Patents by Inventor Shu Tang
Shu Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240088313Abstract: A solar cell comprising a substrate having a front surface configured to face a light source in use, and a rear surface opposite the front surface. The front surface has a front surface morphology and the rear surface has a rear surface morphology. The front and rear surface morphologies are configured such that the front surface has a greater surface area than the rear surface. The solar cell also includes an emitter arranged on the rear surface of the substrate. Also disclosed is a method of forming a layered structure of a solar cell, which includes performing finishing processes such that a first (e.g. front) surface of a substrate has a greater surface area than a second (e.g. rear) surface. The method further includes providing a reflector layer that may be tuned to the morphology of the second surface.Type: ApplicationFiled: December 20, 2021Publication date: March 14, 2024Applicant: REC SOLAR PTE. LTD.Inventors: Muzhi TANG, Shu Yunn CHONG
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Publication number: 20240088042Abstract: A semiconductor structure includes a dielectric layer over a substrate, a via conductor over the substrate and in the dielectric layer, and a first graphene layer disposed over the via conductor. In some embodiments, a top surface of the via conductor and a top surface of the dielectric layer are level. In some embodiments, the first graphene layer overlaps the via conductor from a top view. In some embodiments, the semiconductor structure further includes a second graphene layer under the via conductor and a third graphene layer between the dielectric layer and the via conductor. In some embodiments, the second graphene layer is between the substrate and the via conductor.Type: ApplicationFiled: January 11, 2023Publication date: March 14, 2024Inventors: SHU-WEI LI, HAN-TANG HUNG, YU-CHEN CHAN, CHIEN-HSIN HO, SHIN-YI YANG, MING-HAN LEE, SHAU-LIN SHUE
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Patent number: 11923359Abstract: A method for forming a FinFET device structure is provided. The method includes forming a first fin structure and a second fin structure over a substrate and forming a liner layer over the first fin structure and the second fin structure. The method also includes forming an isolation layer over the liner layer and removing a portion of the liner layer and a portion of the isolation layer, such that the liner layer includes a first liner layer on an outer sidewall surface of the first fin structure and a second liner layer on an inner sidewall surface of the first fin structure, and a top surface of the second liner layer is higher than a top surface of the first liner layer.Type: GrantFiled: July 12, 2021Date of Patent: March 5, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Shu Wu, Shu-Uei Jang, Wei-Yeh Tang, Ryan Chia-Jen Chen, An-Chyi Wei
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Publication number: 20240071822Abstract: A method for manufacturing a semiconductor structure includes forming a first interconnect feature in a first dielectric feature, the first interconnect feature including a first conductive element exposed from the first dielectric feature; forming a first cap feature over the first conductive element, the first cap feature including a first cap element which includes a two-dimensional material; forming a second dielectric feature with a first opening that exposes the first cap element; forming a barrier layer over the second dielectric feature while exposing the first cap element from the barrier layer; removing a portion of the first cap element exposed from the barrier layer; and forming a second conductive element in the first opening.Type: ApplicationFiled: August 31, 2022Publication date: February 29, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chin-Lung CHUNG, Shin-Yi YANG, Yu-Chen CHAN, Han-Tang HUNG, Shu-Wei LI, Ming-Han LEE
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Publication number: 20240072190Abstract: A solar cell comprising a silicon substrate and a layered structure arranged on a surface of the silicon substrate, the layered structure comprising; a first layer comprising a percentage of crystalline material arranged within an amorphous matrix, the first layer being arranged on the surface of the silicon substrate; a second layer comprising a percentage of crystalline material arranged within an amorphous matrix, the second layer being interposed between the first layer and the surface of the silicon substrate; wherein the percentage of crystalline material in the first layer is greater than the percentage of crystalline material in the second layer.Type: ApplicationFiled: December 20, 2021Publication date: February 29, 2024Applicant: REC SOLAR PTE. LTD.Inventors: Muzhi TANG, Priyadharsini KARUPPUSWAMY, Shu Yunn CHONG, Kenta NAKAYASHIKI
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Patent number: 11880664Abstract: A computer-implemented method, system and computer program product for improving understandability of text by a user. A final word vector for each word in a sentence of a document is computed, such as by averaging a first word vector and a second word vector for that word. Furthermore, elements of a user portrait are vectorized. A distance is then computed between a vector for each word in the sentence and a vectorized element in the user's portrait which is summed to form an evaluation result for the element. An evaluation result is also formed for every other element in the user's portrait by performing such a computation step. A “final evaluation result” is then generated corresponding to the evaluation results for every element in the user's portrait. The document is then transformed in response to the final evaluation result indicating a lack of understanding of the sentence by the user.Type: GrantFiled: August 4, 2021Date of Patent: January 23, 2024Assignee: International Business Machines CorporationInventors: Peng Fei Tian, Ting Ting Zhan, Jing Bai, Dong Chen, Jun Su, Zhen Rong Wang, Shu Tang
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Patent number: 11825570Abstract: An embodiment of the disclosure provides a heater package including a substrate, a first barrier layer, at least one heater, and a second barrier layer. The first barrier layer is disposed on a surface of the substrate and has a first treatment layer on a side away from the substrate. The heater is disposed on the substrate and includes a heating layer and at least one electrode. The at least one electrode and the heating layer contact with each other. The second barrier layer covers an upper surface and a sidewall of the heater and has a second treatment layer on an opposite side or the side away from the substrate. A ratio of a thickness of the first treatment layer to a thickness of the first barrier layer and a ratio of a thickness of the second treatment layer to a thickness of the second barrier layer range from 0.03 to 0.2.Type: GrantFiled: November 15, 2019Date of Patent: November 21, 2023Assignee: Industrial Technology Research InstituteInventors: Yen-Ching Kuo, Chien-Chang Hung, Hong-Ming Dai, Jane-Hway Liao, Hung-Yi Chen, Shu-Tang Yeh
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Publication number: 20230307528Abstract: A method of forming a semiconductor device and the structure of the semiconductor device are provided. The manufacturing method includes the following steps of: providing a semiconductor substrate with a front side and a back side; forming a collector layer in the back side; conducting a first Hydrogen implant process to the back side to form an N-type region and baking the N-type region with a first annealing temperature to form a field stop buffer layer; conducting a second Hydrogen implant process to the back side to form a lifetime control site and baking the lifetime control site with a second annealing temperature to form a defect layer, wherein the second annealing temperature being lower than the first annealing temperature; and forming a metal layer on the back side.Type: ApplicationFiled: March 28, 2022Publication date: September 28, 2023Inventors: SEUNGCHUL LEE, SHU-SHU TANG, CHIH-CHIANG CHUANG
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Publication number: 20230042683Abstract: A computer-implemented method, system and computer program product for improving understandability of text by a user. A final word vector for each word in a sentence of a document is computed, such as by averaging a first word vector and a second word vector for that word. Furthermore, elements of a user portrait are vectorized. A distance is then computed between a vector for each word in the sentence and a vectorized element in the user’s portrait which is summed to form an evaluation result for the element. An evaluation result is also formed for every other element in the user’s portrait by performing such a computation step. A “final evaluation result” is then generated corresponding to the evaluation results for every element in the user’s portrait. The document is then transformed in response to the final evaluation result indicating a lack of understanding of the sentence by the user.Type: ApplicationFiled: August 4, 2021Publication date: February 9, 2023Inventors: Peng Fei Tian, Ting Ting Zhan, Jing Bai, Dong Chen, Jun Su, Zhen Rong Wang, Shu Tang
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Patent number: 11551829Abstract: The disclosure provides an electronic device. The electronic device includes a stretchable substrate, a plurality of electronic elements, and at least one connection element. The electronic elements and the connection element are disposed on the stretchable substrate. The connection element is disposed between two adjacent electronic elements, and the two adjacent electronic elements are electrically connected to each other via the connection element. Each electronic element may include at least one functional unit and an electrode, wherein the electrode is in direct contact with the functional unit. The connecting element includes at least one stretchable conductive unit and at least one buffer conductive unit, wherein the buffer conductive unit contacts the electrode, and the stretchable conductive unit is electrically connected to the electrode through the buffer conductive unit. The yield strain of the stretchable conductive unit is greater than the yield strain of the buffer conductive unit.Type: GrantFiled: September 3, 2021Date of Patent: January 10, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hung-Yi Chen, Yen-Ching Kuo, Hong-Ming Dai, Shu-Tang Yeh, Wen-Lung Chen, Jane-Hway Liao
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Publication number: 20220339681Abstract: A biodegradable composite includes an organic matter and a porous material, wherein the organic matter has viable bacteria, and a total plate count of the organic matter is greater than or equal to 104 CFU/g. The organic matter accounts for 40% to 80% of a weight of the biodegradable composite. The porous material accounts for 20% to 60% of the weight of the biodegradable composite. The biodegradable composite could instantly remove unpleasant odor and accelerate a decomposition process to form compost. A product containing the biodegradable composite is provided as well.Type: ApplicationFiled: July 19, 2021Publication date: October 27, 2022Inventors: CHUNG-KING HSU, JUI-TSAI WANG, SHU-TANG CHANG, HUNG-CHING CHANG
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Publication number: 20220068519Abstract: The disclosure provides an electronic device. The electronic device includes a stretchable substrate, a plurality of electronic elements, and at least one connection element. The electronic elements and the connection element are disposed on the stretchable substrate. The connection element is disposed between two adjacent electronic elements, and the two adjacent electronic elements are electrically connected to each other via the connection element. Each electronic element may include at least one functional unit and an electrode, wherein the electrode is in direct contact with the functional unit. The connecting element includes at least one stretchable conductive unit and at least one buffer conductive unit, wherein the buffer conductive unit contacts the electrode, and the stretchable conductive unit is electrically connected to the electrode through the buffer conductive unit. The yield strain of the stretchable conductive unit is greater than the yield strain of the buffer conductive unit.Type: ApplicationFiled: September 3, 2021Publication date: March 3, 2022Inventors: Hung-Yi CHEN, Yen-Ching KUO, Hong-Ming DAI, Shu-Tang YEH, Wen-lung CHEN, Jane-Hway LIAO
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Publication number: 20210202333Abstract: An encapsulation structure may include a flexible substrate, a plurality of electronic elements, a first partition wall, a second partition wall, and a gas barrier layer. The flexible substrate has a device region and a non-device region. The electronic elements are disposed in the device region of the flexible substrate. The first partition wall surrounds one or more of the electronic elements. The second partition wall surrounds the first partition wall. There is at least one trench between the first partition wall and the second partition wall. The gas barrier layer covers one or more of the electronic elements and the surface of the first partition wall. The surface of the first partition wall has a higher surface energy than the surface of the second partition wall.Type: ApplicationFiled: May 13, 2020Publication date: July 1, 2021Inventors: Hong-Ming DAI, Jane-Hway LIAO, Yen-Ching KUO, Shu-Tang YEH, Wei-Lung TSAI, Hung-Yi CHEN, Chien-Chang HUNG
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Patent number: 10985297Abstract: A package of photoelectric device including a substrate, at least one photoelectric device, a first barrier layer, a wavelength-converting layer, and a second barrier layer is provided. The photoelectric device is disposed on the substrate. The first barrier layer is disposed on the substrate and covers the photoelectric device. The wavelength-converting layer is disposed on the first barrier layer. The second barrier layer covers the wavelength-converting layer. A composition of the first barrier layer includes a nitrogen content of more than 0 atomic percent (at %) to 10 at %, an oxygen content of 50 at % to 70 at %, and a silicon content of 30 at % to 50 at %.Type: GrantFiled: May 27, 2019Date of Patent: April 20, 2021Assignees: Industrial Technology Research Institute, Intellectual Property Innovation CorporationInventors: Yen-Ching Kuo, Chien-Chang Hung, Jane-Hway Liao, Yi-Hsiang Huang, Shu-Tang Yeh, Hong-Ming Dai, Hung-Yi Chen
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Publication number: 20200163166Abstract: An embodiment of the disclosure provides a heater package including a substrate, a first barrier layer, at least one heater, and a second barrier layer. The first barrier layer is disposed on a surface of the substrate and has a first treatment layer on a side away from the substrate. The heater is disposed on the substrate and includes a heating layer and at least one electrode. The at least one electrode and the heating layer contact with each other. The second barrier layer covers an upper surface and a sidewall of the heater and has a second treatment layer on an opposite side or the side away from the substrate. A ratio of a thickness of the first treatment layer to a thickness of the first barrier layer and a ratio of a thickness of the second treatment layer to a thickness of the second barrier layer range from 0.03 to 0.2.Type: ApplicationFiled: November 15, 2019Publication date: May 21, 2020Applicant: Industrial Technology Research InstituteInventors: Yen-Ching Kuo, Chien-Chang Hung, Hong-Ming Dai, Jane-Hway Liao, Hung-Yi Chen, Shu-Tang Yeh
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Publication number: 20200119240Abstract: A package of photoelectric device including a substrate, at least one photoelectric device, a first barrier layer, a wavelength-converting layer, and a second barrier layer is provided. The photoelectric device is disposed on the substrate. The first barrier layer is disposed on the substrate and covers the photoelectric device. The wavelength-converting layer is disposed on the first barrier layer. The second barrier layer covers the wavelength-converting layer. A composition of the first barrier layer includes a nitrogen content of more than 0 atomic percent (at %) to l0 at %, an oxygen content of 50 at % to 70 at %, and a silicon content of 30 at % to 50 at %.Type: ApplicationFiled: May 27, 2019Publication date: April 16, 2020Applicants: Industrial Technology Research Institute, Intellectual Property Innovation CorporationInventors: Yen-Ching Kuo, Chien-Chang Hung, Jane-Hway Liao, Yi-Hsiang Huang, Shu-Tang Yeh, Hong-Ming Dai, Hung-Yi Chen
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Patent number: 9935289Abstract: A package of environmental sensitive element including a first substrate, a second substrate, a barrier structure between the first substrate and the second substrate, an environmental sensitive element and an adhesive is provided. The second substrate is disposed above the first substrate. The environmental sensitive element is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structure is distributed outside the environmental sensitive element. The adhesive is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive element and the barrier structure, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×10?7 gram/cm2.Type: GrantFiled: January 22, 2016Date of Patent: April 3, 2018Assignee: Industrial Technology Research Institute InstituteInventors: Kuang-Jung Chen, Shu-Tang Yeh, Yung-Sheng Wang
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Patent number: 9847512Abstract: A package structure of an electronic device is provided. The substrate of such package structure has at least one embedded gas barrier structure, which protects the electronic device mounted thereon and offers good gas barrier capability so as to extend the life of the electronic device.Type: GrantFiled: November 27, 2013Date of Patent: December 19, 2017Assignee: Industrial Technology Research InstituteInventors: Shu-Tang Yeh, Jia-Chong Ho
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Patent number: 9795028Abstract: A package structure of an electronic device includes a first substrate, a second substrate, an electronic device and a first barrier structure. The first substrate includes a first light-transmitting portion and a periphery portion. The second substrate includes a second light-transmitting portion and two covering portions located on two sides of the second light-transmitting portion. The first light-transmitting portion is disposed corresponding to the second light-transmitting portion, and a device disposition region exists therebetween. The covering portions cover the periphery portion of the first substrate and two opposite side surfaces of the first substrate. The electronic device is disposed on the first or second substrate, and is located in the device disposition region. The first barrier structure disposed on the first substrate or the second substrate is disposed corresponding to the periphery portion and disposed on at least one side of the device disposition region.Type: GrantFiled: February 23, 2016Date of Patent: October 17, 2017Assignee: Industrial Technology Research InstituteInventors: Shu-Tang Yeh, Chia-Hao Tsai, Mei-Ru Lin
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Patent number: D876991Type: GrantFiled: March 5, 2018Date of Patent: March 3, 2020Assignee: LE-TA GREEN TECHNOLOGY CO., LTD.Inventors: Shu-Tang Tsai, Pai-Chun Cheng