Patents by Inventor Shu Tang
Shu Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9510459Abstract: An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, a side wall barrier structure, a first adhesive, and a second adhesive is provided. The environmental sensitive electronic device is located on the first substrate. The first adhesive is located on the first substrate. The side wall barrier structure is located on the first adhesive, and the side wall barrier structure is adhered to the first substrate through the first adhesive. The second adhesive is located on the side wall barrier structure. The side wall barrier structure is adhered to the second substrate through the second adhesive, and the side wall barrier structure, the first adhesive, and the second adhesive are located between the first substrate and the second substrate. A manufacturing method of an environmental sensitive electronic device package is also provided.Type: GrantFiled: December 6, 2013Date of Patent: November 29, 2016Assignee: Industrial Technology Research InstituteInventors: Jing-Yi Yan, Shu-Tang Yeh, Sheng-Wei Chen, Kuang-Jung Chen
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Publication number: 20160204379Abstract: A package of environmental sensitive element including a first substrate, a second substrate, a barrier structure between the first substrate and the second substrate, an environmental sensitive element and an adhesive is provided. The second substrate is disposed above the first substrate. The environmental sensitive element is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structure is distributed outside the environmental sensitive element. The adhesive is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive element and the barrier structure, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×10?7 gram/cm2.Type: ApplicationFiled: January 22, 2016Publication date: July 14, 2016Inventors: Kuang-Jung Chen, Shu-Tang Yeh, Yung-Sheng Wang
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Publication number: 20160174366Abstract: A package structure of an electronic device includes a first substrate, a second substrate, an electronic device and a first barrier structure. The first substrate includes a first light-transmitting portion and a periphery portion. The second substrate includes a second light-transmitting portion and two covering portions located on two sides of the second light-transmitting portion. The first light-transmitting portion is disposed corresponding to the second light-transmitting portion, and a device disposition region exists therebetween. The covering portions cover the periphery portion of the first substrate and two opposite side surfaces of the first substrate. The electronic device is disposed on the first or second substrate, and is located in the device disposition region. The first barrier structure disposed on the first substrate or the second substrate is disposed corresponding to the periphery portion and disposed on at least one side of the device disposition region.Type: ApplicationFiled: February 23, 2016Publication date: June 16, 2016Inventors: Shu-Tang Yeh, Chia-Hao Tsai, Mei-Ru Lin
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Patent number: 9142798Abstract: A package of an environmental sensitive electronic element including a first substrate, a second substrate, an environmental sensitive electronic element, a flexible structure layer and a filler layer is provided. The environmental sensitive electronic element is disposed on the first substrate and located between the first substrate and the second substrate. The environmental sensitive electronic element includes an anode layer, a hole injecting layer, a hole transporting layer, an organic light emitting layer, a cathode layer and an electron injection layer. The flexible structure layer is disposed on the environmental sensitive electronic element and includes a soft layer, a trapping layer and a protective layer. The material of the trapping layer is the same as the material of the electron injection layer. The filler layer is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive electronic element and the flexible structure layer.Type: GrantFiled: January 19, 2012Date of Patent: September 22, 2015Assignee: Industrial Technology Research InstituteInventors: Kuang-Jung Chen, Jian-Lin Wu, Shu-Tang Yeh
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Patent number: 9134984Abstract: The creation of a virtual network adapter is disclosed. At least one existing network device having an existing driver is discovered. At least one of an existing device-to-driver mapping and an existing driver associated with the existing network device is removed. A new driver capable of communicating with the existing network device using a common set of primitive commands is installed. The new driver is mapped to the existing device. The use of the virtual network adapter is also disclosed.Type: GrantFiled: May 11, 2012Date of Patent: September 15, 2015Assignee: Hobnob, Inc.Inventors: Jared Go, Aron B. Hall, Wen Shu Tang Lu, Annie Ding
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Patent number: 9041280Abstract: A double-side light emitting display panel includes a substrate, a plurality of top emission pixel structures and a plurality of bottom emission pixel structures. The top emission pixel structures are disposed on the substrate, and the bottom emission pixel structures are disposed on the substrate. The top emission pixel structures and the bottom emission pixel structures are arranged alternatively on the substrate.Type: GrantFiled: January 29, 2013Date of Patent: May 26, 2015Assignee: Industrial Technology Research InstituteInventors: Jing-Yi Yan, Chih-Chieh Hsu, Chen-Wei Lin, Shu-Tang Yeh, Ping-I Shih
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Patent number: 8878226Abstract: A light emitting device includes a substrate, and a plurality of light emitting structures disposed thereon. Each of the light emitting structures includes an auxiliary electrode disposed on the substrate, a first insulating layer disposed on the substrate and covering the auxiliary electrode, an electrode disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and having a first opening exposing the electrode, an organic light emitting layer disposed in the first opening, a cathode disposed on the organic light emitting layer, at least a conductive structure penetrating through the first insulating layer and the second insulating layer, and a closed ring structure disposed on the second insulating layer and around the cathode, wherein a thickness of the closed ring structure is larger than that of the cathode.Type: GrantFiled: January 17, 2013Date of Patent: November 4, 2014Assignee: Industrial Technology Research InstituteInventors: Jing-Yi Yan, Shu-Tang Yeh, Chih-Chieh Hsu, Chen-Wei Lin, Kuang-Jung Chen
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Patent number: 8881177Abstract: The creation of a virtual network adapter is disclosed. At least one existing network device having an existing driver is discovered. At least one of an existing device-to-driver mapping and an existing driver associated with the existing network device is removed. A new driver capable of communicating with the existing network device using a common set of primitive commands is installed. The new driver is mapped to the existing device. The use of the virtual network adapter is also disclosed.Type: GrantFiled: October 1, 2013Date of Patent: November 4, 2014Assignee: Hobnob, Inc.Inventors: Jared Go, Aron B. Hall, Wen Shu Tang Lu, Annie Ding
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Publication number: 20140223451Abstract: The creation of a virtual network adapter is disclosed. At least one existing network device having an existing driver is discovered. At least one of an existing device-to-driver mapping and an existing driver associated with the existing network device is removed. A new driver capable of communicating with the existing network device using a common set of primitive commands is installed. The new driver is mapped to the existing device. The use of the virtual network adapter is also disclosed.Type: ApplicationFiled: October 1, 2013Publication date: August 7, 2014Applicant: Hobnob, Inc.Inventors: Jared Go, Aron B. Hall, Wen Shu Tang Lu, Annie Ding
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Publication number: 20140198435Abstract: A package structure of an electronic device includes a first substrate, a second substrate, an electronic device and a first barrier structure. The first substrate includes a first light-transmitting portion and a periphery portion. The second substrate includes a second light-transmitting portion and two covering portions located on two sides of the second light-transmitting portion. The first light-transmitting portion is disposed corresponding to the second light-transmitting portion, and a device disposition region exists therebetween. The covering portions cover the periphery portion of the first substrate and two opposite side surfaces of the first substrate. The electronic device is disposed on the first or second substrate, and is located in the device disposition region. The first barrier structure disposed on the first substrate or the second substrate is disposed corresponding to the periphery portion and disposed on at least one side of the device disposition region.Type: ApplicationFiled: July 2, 2013Publication date: July 17, 2014Inventors: Shu-Tang Yeh, Chia-Hao Tsai, Mei-Ru Lin
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Patent number: 8763243Abstract: A fabricating method of a substrate board is provided. The substrate board includes a substrate having rigid areas and flexible areas, and at least an electronic component disposed on the substrate, wherein each of the rigid areas is thicker than the flexible areas. A patterned high-extensive material may be additionally disposed on the substrate to improve reliability thereof. The rigid areas and the flexible areas may be formed by molds or cutters. By using an above structure, the electronic component is less affected when the substrate is under stress, so that good characteristics are maintained.Type: GrantFiled: June 18, 2012Date of Patent: July 1, 2014Assignee: Industrial Technology Research InstituteInventors: Jing-Yi Yan, Shu-Tang Yeh
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Publication number: 20140175405Abstract: A package structure of an electronic device is provided. The substrate of such package structure has at least one embedded gas barrier structure, which protects the electronic device mounted thereon and offers good gas barrier capability so as to extend the life of the electronic device.Type: ApplicationFiled: November 27, 2013Publication date: June 26, 2014Applicant: Industrial Technology Research InstituteInventors: Shu-Tang Yeh, Jia-Chong Ho
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Publication number: 20140160710Abstract: An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, a side wall barrier structure, a first adhesive, and a second adhesive is provided. The environmental sensitive electronic device is located on the first substrate. The first adhesive is located on the first substrate. The side wall barrier structure is located on the first adhesive, and the side wall barrier structure is adhered to the first substrate through the first adhesive. The second adhesive is located on the side wall barrier structure. The side wall barrier structure is adhered to the second substrate through the second adhesive, and the side wall barrier structure, the first adhesive, and the second adhesive are located between the first substrate and the second substrate. A manufacturing method of an environmental sensitive electronic device package is also provided.Type: ApplicationFiled: December 6, 2013Publication date: June 12, 2014Applicant: Industrial Technology Research InstituteInventors: Jing-Yi Yan, Shu-Tang Yeh, Sheng-Wei Chen, Kuang-Jung Chen
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Publication number: 20130305263Abstract: The creation of a virtual network adapter is disclosed. At least one existing network device having an existing driver is discovered. At least one of an existing device-to-driver mapping and an existing driver associated with the existing network device is removed. A new driver capable of communicating with the existing network device using a common set of primitive commands is installed. The new driver is mapped to the existing device. The use of the virtual network adapter is also disclosed.Type: ApplicationFiled: May 11, 2012Publication date: November 14, 2013Applicant: HOBNOB, INC.Inventors: Jared Go, Aron B. Hall, Wen Shu Tang Lu, Annie Ding
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Patent number: 8584146Abstract: The creation of a virtual network adapter is disclosed. At least one existing network device having an existing driver is discovered. At least one of an existing device-to-driver mapping and an existing driver associated with the existing network device is removed. A new driver capable of communicating with the existing network device using a common set of primitive commands is installed. The new driver is mapped to the existing device. The use of the virtual network adapter is also disclosed.Type: GrantFiled: May 24, 2012Date of Patent: November 12, 2013Assignee: Hobnob, Inc.Inventors: Jared Go, Aron B. Hall, Wen Shu Tang Lu, Annie Ding
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Publication number: 20130126932Abstract: A package of an environmental sensitive electronic element including a first substrate, a second substrate, an environmental sensitive electronic element, a flexible structure layer and a filler layer is provided. The environmental sensitive electronic element is disposed on the first substrate and located between the first substrate and the second substrate. The environmental sensitive electronic element includes an anode layer, a hole injecting layer, a hole transporting layer, an organic light emitting layer, a cathode layer and an electron injection layer. The flexible structure layer is disposed on the environmental sensitive electronic element and includes a soft layer, a trapping layer and a protective layer. The material of the trapping layer is the same as the material of the electron injection layer. The filler layer is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive electronic element and the flexible structure layer.Type: ApplicationFiled: January 19, 2012Publication date: May 23, 2013Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kuang-Jung Chen, Jian-Lin Wu, Shu-Tang Yeh
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Patent number: 8446730Abstract: A package of an environmental sensitive element including a flexible substrate, an environmental sensitive element, a flexible sacrificial layer and a packaging structure is provided. The environmental sensitive element is disposed on the flexible substrate. The flexible sacrificial layer is disposed on the environmental sensitive element, wherein the environmental sensitive element includes a plurality of first thin films and the flexible sacrificial layer includes a plurality of second thin films. The bonding strength between two adjacent second thin films is substantially equal to or lower than the bonding strength between two adjacent first thin films. Further, the packaging structure covers the environmental sensitive element and the flexible sacrificial layer.Type: GrantFiled: February 9, 2010Date of Patent: May 21, 2013Assignee: Industrial Technology Research InstituteInventors: Kuang-Jung Chen, Shu-Tang Yeh, Jia-Chong Ho
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Patent number: 8368088Abstract: A light-emitting device and a method for manufacturing the same are provided. The light-emitting device comprises a substrate, a light-emitting element and a light-electricity-transforming element. The substrate has a first region and a second region which are non-overlapping. The light-emitting element is disposed over the substrate and located in the second region. The light-electricity-transforming element is disposed over the substrate and located in the first region. At least a portion of a side wall of the light-electricity-transforming element corresponds to at least a portion of a side wall of the light-emitting element, so that at least a side light from the light-emitting element is received and transformed into an electricity power by the light-electricity-transforming device.Type: GrantFiled: December 22, 2010Date of Patent: February 5, 2013Assignee: Industrial Technology Research InstituteInventors: Jing-Yi Yan, Jung-Jie Huang, Shu-Tang Yeh, Yen-Shih Huang, Hung-Chien Lin
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Patent number: 8366505Abstract: A packaging method of an organic light emitting diode (OLED) is described. First, a substrate is provided, and the substrate has the OLED device formed thereon. Thereafter, at least one protection layer is formed on the substrate, so as to cover the peripheral sidewall of the OLED device entirely. The step of forming the protection layer includes forming an organic layer on the substrate, and then forming a metal layer on the organic layer, wherein the metal layer at least covers a sidewall of the OLED device. Afterwards, an oxidation treatment is performed, so as to oxidize a portion of the metal layer.Type: GrantFiled: June 19, 2009Date of Patent: February 5, 2013Assignee: Industrial Technology Research InstituteInventors: Shu-Tang Yeh, Jing-Yi Yan, Kung-Yu Cheng
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Publication number: 20120258573Abstract: A fabricating method of a substrate board is provided. The substrate board includes a substrate having rigid areas and flexible areas, and at least an electronic component disposed on the substrate, wherein each of the rigid areas is thicker than the flexible areas. A patterned high-extensive material may be additionally disposed on the substrate to improve reliability thereof. The rigid areas and the flexible areas may be formed by molds or cutters. By using an above structure, the electronic component is less affected when the substrate is under stress, so that good characteristics are maintained.Type: ApplicationFiled: June 18, 2012Publication date: October 11, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jing-Yi Yan, Shu-Tang Yeh