Abstract: An application method of an active portion of Ligusticum chuanxiong in preparation of an anti-gout drug is provided, which belongs to the technical field of drugs, relates to an active portion of a traditional Chinese medicine and an application method thereof. An active portion of the Ligusticum chuanxiong for inhibiting xanthine oxidase (XOD, or XO) is an ethyl acetate extract, the ethyl acetate extract mainly includes a small and medium polar lipophilic component, and the small and medium polar lipophilic component is mainly a phthalide compound, and it has been confirmed through experiments that the active portion has an anti-gout effect, in addition, an anti-gout drug and an anti-gout health product containing the active portion of the Ligusticum chuanxiong are provided.

Abstract: An encapsulation structure is provided. The encapsulation structure includes a flexible substrate that has an element area and a non-element area. The encapsulation structure also includes multiple electronic elements disposed in the element area. The encapsulation structure further includes multiple light-guiding structures disposed on the electronic elements. The light-guiding structure includes a convex structure and/or a concave structure. The convex structure, in a cross-section, has at least one curved surface, at least two inclined surfaces, or a combination of at least one curved surface and one inclined surface. The concave structure, in a cross-section, has at least one curved surface or at least two inclined surfaces.

Abstract: A computer-implemented method, system and computer program product for improving understandability of text by a user. A final word vector for each word in a sentence of a document is computed, such as by averaging a first word vector and a second word vector for that word. Furthermore, elements of a user portrait are vectorized. A distance is then computed between a vector for each word in the sentence and a vectorized element in the user's portrait which is summed to form an evaluation result for the element. An evaluation result is also formed for every other element in the user's portrait by performing such a computation step. A “final evaluation result” is then generated corresponding to the evaluation results for every element in the user's portrait. The document is then transformed in response to the final evaluation result indicating a lack of understanding of the sentence by the user.

Abstract: An embodiment of the disclosure provides a heater package including a substrate, a first barrier layer, at least one heater, and a second barrier layer. The first barrier layer is disposed on a surface of the substrate and has a first treatment layer on a side away from the substrate. The heater is disposed on the substrate and includes a heating layer and at least one electrode. The at least one electrode and the heating layer contact with each other. The second barrier layer covers an upper surface and a sidewall of the heater and has a second treatment layer on an opposite side or the side away from the substrate. A ratio of a thickness of the first treatment layer to a thickness of the first barrier layer and a ratio of a thickness of the second treatment layer to a thickness of the second barrier layer range from 0.03 to 0.2.

Abstract: A method of forming a semiconductor device and the structure of the semiconductor device are provided. The manufacturing method includes the following steps of: providing a semiconductor substrate with a front side and a back side; forming a collector layer in the back side; conducting a first Hydrogen implant process to the back side to form an N-type region and baking the N-type region with a first annealing temperature to form a field stop buffer layer; conducting a second Hydrogen implant process to the back side to form a lifetime control site and baking the lifetime control site with a second annealing temperature to form a defect layer, wherein the second annealing temperature being lower than the first annealing temperature; and forming a metal layer on the back side.

Abstract: A computer-implemented method, system and computer program product for improving understandability of text by a user. A final word vector for each word in a sentence of a document is computed, such as by averaging a first word vector and a second word vector for that word. Furthermore, elements of a user portrait are vectorized. A distance is then computed between a vector for each word in the sentence and a vectorized element in the user’s portrait which is summed to form an evaluation result for the element. An evaluation result is also formed for every other element in the user’s portrait by performing such a computation step. A “final evaluation result” is then generated corresponding to the evaluation results for every element in the user’s portrait. The document is then transformed in response to the final evaluation result indicating a lack of understanding of the sentence by the user.

Abstract: The disclosure provides an electronic device. The electronic device includes a stretchable substrate, a plurality of electronic elements, and at least one connection element. The electronic elements and the connection element are disposed on the stretchable substrate. The connection element is disposed between two adjacent electronic elements, and the two adjacent electronic elements are electrically connected to each other via the connection element. Each electronic element may include at least one functional unit and an electrode, wherein the electrode is in direct contact with the functional unit. The connecting element includes at least one stretchable conductive unit and at least one buffer conductive unit, wherein the buffer conductive unit contacts the electrode, and the stretchable conductive unit is electrically connected to the electrode through the buffer conductive unit. The yield strain of the stretchable conductive unit is greater than the yield strain of the buffer conductive unit.

Abstract: A biodegradable composite includes an organic matter and a porous material, wherein the organic matter has viable bacteria, and a total plate count of the organic matter is greater than or equal to 104 CFU/g. The organic matter accounts for 40% to 80% of a weight of the biodegradable composite. The porous material accounts for 20% to 60% of the weight of the biodegradable composite. The biodegradable composite could instantly remove unpleasant odor and accelerate a decomposition process to form compost. A product containing the biodegradable composite is provided as well.

Abstract: The disclosure provides an electronic device. The electronic device includes a stretchable substrate, a plurality of electronic elements, and at least one connection element. The electronic elements and the connection element are disposed on the stretchable substrate. The connection element is disposed between two adjacent electronic elements, and the two adjacent electronic elements are electrically connected to each other via the connection element. Each electronic element may include at least one functional unit and an electrode, wherein the electrode is in direct contact with the functional unit. The connecting element includes at least one stretchable conductive unit and at least one buffer conductive unit, wherein the buffer conductive unit contacts the electrode, and the stretchable conductive unit is electrically connected to the electrode through the buffer conductive unit. The yield strain of the stretchable conductive unit is greater than the yield strain of the buffer conductive unit.

Abstract: An encapsulation structure may include a flexible substrate, a plurality of electronic elements, a first partition wall, a second partition wall, and a gas barrier layer. The flexible substrate has a device region and a non-device region. The electronic elements are disposed in the device region of the flexible substrate. The first partition wall surrounds one or more of the electronic elements. The second partition wall surrounds the first partition wall. There is at least one trench between the first partition wall and the second partition wall. The gas barrier layer covers one or more of the electronic elements and the surface of the first partition wall. The surface of the first partition wall has a higher surface energy than the surface of the second partition wall.

Abstract: A package of photoelectric device including a substrate, at least one photoelectric device, a first barrier layer, a wavelength-converting layer, and a second barrier layer is provided. The photoelectric device is disposed on the substrate. The first barrier layer is disposed on the substrate and covers the photoelectric device. The wavelength-converting layer is disposed on the first barrier layer. The second barrier layer covers the wavelength-converting layer. A composition of the first barrier layer includes a nitrogen content of more than 0 atomic percent (at %) to 10 at %, an oxygen content of 50 at % to 70 at %, and a silicon content of 30 at % to 50 at %.

Abstract: An embodiment of the disclosure provides a heater package including a substrate, a first barrier layer, at least one heater, and a second barrier layer. The first barrier layer is disposed on a surface of the substrate and has a first treatment layer on a side away from the substrate. The heater is disposed on the substrate and includes a heating layer and at least one electrode. The at least one electrode and the heating layer contact with each other. The second barrier layer covers an upper surface and a sidewall of the heater and has a second treatment layer on an opposite side or the side away from the substrate. A ratio of a thickness of the first treatment layer to a thickness of the first barrier layer and a ratio of a thickness of the second treatment layer to a thickness of the second barrier layer range from 0.03 to 0.2.

Abstract: A package of photoelectric device including a substrate, at least one photoelectric device, a first barrier layer, a wavelength-converting layer, and a second barrier layer is provided. The photoelectric device is disposed on the substrate. The first barrier layer is disposed on the substrate and covers the photoelectric device. The wavelength-converting layer is disposed on the first barrier layer. The second barrier layer covers the wavelength-converting layer. A composition of the first barrier layer includes a nitrogen content of more than 0 atomic percent (at %) to l0 at %, an oxygen content of 50 at % to 70 at %, and a silicon content of 30 at % to 50 at %.

Abstract: A package of environmental sensitive element including a first substrate, a second substrate, a barrier structure between the first substrate and the second substrate, an environmental sensitive element and an adhesive is provided. The second substrate is disposed above the first substrate. The environmental sensitive element is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structure is distributed outside the environmental sensitive element. The adhesive is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive element and the barrier structure, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×10?7 gram/cm2.

Abstract: A package structure of an electronic device is provided. The substrate of such package structure has at least one embedded gas barrier structure, which protects the electronic device mounted thereon and offers good gas barrier capability so as to extend the life of the electronic device.

Abstract: A package structure of an electronic device includes a first substrate, a second substrate, an electronic device and a first barrier structure. The first substrate includes a first light-transmitting portion and a periphery portion. The second substrate includes a second light-transmitting portion and two covering portions located on two sides of the second light-transmitting portion. The first light-transmitting portion is disposed corresponding to the second light-transmitting portion, and a device disposition region exists therebetween. The covering portions cover the periphery portion of the first substrate and two opposite side surfaces of the first substrate. The electronic device is disposed on the first or second substrate, and is located in the device disposition region. The first barrier structure disposed on the first substrate or the second substrate is disposed corresponding to the periphery portion and disposed on at least one side of the device disposition region.

Abstract: An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, a side wall barrier structure, a first adhesive, and a second adhesive is provided. The environmental sensitive electronic device is located on the first substrate. The first adhesive is located on the first substrate. The side wall barrier structure is located on the first adhesive, and the side wall barrier structure is adhered to the first substrate through the first adhesive. The second adhesive is located on the side wall barrier structure. The side wall barrier structure is adhered to the second substrate through the second adhesive, and the side wall barrier structure, the first adhesive, and the second adhesive are located between the first substrate and the second substrate. A manufacturing method of an environmental sensitive electronic device package is also provided.

Abstract: A package of environmental sensitive element including a first substrate, a second substrate, a barrier structure between the first substrate and the second substrate, an environmental sensitive element and an adhesive is provided. The second substrate is disposed above the first substrate. The environmental sensitive element is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structure is distributed outside the environmental sensitive element. The adhesive is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive element and the barrier structure, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×10?7 gram/cm2.

Abstract: A package structure of an electronic device includes a first substrate, a second substrate, an electronic device and a first barrier structure. The first substrate includes a first light-transmitting portion and a periphery portion. The second substrate includes a second light-transmitting portion and two covering portions located on two sides of the second light-transmitting portion. The first light-transmitting portion is disposed corresponding to the second light-transmitting portion, and a device disposition region exists therebetween. The covering portions cover the periphery portion of the first substrate and two opposite side surfaces of the first substrate. The electronic device is disposed on the first or second substrate, and is located in the device disposition region. The first barrier structure disposed on the first substrate or the second substrate is disposed corresponding to the periphery portion and disposed on at least one side of the device disposition region.