Abstract: The present invention relates to a method for fermenting fish skin by using Aspergillus. Also provided is a use of the fermentation liquid obtained by fermenting fish skin with Aspergillus obtained from the method in inhibiting the activity of tyrosinase, inhibiting the activity of angiotensin-converting enzyme and/or improving the survival of fibroblasts.

Abstract: An organic-inorganic hybrid resin, a molding composition, and a photoelectric device employing the same are disclosed. The organic-inorganic hybrid resin is a reaction product of a composition, wherein the composition includes: 0.1-10 parts by weight of reactant (a), and 100 parts by weight of reactant (b). In particular, the reactant (a) is a silsesquioxane prepolymer with metal oxide clusters, and the metal oxide cluster includes Ti, Zr, Zn, or a combination thereof. The reactant (b) includes an epoxy resin.

Abstract: The present invention relates to a method for fermenting fish skin by using Aspergillus. Also provided is a use of the fermentation liquid obtained by fermenting fish skin with Aspergillus obtained from the method in inhibiting the activity of tyrosinase, inhibiting the activity of angiotensin-converting enzyme and/or improving the survival of fibroblasts.

Abstract: The invention provides a method for forming a fermented composition of mung bean hulls, including: mixing mung bean hulls and water to form a mixture; adding a fungus into the mixture, wherein the fungus includes Rhizopus spp. or Aspergillus spp.; and fermenting the mixture to form a fermented composition. The invention also includes a fermented composition of mung bean hulls by the method and an anti-oxidation and anti-inflammation composition containing the fermented composition of mung bean hulls.

Abstract: In one embodiment, an organic-inorganic metal oxide hybrid resin having the following formula: wherein each R1 is independently a substituted or non-substituted C1 to C10 alkyl group; each R2 is independently a substituted or non-substituted C1 to C10 alkyl group or benzyl group; n is a positive integer from 3 to 30; and each Y is independently (MO4/2)l[(MO)(4-a)/2M(OH)a/2]m[MO(4-b)/2M(OZ)b/2]p, wherein M is a metal; l is a positive integer from 10 to 90; m is a positive integer from 2 to 20; p is a positive integer from 4 to 15; a is a positive integer from 1 to 2; b is a positive integer from 1 to 2; and Z is an organosilane group.

Abstract: In one embodiment, an organic-inorganic metal oxide hybrid resin having the following formula: wherein each R1 is independently a substituted or non-substituted C1 to C10 alkyl group; each R2 is independently a substituted or non-substituted C1 to C10 alkyl group or benzyl group; n is a positive integer from 3 to 30; and each Y is independently (MO4/2)l[(MO)(4-a)/2M(OH)a/2]m[MO(4-b)/2M(OZ)b/2]p, wherein M is a metal; l is a positive integer from 10 to 90; m is a positive integer from 2 to 20; p is a positive integer from 4 to 15; a is a positive integer from 1 to 2; b is a positive integer from 1 to 2; and Z is an organosilane group.

Abstract: A connecting structure of a flat fuel cell assembly. The assembly includes a plurality of fuel cells, each of which has a membrane electrode assembly with an anode, a proton exchange membrane and a cathode combined. Two conductive nets are attached to the surfaces of the anode and the cathode of each membrane electrode assembly by thermosetting adhesive and heat pressing to collect and transmit electrons.

Abstract: A transparent silicone epoxy composition is provided. The transparent silicone epoxy composition comprises (a) at least an epoxy modified siloxane, (b) at least a silanol-containing siloxane and (c) a catalyst. Each epoxy modified siloxane molecule comprises at least two cycloaliphatic epoxy groups and epoxy modified siloxane in the transparent silicone epoxy composition is about 10˜89 weight percentage. Silanol-containing siloxane can be cross-linked with epoxy modified siloxane. Silanol-containing siloxane comprises at least two hydroxyl groups. Silanol-containing siloxane in the transparent silicone epoxy composition is about 89˜10 weight percentage. The catalyst in the transparent silicone epoxy composition is about 0.01˜1 weight percentage.

Abstract: A transparent silicone epoxy composition is provided. The transparent silicone epoxy composition comprises (a) at least an epoxy modified siloxane, (b) at least a silanol-containing siloxane and (c) a catalyst. Each epoxy modified siloxane molecule comprises at least two cycloaliphatic epoxy groups and epoxy modified siloxane in the transparent silicone epoxy composition is about 10˜89 weight percentage. Silanol-containing siloxane can be cross-linked with epoxy modified siloxane. Silanol-containing siloxane comprises at least two hydroxyl groups. Silanol-containing siloxane in the transparent silicone epoxy composition is about 89˜10 weight percentage. The catalyst in the transparent silicone epoxy composition is about 0.01˜1 weight percentage.

Abstract: The present invention relates to a method for fermenting fish skin by using Aspergillus. Also provided is a use of the fermentation product obtained from the method in inhibiting the activity of tyrosinase, inhibiting the activity of angiotensin-converting enzyme and/or improving the survival of fibroblasts.

Abstract: The invention provides a method for forming a fermented composition of mung bean hulls, including: mixing mung bean hulls and water to form a mixture; adding a fungus into the mixture, wherein the fungus includes Rhizopus spp. or Aspergillus spp.; and fermenting the mixture to form a fermented composition. The invention also includes a fermented composition of mung bean hulls by the method and an anti-oxidation and anti-inflammation composition containing the fermented composition of mung bean hulls.

Abstract: A partition assembly includes a plurality of parallel arranged upright posts, a plurality of transverse support posts, a plurality of first connecting plates, a plurality of second connecting plates, and a plurality of panels. Thus, the limit slot of each of the panels is hooked on the locking hook of the respective support post so that each of the panels is mounted on the respective support post easily and quickly without needing any screw member, thereby facilitating a user mounting the panels.

Abstract: A chip package structure and a process for fabricating the same is disclosed. The chip package structure mainly comprises a carrier, a chip and an encapsulating material layer. To fabricate the chip package, a carrier and a plurality of chips are provided. Each chip has at least an active surface with a plurality of bumps thereon. The chips and the carrier are electrically connected. An encapsulating material layer that fills the bonding gap between the chips and the carriers and covers the chips and carrier is formed. The encapsulating material layer between the chips and the carrier has a first thickness and the encapsulating material layer over the chips has a second thickness. The second thickness has a value between half to twice the first thickness.

Abstract: A process for fabricating a chip package structure is disclosed. To fabricate the chip package structure, a carrier and a plurality of chips are provided. Each chip has an active surface and at least one of the active surfaces has a plurality of bumps thereon. The chips and the carrier are electrically connected together. Thereafter, a heat sink is attached to the back of the chips and then at least one heat-resistant buffering film is formed over part of the heat sink surface. An encapsulating material layer is formed over the carrier and filling bonding gaps between the chips and the carrier. The encapsulating material within the bonding gaps has a thickness. The maximum diameter of particles constituting the encapsulating material layer is less than half of the said thickness.

Abstract: A method and program is disclosed for generating work in progress (WIP) schedules in semiconductor manufacturing facility. After determining starting and ending dates of predetermined schedule periods for generating WIP schedules, remaining days are determined for completing at least one wafer lot associated with predetermined product from the starting date. A starting process stage for the wafer lot is determined at the starting date based on the remaining days, and an ending process stage for the wafer lot at the end of the ending date. Wafer numbers are assigned to each process stage of schedule times in proportion to process times of each stage in view of total process time for the schedule period, and by repeating the above steps for one or more other wafer lots under production, a total wafer number assigned to each stage is determined and the WIP schedule for the schedule period is obtained.

Abstract: A chip package structure and a process for fabricating the same is disclosed. The chip package structure mainly comprises a carrier, a chip and an encapsulating material layer. To fabricate the chip package, a carrier and a plurality of chips are provided. Each chip has at least an active surface with a plurality of bumps thereon. The chips and the carrier are electrically connected. An encapsulating material layer that fills the bonding gap between the chips and the carriers and covers the chips and carrier is formed. The encapsulating material layer between the chips and the carrier has a first thickness and the encapsulating material layer over the chips has a second thickness. The second thickness has a value between half to twice the first thickness.

Abstract: A chip package structure is disclosed. The chip package structure essentially comprises a carrier, one or more chips, a heat sink and an encapsulating material layer. At least one of the chips is flip-chip bonded and electrically connected to the carrier or another chip. There is a flip-chip bonding gap between the chip and the carrier or other chips. A heat sink is positioned on the uppermost chip. The encapsulating material layer fills the flip-chip bonding gap as well as a gap between the uppermost chip and the heat sink. A part of the surface of the heat sink away from the upper-most chip is exposed. Furthermore, the encapsulating material layer is formed in a simultaneous molding process. For example, the chip is separated from the heat sink by a distance between 0.03˜0.2 mm, and the encapsulating material has a thermal conductivity greater than 1.2 W/m.K.

Abstract: A chip package structure is disclosed. The chip package structure essentially comprises a carrier, one or more chips, a heat sink and an encapsulating material layer. At least one of the chips is bonded and electrically connected to the carrier or another chip using a flip-chip bonding technique. A flip-chip bonding gap is set up between the chip and he carrier or other chips. The heat sink is set up over the top chip. The heat sink has an area bigger than the chip. The encapsulating material layer fills up the flip-chip bonding gap and covers the carrier as well as the heat sink. The encapsulating material layer is formed in a simultaneous molding process and has a thermal conductivity more than 1.2 W/m.K. Furthermore, a plurality of standoff components may be selectively positioned on the heat sink.

Abstract: A chip package structure and a process for fabricating the same is disclosed. The chip package structure mainly comprises a carrier, a chip and an encapsulating material layer. To fabricate the chip package, a carrier and a plurality of chips are provided. Each chip has at least an active surface with a plurality of bumps thereon. The chips and the carrier are electrically connected. An encapsulating material layer that fills the bonding gap between the chips and the carriers and covers the chips and carrier is formed. The encapsulating material layer between the chips and the carrier has a first thickness and the encapsulating material layer over the chips has a second thickness. The second thickness has a value between half to twice the first thickness.

Abstract: A connecting structure of a flat fuel cell assembly. The assembly includes a plurality of fuel cells, each of which has a membrane electrode assembly with an anode, a proton exchange membrane and a cathode combined. Two conductive nets are attached to the surfaces of the anode and the cathode of each membrane electrode assembly by thermosetting adhesive and heat pressing to collect and transmit electrons.