Abstract: Fine conductive particles are composed of metallic conductive powder, and an insulating organic capping layer on the grains of the powder. The metallic conductive powder have grains with a diameter ranging from 1 to 20 microns, and the capping layer has a thickness of 50-400 nm, which is able to flow by thermo-pressing. The insulating organic capping layer is prepared from a silane having a reactive functionality, a fluorine-containing silane and a compound or a resin having a functionality able to reactive with the reactive functionality.

Abstract: A chip package structure is disclosed. The chip package structure essentially comprises a carrier, one or more chips, a heat sink and an encapsulating material layer. At least one of the chips is flip-chip bonded and electrically connected to the carrier or another chip. There is a flip-chip bonding gap between the chip and the carrier or other chips. A heat sink is positioned on the uppermost chip. The encapsulating material layer fills the flip-chip bonding gap as well as a gap between the uppermost chip and the heat sink. A part of the surface of the heat sink away from the upper-most chip is exposed. Furthermore, the encapsulating material layer is formed in a simultaneous molding process. For example, the chip is separated from the heat sink by a distance between 0.03˜0.2 mm, and the encapsulating material has a thermal conductivity greater than 1.2 W/m.K.

Abstract: A chip package structure is disclosed. The chip package structure essentially comprises a carrier, one or more chips, a heat sink and an encapsulating material layer. At least one of the chips is bonded and electrically connected to the carrier or another chip using a flip-chip bonding technique. A flip-chip bonding gap is set up between the chip and he carrier or other chips. The heat sink is set up over the top chip. The heat sink has an area bigger than the chip. The encapsulating material layer fills up the flip-chip bonding gap and covers the carrier as well as the heat sink. The encapsulating material layer is formed in a simultaneous molding process and has a thermal conductivity more than 1.2 W/m.K. Furthermore, a plurality of standoff components may be selectively positioned on the heat sink.

Abstract: A chip package structure and a process for fabricating the same is disclosed. The chip package structure essentially comprises a carrier, one or more chips, a heat sink and an encapsulating material layer. To fabricate the chip package structure, a carrier and a plurality of chips are provided. Each chip has an active surface and at least one of the active surfaces has a plurality of bumps thereon. The chips and the carrier are electrically connected together. Thereafter, a heat sink is attached to the back of the chips and then at least one heat-resistant buffering film is formed over part of the heat sink surface. An encapsulating material layer is formed over the carrier and filling bonding gaps between the chips and the carrier. The encapsulating material within the bonding gaps has a thickness. The maximum diameter of particles constituting the encapsulating material layer is less than half of the said thickness.

Abstract: Fine conductive particles are composed of metallic conductive powder, and an insulating organic capping layer on the grains of the powder. The metallic conductive powder have grains with a diameter ranging from 1 to 20 microns, and the capping layer has a thickness of 50-400 nm, which is able to flow by thermo-pressing. The insulating organic capping layer is prepared from a silane having a reactive functionality, a fluorine-containing silane and a compound or a resin having a functionality able to reactive with the reactive functionality.

Abstract: A stator assembly structure has a latch and coupling design to assemble every element of the stator so that the stator structure may be disassembled and separated. The separated elements may be recycled according to their material nature to reduce waste of resources.

Abstract: A method of assigning capacity and routing flow in a bi-directional line switched SONET ring based upon ring topology and demand data defines for each pair of links of the ring a two-edge cut. Each two-edge cut divides the ring into two sets of nodes. For each two-edge cut, the capacity assignment method calculates a demand equal to the sum of all demands between nodes on opposite sides of the two-edge cut. The capacity assignment method then determines the maximum demand and sets the capacity of each link equal to one-half the maximum demand plus one-half of one demand unit. The flow routing method of the present invention calculates a cut difference for each two-edge cut. A critical cut is a two-edge cut having a cut difference equal to or less than one. If there is a critical cut with demands greater than zero on the same side of the critical cut, the method performs a first processing routine.

Abstract: This invention is discloses a packaged integrated circuit (IC) which includes an IC chip supported and securely attached to an adapter board. The package also includes a chip cap for covering and protecting the IC chip therein. The chip cap further forms a concave, step near a lower edge of the cap for wrapping around the edge of the adapter board for increasing the contact areas between the cap and the board and for securely attaching the cap to the board. The chip cap is composed of thermal conductive materials and the chip cap further includes a heat sink for dissipating heat generated from the IC chip. The adapter board further includes a plurality of connecting vias and a plurality of conductive metal balls forming a ball grid array (BGA) underneath the adapter board. The IC chip is in electrical and thermal contact with the BGA by filling the connection vias with conductive materials.

Abstract: An audio-video user interface for a multimedia communication system is disclosed in this invention. the integrated audio-video user interface includes a base-support for supporting the integrated audio-video interface. The base-support further includes a plurality of audio input and output devices. the audio-video user interface further includes a multi-direction adjustable support for supporting a video input device such as a video camera. The adjustable support is securely attached to the base support and is flexibly adjustable for directing the video input device for pointing to different directions. The audio-video user interface is ready to perform a multi-media communication once connected to a compatible computer with an audio interface card, a video interface card and an integrated service digital network (ISDN) interface card.

Abstract: A vehicle rear view mirror includes a mirror body coupled to a base by a coupler, the coupler includes a bolt engaged to the base and a ball disposed on an upper portion of the bolt, and a shell force-fitted on the ball and embedded within the body such that the body is stably supported in place.