, and a circuit board, are integrated in a modularized fashion so as to achieve the purposes of easy mounting of the detection module to the rotation spindle.Type: ApplicationFiled: March 22, 2011Publication date: September 27, 2012Inventor: SHOU-YU CHU
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Publication number: 20120181706Abstract: A power semiconductor package structure includes a carrier, a first power chip, a second power chip, a first conductive sheet, a second conductive sheet and a third conductive sheet. The first power chip has a first surface and a second surface opposing to the first surface. A first control electrode and a first main power electrode are disposed on the first surface, and a second main power electrode is disposed on the second surface. The second surface is disposed on the carrier, and electrically connected to the carrier through the second main power electrode. The second power chip has a third surface and a fourth surface opposing to the third surface. A third main power electrode is disposed on the third surface, and a fourth main power electrode is disposed on the fourth surface. The fourth surface is disposed on the first power chip. The first conductive sheet is electrically connected to the first main power electrode and the fourth main power electrode.Type: ApplicationFiled: April 11, 2011Publication date: July 19, 2012Inventors: Jian-Hong ZENG, Shou-Yu Hong
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Publication number: 20120014069Abstract: A power module includes a first heat sink, first and second power chips, a thermo-conductive insulating layer, a lead frame and a molding compound. The first heat sink has a first area and a second area. The first power chip is disposed in the first area. The thermo-conductive insulating layer is disposed in the second area. The second power chip is disposed on the heat sink through the thermo-conductive insulating layer. The lead frame is electrically connected to at least one of the first and second power chips. The molding compound covers the first and second power chips, the thermo-conductive insulating layer and a portion of the lead frame. The first heat sink is electrically connected to at least one of the first and second power chips. Because the first power chip is not disposed on the first heat sink through the thermo-conductive insulating layer, the cost can be reduced.Type: ApplicationFiled: March 16, 2011Publication date: January 19, 2012Inventors: Jian-Hong Zeng, Shou-Yu Hong, Qi-Feng Ye, Yi-Cheng Lin
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Publication number: 20120014059Abstract: A power module includes a first power chip and a second power chip, each of which has at least two electrodes. The power module is applied to a power converter having a power density higher than 15 W/inch3 and a maximum efficiency higher than 92%, or to a power converter having a power density higher than 20 W/inch3 or having a maximum efficiency higher than 93%. At least one of the power chips operates at a frequency higher than 25 kHz.Type: ApplicationFiled: March 29, 2011Publication date: January 19, 2012Inventors: Jian-Hong ZENG, Shou-Yu Hong, Qi-Feng Ye, Xue-Tao Guo, Ai-Xing Tong
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Patent number: 8004531Abstract: Multiple graphics processor system and method embodiments are disclosed. One system embodiment, among others, comprises a multiple graphics processor system, comprising a first graphics processing unit having first status information and a second graphics processing unit having second status information, and first key logic corresponding to the first graphics processing unit, the first key logic configured to compare the first and second status information and communicate to the first graphics processing unit a key corresponding to the lowest completed stage of processing among the first and second graphics processing units.Type: GrantFiled: October 13, 2006Date of Patent: August 23, 2011Assignee: Via Technologies, Inc.Inventors: Wen-Chung Chen, Li Liang, Shou-Yu Joyce Cheng, Dehai (Roy) Kong, Mitch Singer
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Publication number: 20100301981Abstract: A coil assembly includes at least one insulated wire and an electromagnetic interference shielding layer. The insulated wire is wound into a winding coil part. The winding coil part includes a first wire-outlet segment, a second wire-outlet segment and a central through-hole. The electromagnetic interference shielding layer is formed on the winding coil part for shielding the insulated wire. The electromagnetic interference shielding layer has lateral projection profile on the winding coil part. The electromagnetic interference shielding layer has a radial gap such that the electromagnetic interference shielding layer is a non-conducting loop.Type: ApplicationFiled: May 26, 2010Publication date: December 2, 2010Applicant: DELTA ELECTRONICS, INC.Inventors: Jian-Hong Zeng, Shou-Yu Hong, Nan Ye, Wei Yang, Jian-Ping Ying