Patents by Inventor Shu Tang

Shu Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088313
    Abstract: A solar cell comprising a substrate having a front surface configured to face a light source in use, and a rear surface opposite the front surface. The front surface has a front surface morphology and the rear surface has a rear surface morphology. The front and rear surface morphologies are configured such that the front surface has a greater surface area than the rear surface. The solar cell also includes an emitter arranged on the rear surface of the substrate. Also disclosed is a method of forming a layered structure of a solar cell, which includes performing finishing processes such that a first (e.g. front) surface of a substrate has a greater surface area than a second (e.g. rear) surface. The method further includes providing a reflector layer that may be tuned to the morphology of the second surface.
    Type: Application
    Filed: December 20, 2021
    Publication date: March 14, 2024
    Applicant: REC SOLAR PTE. LTD.
    Inventors: Muzhi TANG, Shu Yunn CHONG
  • Publication number: 20240088042
    Abstract: A semiconductor structure includes a dielectric layer over a substrate, a via conductor over the substrate and in the dielectric layer, and a first graphene layer disposed over the via conductor. In some embodiments, a top surface of the via conductor and a top surface of the dielectric layer are level. In some embodiments, the first graphene layer overlaps the via conductor from a top view. In some embodiments, the semiconductor structure further includes a second graphene layer under the via conductor and a third graphene layer between the dielectric layer and the via conductor. In some embodiments, the second graphene layer is between the substrate and the via conductor.
    Type: Application
    Filed: January 11, 2023
    Publication date: March 14, 2024
    Inventors: SHU-WEI LI, HAN-TANG HUNG, YU-CHEN CHAN, CHIEN-HSIN HO, SHIN-YI YANG, MING-HAN LEE, SHAU-LIN SHUE
  • Patent number: 11923359
    Abstract: A method for forming a FinFET device structure is provided. The method includes forming a first fin structure and a second fin structure over a substrate and forming a liner layer over the first fin structure and the second fin structure. The method also includes forming an isolation layer over the liner layer and removing a portion of the liner layer and a portion of the isolation layer, such that the liner layer includes a first liner layer on an outer sidewall surface of the first fin structure and a second liner layer on an inner sidewall surface of the first fin structure, and a top surface of the second liner layer is higher than a top surface of the first liner layer.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Shu Wu, Shu-Uei Jang, Wei-Yeh Tang, Ryan Chia-Jen Chen, An-Chyi Wei
  • Publication number: 20240071822
    Abstract: A method for manufacturing a semiconductor structure includes forming a first interconnect feature in a first dielectric feature, the first interconnect feature including a first conductive element exposed from the first dielectric feature; forming a first cap feature over the first conductive element, the first cap feature including a first cap element which includes a two-dimensional material; forming a second dielectric feature with a first opening that exposes the first cap element; forming a barrier layer over the second dielectric feature while exposing the first cap element from the barrier layer; removing a portion of the first cap element exposed from the barrier layer; and forming a second conductive element in the first opening.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Lung CHUNG, Shin-Yi YANG, Yu-Chen CHAN, Han-Tang HUNG, Shu-Wei LI, Ming-Han LEE
  • Publication number: 20240072190
    Abstract: A solar cell comprising a silicon substrate and a layered structure arranged on a surface of the silicon substrate, the layered structure comprising; a first layer comprising a percentage of crystalline material arranged within an amorphous matrix, the first layer being arranged on the surface of the silicon substrate; a second layer comprising a percentage of crystalline material arranged within an amorphous matrix, the second layer being interposed between the first layer and the surface of the silicon substrate; wherein the percentage of crystalline material in the first layer is greater than the percentage of crystalline material in the second layer.
    Type: Application
    Filed: December 20, 2021
    Publication date: February 29, 2024
    Applicant: REC SOLAR PTE. LTD.
    Inventors: Muzhi TANG, Priyadharsini KARUPPUSWAMY, Shu Yunn CHONG, Kenta NAKAYASHIKI
  • Patent number: 11880664
    Abstract: A computer-implemented method, system and computer program product for improving understandability of text by a user. A final word vector for each word in a sentence of a document is computed, such as by averaging a first word vector and a second word vector for that word. Furthermore, elements of a user portrait are vectorized. A distance is then computed between a vector for each word in the sentence and a vectorized element in the user's portrait which is summed to form an evaluation result for the element. An evaluation result is also formed for every other element in the user's portrait by performing such a computation step. A “final evaluation result” is then generated corresponding to the evaluation results for every element in the user's portrait. The document is then transformed in response to the final evaluation result indicating a lack of understanding of the sentence by the user.
    Type: Grant
    Filed: August 4, 2021
    Date of Patent: January 23, 2024
    Assignee: International Business Machines Corporation
    Inventors: Peng Fei Tian, Ting Ting Zhan, Jing Bai, Dong Chen, Jun Su, Zhen Rong Wang, Shu Tang
  • Patent number: 11825570
    Abstract: An embodiment of the disclosure provides a heater package including a substrate, a first barrier layer, at least one heater, and a second barrier layer. The first barrier layer is disposed on a surface of the substrate and has a first treatment layer on a side away from the substrate. The heater is disposed on the substrate and includes a heating layer and at least one electrode. The at least one electrode and the heating layer contact with each other. The second barrier layer covers an upper surface and a sidewall of the heater and has a second treatment layer on an opposite side or the side away from the substrate. A ratio of a thickness of the first treatment layer to a thickness of the first barrier layer and a ratio of a thickness of the second treatment layer to a thickness of the second barrier layer range from 0.03 to 0.2.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: November 21, 2023
    Assignee: Industrial Technology Research Institute
    Inventors: Yen-Ching Kuo, Chien-Chang Hung, Hong-Ming Dai, Jane-Hway Liao, Hung-Yi Chen, Shu-Tang Yeh
  • Publication number: 20230307528
    Abstract: A method of forming a semiconductor device and the structure of the semiconductor device are provided. The manufacturing method includes the following steps of: providing a semiconductor substrate with a front side and a back side; forming a collector layer in the back side; conducting a first Hydrogen implant process to the back side to form an N-type region and baking the N-type region with a first annealing temperature to form a field stop buffer layer; conducting a second Hydrogen implant process to the back side to form a lifetime control site and baking the lifetime control site with a second annealing temperature to form a defect layer, wherein the second annealing temperature being lower than the first annealing temperature; and forming a metal layer on the back side.
    Type: Application
    Filed: March 28, 2022
    Publication date: September 28, 2023
    Inventors: SEUNGCHUL LEE, SHU-SHU TANG, CHIH-CHIANG CHUANG
  • Publication number: 20230042683
    Abstract: A computer-implemented method, system and computer program product for improving understandability of text by a user. A final word vector for each word in a sentence of a document is computed, such as by averaging a first word vector and a second word vector for that word. Furthermore, elements of a user portrait are vectorized. A distance is then computed between a vector for each word in the sentence and a vectorized element in the user’s portrait which is summed to form an evaluation result for the element. An evaluation result is also formed for every other element in the user’s portrait by performing such a computation step. A “final evaluation result” is then generated corresponding to the evaluation results for every element in the user’s portrait. The document is then transformed in response to the final evaluation result indicating a lack of understanding of the sentence by the user.
    Type: Application
    Filed: August 4, 2021
    Publication date: February 9, 2023
    Inventors: Peng Fei Tian, Ting Ting Zhan, Jing Bai, Dong Chen, Jun Su, Zhen Rong Wang, Shu Tang
  • Patent number: 11551829
    Abstract: The disclosure provides an electronic device. The electronic device includes a stretchable substrate, a plurality of electronic elements, and at least one connection element. The electronic elements and the connection element are disposed on the stretchable substrate. The connection element is disposed between two adjacent electronic elements, and the two adjacent electronic elements are electrically connected to each other via the connection element. Each electronic element may include at least one functional unit and an electrode, wherein the electrode is in direct contact with the functional unit. The connecting element includes at least one stretchable conductive unit and at least one buffer conductive unit, wherein the buffer conductive unit contacts the electrode, and the stretchable conductive unit is electrically connected to the electrode through the buffer conductive unit. The yield strain of the stretchable conductive unit is greater than the yield strain of the buffer conductive unit.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: January 10, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hung-Yi Chen, Yen-Ching Kuo, Hong-Ming Dai, Shu-Tang Yeh, Wen-Lung Chen, Jane-Hway Liao
  • Publication number: 20220339681
    Abstract: A biodegradable composite includes an organic matter and a porous material, wherein the organic matter has viable bacteria, and a total plate count of the organic matter is greater than or equal to 104 CFU/g. The organic matter accounts for 40% to 80% of a weight of the biodegradable composite. The porous material accounts for 20% to 60% of the weight of the biodegradable composite. The biodegradable composite could instantly remove unpleasant odor and accelerate a decomposition process to form compost. A product containing the biodegradable composite is provided as well.
    Type: Application
    Filed: July 19, 2021
    Publication date: October 27, 2022
    Inventors: CHUNG-KING HSU, JUI-TSAI WANG, SHU-TANG CHANG, HUNG-CHING CHANG
  • Publication number: 20220068519
    Abstract: The disclosure provides an electronic device. The electronic device includes a stretchable substrate, a plurality of electronic elements, and at least one connection element. The electronic elements and the connection element are disposed on the stretchable substrate. The connection element is disposed between two adjacent electronic elements, and the two adjacent electronic elements are electrically connected to each other via the connection element. Each electronic element may include at least one functional unit and an electrode, wherein the electrode is in direct contact with the functional unit. The connecting element includes at least one stretchable conductive unit and at least one buffer conductive unit, wherein the buffer conductive unit contacts the electrode, and the stretchable conductive unit is electrically connected to the electrode through the buffer conductive unit. The yield strain of the stretchable conductive unit is greater than the yield strain of the buffer conductive unit.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 3, 2022
    Inventors: Hung-Yi CHEN, Yen-Ching KUO, Hong-Ming DAI, Shu-Tang YEH, Wen-lung CHEN, Jane-Hway LIAO
  • Publication number: 20210202333
    Abstract: An encapsulation structure may include a flexible substrate, a plurality of electronic elements, a first partition wall, a second partition wall, and a gas barrier layer. The flexible substrate has a device region and a non-device region. The electronic elements are disposed in the device region of the flexible substrate. The first partition wall surrounds one or more of the electronic elements. The second partition wall surrounds the first partition wall. There is at least one trench between the first partition wall and the second partition wall. The gas barrier layer covers one or more of the electronic elements and the surface of the first partition wall. The surface of the first partition wall has a higher surface energy than the surface of the second partition wall.
    Type: Application
    Filed: May 13, 2020
    Publication date: July 1, 2021
    Inventors: Hong-Ming DAI, Jane-Hway LIAO, Yen-Ching KUO, Shu-Tang YEH, Wei-Lung TSAI, Hung-Yi CHEN, Chien-Chang HUNG
  • Patent number: 10985297
    Abstract: A package of photoelectric device including a substrate, at least one photoelectric device, a first barrier layer, a wavelength-converting layer, and a second barrier layer is provided. The photoelectric device is disposed on the substrate. The first barrier layer is disposed on the substrate and covers the photoelectric device. The wavelength-converting layer is disposed on the first barrier layer. The second barrier layer covers the wavelength-converting layer. A composition of the first barrier layer includes a nitrogen content of more than 0 atomic percent (at %) to 10 at %, an oxygen content of 50 at % to 70 at %, and a silicon content of 30 at % to 50 at %.
    Type: Grant
    Filed: May 27, 2019
    Date of Patent: April 20, 2021
    Assignees: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Yen-Ching Kuo, Chien-Chang Hung, Jane-Hway Liao, Yi-Hsiang Huang, Shu-Tang Yeh, Hong-Ming Dai, Hung-Yi Chen
  • Publication number: 20200163166
    Abstract: An embodiment of the disclosure provides a heater package including a substrate, a first barrier layer, at least one heater, and a second barrier layer. The first barrier layer is disposed on a surface of the substrate and has a first treatment layer on a side away from the substrate. The heater is disposed on the substrate and includes a heating layer and at least one electrode. The at least one electrode and the heating layer contact with each other. The second barrier layer covers an upper surface and a sidewall of the heater and has a second treatment layer on an opposite side or the side away from the substrate. A ratio of a thickness of the first treatment layer to a thickness of the first barrier layer and a ratio of a thickness of the second treatment layer to a thickness of the second barrier layer range from 0.03 to 0.2.
    Type: Application
    Filed: November 15, 2019
    Publication date: May 21, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Yen-Ching Kuo, Chien-Chang Hung, Hong-Ming Dai, Jane-Hway Liao, Hung-Yi Chen, Shu-Tang Yeh
  • Publication number: 20200119240
    Abstract: A package of photoelectric device including a substrate, at least one photoelectric device, a first barrier layer, a wavelength-converting layer, and a second barrier layer is provided. The photoelectric device is disposed on the substrate. The first barrier layer is disposed on the substrate and covers the photoelectric device. The wavelength-converting layer is disposed on the first barrier layer. The second barrier layer covers the wavelength-converting layer. A composition of the first barrier layer includes a nitrogen content of more than 0 atomic percent (at %) to l0 at %, an oxygen content of 50 at % to 70 at %, and a silicon content of 30 at % to 50 at %.
    Type: Application
    Filed: May 27, 2019
    Publication date: April 16, 2020
    Applicants: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Yen-Ching Kuo, Chien-Chang Hung, Jane-Hway Liao, Yi-Hsiang Huang, Shu-Tang Yeh, Hong-Ming Dai, Hung-Yi Chen
  • Patent number: 9935289
    Abstract: A package of environmental sensitive element including a first substrate, a second substrate, a barrier structure between the first substrate and the second substrate, an environmental sensitive element and an adhesive is provided. The second substrate is disposed above the first substrate. The environmental sensitive element is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structure is distributed outside the environmental sensitive element. The adhesive is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive element and the barrier structure, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×10?7 gram/cm2.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: April 3, 2018
    Assignee: Industrial Technology Research Institute Institute
    Inventors: Kuang-Jung Chen, Shu-Tang Yeh, Yung-Sheng Wang
  • Patent number: 9847512
    Abstract: A package structure of an electronic device is provided. The substrate of such package structure has at least one embedded gas barrier structure, which protects the electronic device mounted thereon and offers good gas barrier capability so as to extend the life of the electronic device.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: December 19, 2017
    Assignee: Industrial Technology Research Institute
    Inventors: Shu-Tang Yeh, Jia-Chong Ho
  • Patent number: 9795028
    Abstract: A package structure of an electronic device includes a first substrate, a second substrate, an electronic device and a first barrier structure. The first substrate includes a first light-transmitting portion and a periphery portion. The second substrate includes a second light-transmitting portion and two covering portions located on two sides of the second light-transmitting portion. The first light-transmitting portion is disposed corresponding to the second light-transmitting portion, and a device disposition region exists therebetween. The covering portions cover the periphery portion of the first substrate and two opposite side surfaces of the first substrate. The electronic device is disposed on the first or second substrate, and is located in the device disposition region. The first barrier structure disposed on the first substrate or the second substrate is disposed corresponding to the periphery portion and disposed on at least one side of the device disposition region.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: October 17, 2017
    Assignee: Industrial Technology Research Institute
    Inventors: Shu-Tang Yeh, Chia-Hao Tsai, Mei-Ru Lin
  • Patent number: D876991
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: March 3, 2020
    Assignee: LE-TA GREEN TECHNOLOGY CO., LTD.
    Inventors: Shu-Tang Tsai, Pai-Chun Cheng