Abstract: An encapsulation method of an environmentally sensitive electronic element is provided. A first substrate is provided, wherein at least one first alignment mark and a plurality of environmentally sensitive electronic elements are formed on the first substrate. A second substrate is provided, wherein at least one second alignment mark and a plurality of limiting cavities are formed on the second substrate. A plurality of cover lids is respectively disposed in the limiting cavities. An adhesive is formed on the cover lids. The first substrate and the second substrate are laminated together with the first alignment mark and the second alignment mark as reference, so that the environmentally sensitive electronic elements are sealed in the adhesive and located between the first substrate and the second substrate. The second substrate and the cover lids are separated from each other.

Abstract: A substrate board, a fabricating method thereof, and a display using the same are provided. The substrate board includes a substrate having at least a rigid area and at least a flexible area, and at least an electronic component disposed on a surface of the substrate, wherein the rigid area is thicker than the flexible area. A patterned high-extensive material may be additionally disposed on the substrate to improve reliability thereof. The rigid area and the flexible area may be formed by molds or cutters. By using an above structure, the electronic component is less affected when the substrate is under stress, so that good characteristics are maintained.

Abstract: A light-emitting device and a method for manufacturing the same are provided. The light-emitting device comprises a substrate, a light-emitting element and a light-electricity-transforming element. The substrate has a first region and a second region which are non-overlapping. The light-emitting element is disposed over the substrate and located in the second region. The light-electricity-transforming element is disposed over the substrate and located in the first region. At least a portion of a side wall of the light-electricity-transforming element corresponds to at least a portion of a side wall of the light-emitting element, so that at least a side light from the light-emitting element is received and transformed into an electricity power by the light-electricity-transforming device.

Abstract: An encapsulation method of an environmentally sensitive electronic element is provided. A first substrate is provided, wherein at least one first alignment mark and a plurality of environmentally sensitive electronic elements are formed on the first substrate. A second substrate is provided, wherein at least one second alignment mark and a plurality of limiting cavities are formed on the second substrate. A plurality of cover lids is respectively disposed in the limiting cavities. An adhesive is formed on the cover lids. The first substrate and the second substrate are laminated together with the first alignment mark and the second alignment mark as reference, so that the environmentally sensitive electronic elements are sealed in the adhesive and located between the first substrate and the second substrate. The second substrate and the cover lids are separated from each other.

Abstract: A package of an environmentally sensitive electronic device including a first substrate, a second substrate, an environmentally sensitive electronic device, a plurality of barrier structures, and a fill is provided. The second substrate is disposed above the first substrate. The environmentally sensitive electronic device is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structures are disposed between the first substrate and the second substrate, wherein the barrier structures surround the environmental sensitive electronic device, and the water vapor transmission rate of the barrier structures is less than 10?1 g/m2/day. The fill is disposed between the first substrate and the second substrate and covers the environmentally sensitive electronic device and the barrier structures.

Abstract: A package of an environmental sensitive element including a flexible substrate, an environmental sensitive element, a flexible sacrificial layer and a packaging structure is provided. The environmental sensitive element is disposed on the flexible substrate. The flexible sacrificial layer is disposed on the environmental sensitive element, wherein the environmental sensitive element includes a plurality of first thin films and the flexible sacrificial layer includes a plurality of second thin films. The bonding strength between two adjacent second thin films is substantially equal to or lower than the bonding strength between two adjacent first thin films. Further, the packaging structure covers the environmental sensitive element and the flexible sacrificial layer.

Abstract: A package of an environmentally sensitive electronic device including a first substrate, a second substrate, an environmentally sensitive electronic device, a plurality of barrier structures, and a fill is provided. The second substrate is disposed above the first substrate. The environmentally sensitive electronic device is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structures are disposed between the first substrate and the second substrate, wherein the barrier structures surround the environmental sensitive electronic device, and the water vapor transmission rate of the barrier structures is less than 10?1 g/m2/day. The fill is disposed between the first substrate and the second substrate and covers the environmentally sensitive electronic device and the barrier structures.

Abstract: A packaging method of an organic light emitting diode (OLED) is described. First, a substrate is provided, and the substrate has the OLED device formed thereon. Thereafter, at least one protection layer is formed on the substrate, so as to cover the peripheral sidewall of the OLED device entirely. The step of forming the protection layer includes forming an organic layer on the substrate, and then forming a metal layer on the organic layer, wherein the metal layer at least covers a sidewall of the OLED device. Afterwards, an oxidation treatment is performed, so as to oxidize a portion of the metal layer.

Abstract: A substrate board, a fabricating method thereof, and a display using the same are provided. The substrate board includes a substrate having at least a rigid area and at least a flexible area, and at least an electronic component disposed on a surface of the substrate, wherein the rigid area is thicker than the flexible area. A patterned high-extensive material may be additionally disposed on the substrate to improve reliability thereof. The rigid area and the flexible area may be formed by molds or cutters. By using an above structure, the electronic component is less affected when the substrate is under stress, so that good characteristics are maintained.

Abstract: An organometallic complex. The organometallic complex has formula (I): wherein A1 is a substituted or non-substituted aromatic heterocyclic group, A2 is a substituted or non-substituted aryl group, A3 is an acetylacetone group or picolinic acid group, and X is selected from the group consisting of fluorine atom, trifluoromethyl, alkoxy, thioalkyl, and amino. The invention also provides an organic electroluminescent device utilizing the organometallic complex.

Abstract: An organometallic complex is provided. The organometallic complex is selected from the group consisting of and wherein C is an acetyl acetone group or picolinic acid group m is 1˜3, n is 0˜3 and m+n=3, wherein D, E and G are the same or different and selected from the group consisting of H, halogen atoms, trifluoromethyl, C1-20 alkyl, C1-20 alkyl halide, C3-10 aryl and C3-20 heterocyclic ring containing O, N or S.

Abstract: A method for fabricating integrated circuit devices, e.g., Flash memory devices, embedded Flash memory devices. The method includes providing a semiconductor substrate, e.g., silicon, silicon on insulator, epitaxial silicon. In a specific embodiment, the semiconductor substrate has a peripheral region and a cell region. The method includes forming a first dielectric layer (e.g., silicon dioxide) having a first thickness overlying a cell region and a second dielectric layer (e.g., silicon dixode) having a second thickness overlying the peripheral region. In a specific embodiment, the cell region is for Flash memory devices and/or other like structures. The method forms a pad oxide layer overlying the first dielectric layer and forms a nitride layer overlying the pad oxide layer.

Abstract: An organometallic complex. The organometallic complex has formula (I): wherein A1 is a substituted or non-substituted aromatic heterocyclic group, A2 is a substituted or non-substituted aryl group, A3 is an acetylacetone group or picolinic acid group, and X is selected from the group consisting of fluorine atom, trifluoromethyl, alkoxy, thioalkyl, and amino. The invention also provides an organic electroluminescent device utilizing the organometallic complex.

Abstract: A method for fabricating integrated circuit devices, e.g., Flash memory devices, embedded Flash memory devices. The method includes providing a semiconductor substrate, e.g., silicon, silicon on insulator, epitaxial silicon. In a specific embodiment, the semiconductor substrate has a peripheral region and a cell region. The method includes forming a first dielectric layer (e.g., silicon dioxide) having a first thickness overlying a cell region and a second dielectric layer (e.g., silicon dixode) having a second thickness overlying the peripheral region. In a specific embodiment, the cell region is for Flash memory devices and/or other like structures. The method forms a pad oxide layer overlying the first dielectric layer and forms a nitride layer overlying the pad oxide layer.

Abstract: An organometallic complex. The organometallic complex has formula (I): wherein M is a transition metal comprising Ir, Pt, Pd, or Rh, A is a C3-20 aryl, C3-20 cycloalkyl, or C3-20 heterocyclic ring containing O, N, or S, R1˜R4 are the same or different and comprise H, halogen atoms, trifluoromethyl, C1-10 alkyl, C3-10 aryl, C3-10 cycloalkyl, or C3-10 heterocyclic ring containing O, N, or S, C is an acetyl acetone group or picolinic acid group wherein D, E, and F are the same or different and comprise H, halogen atoms, trifluoromethyl, C1-20 alkyl, C1-20 alkyl halide, C3-10 aryl, or C3-20 heterocyclic ring containing O, N, or S, and when M is Ir or Rh, m is 1˜3, n is 0˜3, and m+n=3 and when M is Pt or Pd, m is 1˜2, n is 0˜2, and m+n=2. The invention also provides an organic electroluminescent device utilizing the organometallic complex.

Abstract: The present invention discloses a bandpass amplifier having gain and bandpass performance. The bandpass amplifier includes an input match unit for matching the gain of the amplifier and having a first filter response; a first bias unit electrically connected to the input match unit for driving the first terminal of the amplifier and having a first high pass filter response; a gain stage electrically connected to the first bias unit for providing the flat gain of the amplifier; a second bias unit electrically connected to the gain stage for driving the second terminal of the amplifier and having a second high pass filter response; and an output match unit electrically connected to the second bias unit for matching the gain of the amplifier and having a second filter response.

Abstract: Method and apparatus for drying a moving web utilizing one or more air caps each including an apertured plate together with a high pressure plenum which is arranged to deliver high pressure air through the apertures in the plate to impinge against the web. The geometry of the plates, their spacing from the web and the positioning of exhaust means are correlated to provide a minimum amount of cross flow interference thereby improving the heat transfer and ultimately the efficiency of the drying operation.