Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Abstract: An apparatus for inspecting wafer carriers is disclosed. In one example, the apparatus includes: a housing; a load port; a robot arm inside the housing; and a processor. The load port is configured to load a wafer carrier into the housing. The robot arm is configured to move a first camera connected to the robot arm. The first camera is configured to capture a plurality of images of the wafer carrier. The processor is configured to process the plurality of images to inspect the wafer carrier.

Abstract: A method includes initiating a gas flow of a first gas parallel to a wall of an interface module to create an air curtain across an opening defined in the wall. The method includes moving an interface door to reveal the opening, wherein the air curtain restrains a second gas within the interface module from passing through the opening. The method includes transferring a semiconductor wafer through the opening and moving the interface door to cover the opening. The method includes halting the gas flow of the first gas after moving the interface door to cover the opening.

Abstract: A lithography method to pattern a first semiconductor wafer is disclosed. An optical mask is positioned over the first semiconductor wafer. A first region of the first semiconductor wafer is patterned by directing light from a light source through transparent regions of the optical mask. A second region of the first semiconductor wafer is patterned by directing energy from an energy source to the second region, wherein the patterning of the second region comprises direct-beam writing.

Abstract: Provided are a display panel and a display device. The display panel includes a display region and a non-display region. The display region surrounds at least part of the non-display region. The non-display region includes an element disposition region and a bank disposition region surrounding at least part of the element disposition region. The bank disposition region is provided with a bank. The display panel includes a substrate, the bank is disposed on a side of the substrate; a light-emitting layer located on a side of the bank facing away from the substrate and including a first light-emitting portion located in the bank disposition region; and a first light-shielding structure located in the bank disposition region and on a side of the first light-emitting portion facing the substrate. The first light-emitting portion and the first light-shielding structure at least partially overlap along the thickness direction of the display panel.

Abstract: A data transmission method, applied to the terminal device of a data transmission system includes: determining a data service scenario corresponding to the terminal device; obtaining a data transmission strategy corresponding to the data service scenario, the data transmission strategy being implemented by scheduling dual subscriber identity modules of the terminal device; and transmitting to-be-transmitted data to the network-side device according to the data transmission strategy.

Abstract: In certain embodiments, a system includes: an inspection station configured to receive a die vessel, wherein the inspection station is configured to inspect the die vessel for defects; a desiccant station configured to receive the die vessel from the inspection station, wherein the desiccant station is configured to add a desiccant to the die vessel; a bundle station configured to receive the die vessel from the desiccant station, wherein the bundle station is configured to combine the die vessel with another die vessel as a die bundle; and a bagging station configured to receive the die bundle from the bundle station, wherein the bagging station is configured to dispose the die bundle in a die bag and to heat seal the die bag with the die bundle inside.

Abstract: A method includes: receiving a defect map from a defect scanner, wherein the defect map comprises at least one defect location of a semiconductor workpiece; annotating the defect map with a reference fiducial location of the semiconductor workpiece; determining a detected fiducial location within image data of the semiconductor workpiece; determining an offset correction based on comparing the detected fiducial location with the reference fiducial location; producing a corrected defect map by applying the offset correction to the defect map, wherein the applying the offset correction translocates the at least one defect location; and transferring the corrected defect map to a defect reviewer configured to perform root cause analysis based on the corrected defect map.

Abstract: A cooling controller receives, from one or more sensors, wafer information associated with a wafer. The cooling controller determines a pattern mask area for the wafer based on the wafer information. The cooling controller determines a cooling time for the wafer based on the pattern mask area. The cooling controller causes a cooling plate to cool the wafer for a time duration equal to the cooling time. Determining the cooling time for a wafer based on a pattern mask area provides stable and consistent wafer temperatures for wafers having different mask and layout properties, which reduces mask overlay variation and increases wafer yield.

Abstract: A system and method for cleaning ring frames is disclosed. In one embodiment, a ring frame processing system includes: a plurality of blades for mechanically removing tapes and tape residues from surfaces of a ring frame; a plurality of wheel brushes for conditioning the surfaces of the ring frame; and a transport mechanism for transporting the ring frame.

Abstract: A method and an apparatus for controlling a transmission power, and a storage medium. The method includes: determining a target number of transmission cycles according to a service scenario of an electronic device, wherein a preset time window is divided into the target number of transmission cycles, and the preset time window is a test cycle used in a specific absorption rate (SAR) test of the electronic device; determining at least one of an upper limit value or a lower limit value of a transmission power corresponding to each transmission cycle, wherein an average value of transmission powers in the preset time window complies a SAR requirement; and controlling the electronic device to transmit and receive signals using a corresponding transmission power in each transmission cycle.

Abstract: A system comprises a front opening universal pod (FOUP) configured to hold one or more semiconductor wafers and a load dock having a stage and a receiving portion extending above the stage. The FOUP is positioned on the stage. A fan filter unit (FFU) positioned above the load dock. An air flow optimizer device is disposed on the receiving portion and under the FFU. The air flow optimizer device has an inlet opening and an outlet opening and a channel extends between the inlet opening and the outlet opening.

Abstract: A cleaning apparatus, method, and dry chamber are provided for cleaning a wafer carrier that holds wafers as part of a semiconductor fabrication process. The cleaning apparatus includes a wet chamber that receives the wafer carrier to be washed and a reservoir in fluid communication with the wet chamber. The reservoir stores a cleaning liquid that is introduced to the wafer carrier within the wet chamber during a washing operation, and a dry chamber is spaced apart from the wet chamber. The dry chamber receives the wafer carrier after the wafer carrier is washed in the wet chamber and holds the wafer carrier during a drying operation. A transport system transports the wafer carrier between the wet chamber and the dry chamber during a cleaning process.

Abstract: The present disclosure provides an embodiment of a semiconductor fabrication system. The semiconductor fabrication system includes an equipment front end module with a load port to transfer semiconductor wafers to the equipment front end module from a wafer carrier; and a wafer humidity control device embedded in the equipment front end module and configured to generate an air curtain to protect the semiconductor wafers. The wafer humidity control device further includes a gas entry layer with a gas inlet to receive a gas; a uniform layer integrated with the gas entry layer and designed to redistribute the gas; and a diversion structure having multiple pieces assembled together to hold the uniform layer and integrated with the gas entry layer.

Abstract: A method and an apparatus for adjusting antenna radiation power includes adjusting antenna radiation power includes: acquiring a power index identification of a triggered SAR sensor group; acquiring target radiation power corresponding to the power index identification according to a first mapping relationship; and determining a corresponding radiator according to a second mapping relationship and the SAR sensor group and adjusting radiation power of the radiator into the target radiation power. The method and apparatus may be incorporated in an electronic device.

Abstract: A cleaning apparatus, method, and dry chamber are provided for cleaning a wafer carrier that holds wafers as part of a semiconductor fabrication process. The cleaning apparatus includes a wet chamber that receives the wafer carrier to be washed and a reservoir in fluid communication with the wet chamber. The reservoir stores a cleaning liquid that is introduced to the wafer carrier within the wet chamber during a washing operation, and a dry chamber is spaced apart from the wet chamber. The dry chamber receives the wafer carrier after the wafer carrier is washed in the wet chamber and holds the wafer carrier during a drying operation. A transport system transports the wafer carrier between the wet chamber and the dry chamber during a cleaning process.

Abstract: In certain embodiments, a workstation includes: a cleaning station configured to clean a die vessel, wherein the die vessel is configured to secure a semiconductor die; an inspection station configured to inspect the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and a conveyor configured to move the die vessel between the cleaning station and the inspection station.

Abstract: A cleaning apparatus, method, and dry chamber are provided for cleaning a wafer carrier that holds wafers as part of a semiconductor fabrication process. The cleaning apparatus includes a wet chamber that receives the wafer carrier to be washed and a reservoir in fluid communication with the wet chamber. The reservoir stores a cleaning liquid that is introduced to the wafer carrier within the wet chamber during a washing operation, and a dry chamber is spaced apart from the wet chamber. The dry chamber receives the wafer carrier after the wafer carrier is washed in the wet chamber and holds the wafer carrier during a drying operation. A transport system transports the wafer carrier between the wet chamber and the dry chamber during a cleaning process.

Abstract: An apparatus for handling wafer carriers in a semiconductor fabrication facility (FAB) is disclosed. In one example, the apparatus includes: a table configured to receive a wafer carrier having a first door and operable to hold a plurality of wafers; an opening mechanism configured to open the first door of the wafer carrier; and a door storage space configured to store the first door. The apparatus may be either located on a floor of the FAB or physically coupled to a ceiling of the FAB.

Abstract: A power control method includes: receiving a protocol data unit (PDU) session establishment request sent by a terminal device; determining a target service type carried by a PDU session corresponding to the PDU session establishment request according to a data type tag carried by the PDU session establishment request; determining a target receiving power corresponding to the target service type according to the target service type and a configured receiving power of a base station; sending the target receiving power corresponding to the target service type to the terminal device.