Patents by Inventor Shui Liu

Shui Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11075104
    Abstract: A semiconductor chuck is provided. The semiconductor chuck includes a metal base and a first adhesive layer over the metal base. The semiconductor chuck includes a dielectric layer over the first adhesive layer, wherein the dielectric layer is adhered to the metal base by the first adhesive layer. The semiconductor chuck includes a removable protective plate over the dielectric layer, wherein a first portion of the removable protective plate covers a top surface of the dielectric layer.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: July 27, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Fu-Zen Lin, Chien-Hsiang Chen, Chih-Shen Yang, Hsu-Shui Liu, Cheng-Yi Huang
  • Patent number: 11017010
    Abstract: The embodiments of the disclosure disclose an intelligent playing method and apparatus based on preference feedback. An embodiment of the method comprises: receiving voice feedback on currently played multimedia from a user; analyzing a user intention based on the voice feedback; calculating, in response to the user intention indicating updating a currently played multimedia list, a similarity between multimedia in a multimedia database and the current multimedia; and updating the currently played multimedia list based on the voice feedback and the similarity. The embodiment improves the quality and pertinence in playing multimedia.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: May 25, 2021
    Assignee: Baidu Online Network Technology (Beijing) Co., Ltd.
    Inventors: Guang Lu, Shui Liu, Xiajun Luo, Shiquan Ye, Qiang Ju, Jian Xie
  • Patent number: 11004720
    Abstract: A system and method for cleaning and inspecting ring frames is disclosed here. In one embodiment, a ring frame processing system includes: a cleaning station configured to remove a first tape on a first surface of a ring frame using a first blade, clean first adhesive residues from the first tape on the first surface of the ring frame using a first wheel brush, and remove second adhesive residues from a second tape on a second surface of the ring frame using a second blade; and an inspection station, wherein the inspection station comprises an automated optical inspection system configured to determine the cleanness of the first and second surfaces of the ring frame after cleaning.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: May 11, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo, Jian-Hung Chen, Meng-Chen Lin, Chung-Hsin Chien, Hsuan Lee, Boris Huang
  • Publication number: 20210121439
    Abstract: Provided is use of tectorigenin in the preparation of a medicament for treatment of chicken necrotic enteritis. Using tectorigenin for treating chicken necrotic enteritis can significantly reduce the degree of pathological changes in the intestinal tract of chickens with necrotic enteritis, and has a good therapeutic effect on chicken necrotic enteritis caused by Clostridium perfringens.
    Type: Application
    Filed: May 14, 2019
    Publication date: April 29, 2021
    Applicants: SHANDONG GUANGYUAN PHARMACEUTICAL SCI. & TECH.CO., LTD, SHANDONG JINZHUJI PHARMACEUTICAL CO., LTD
    Inventors: Yunfeng HOU, Xuming DENG, Chuanjin ZHANG, Shui LIU, Jianfeng WANG, Youzhi LI, Jing NIE, Junping ZHU, Guizhen WANG, Yong ZHANG, Xiaoye FAN, Jian ZHANG, Tingting WANG, Yonglin ZHOU, Qianghua LV
  • Patent number: 10991625
    Abstract: Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: April 27, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Sheng Kuo, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo, Yang-Ann Chu
  • Patent number: 10971386
    Abstract: A method for positioning a mobile device relative to a stationary device in a semiconductor manufacturing environment is disclosed. The method includes detecting a target affixed to the stationary device at a target location, wherein the target location corresponds to a location of the target relative to a reference point on the stationary device, determining a first position coordinate offset value based upon detecting the target, and moving the mobile device, using the first position coordinate offset value, relative to train the mobile device to move relative to the stationary device for the stationary device to performing a semiconductor manufacturing operation.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: April 6, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Yan-Han Chen, Cheng-Kang Hu, Ren-Hau Wu, Cheng-Hung Chen, Feng-Kuang Wu, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo
  • Patent number: 10965327
    Abstract: A terminal includes: a first baseband processor, a second baseband processor, a first radio frequency chip, a second radio frequency chip, a first antenna, a second antenna, a third antenna, and a fourth antenna. The first baseband processor is connected to the first antenna and the second antenna by using the first radio frequency chip. The first radio frequency chip is connected to the first antenna to form a first channel, and is connected to the second antenna to form a second channel. The second baseband processor is connected to the third antenna and the fourth antenna by using the second radio frequency chip. The second radio frequency chip is connected to the third antenna to form a third channel, and is connected to the fourth antenna to form a fourth channel.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: March 30, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Li Shen, Bangshi Yin, Kun Li, Songping Yao, Anmin Xu, Shumin Liu, Shui Liu
  • Publication number: 20210082718
    Abstract: A method for positioning a mobile device relative to a stationary device in a semiconductor manufacturing environment is disclosed. The method includes detecting a target affixed to the stationary device at a target location, wherein the target location corresponds to a location of the target relative to a reference point on the stationary device, determining a first position coordinate offset value based upon detecting the target, and moving the mobile device, using the first position coordinate offset value, relative to train the mobile device to move relative to the stationary device for the stationary device to performing a semiconductor manufacturing operation.
    Type: Application
    Filed: September 17, 2019
    Publication date: March 18, 2021
    Inventors: Yan-Han CHEN, Cheng-Kang HU, Ren-Hau WU, Cheng-Hung CHEN, Feng-Kuang WU, Hsu-Shui LIU, Jiun-Rong PAI, Shou-Wen KUO
  • Publication number: 20210066108
    Abstract: A semiconductor chuck is provided. The semiconductor chuck includes a metal base and a first adhesive layer over the metal base. The semiconductor chuck includes a dielectric layer over the first adhesive layer, wherein the dielectric layer is adhered to the metal base by the first adhesive layer. The semiconductor chuck includes a removable protective plate over the dielectric layer, wherein a first portion of the removable protective plate covers a top surface of the dielectric layer.
    Type: Application
    Filed: August 27, 2019
    Publication date: March 4, 2021
    Inventors: Fu-Zen Lin, Chien-Hsiang Chen, Chih-Shen Yang, Hsu-Shui Liu, Cheng-Yi Huang
  • Publication number: 20210065347
    Abstract: A method includes: receiving a defect map from a defect scanner, wherein the defect map comprises at least one defect location of a semiconductor workpiece; annotating the defect map with a reference fiducial location of the semiconductor workpiece; determining a detected fiducial location within image data of the semiconductor workpiece; determining an offset correction based on comparing the detected fiducial location with the reference fiducial location; producing a corrected defect map by applying the offset correction to the defect map, wherein the applying the offset correction translocates the at least one defect location; and transferring the corrected defect map to a defect reviewer configured to perform root cause analysis based on the corrected defect map.
    Type: Application
    Filed: November 16, 2020
    Publication date: March 4, 2021
    Inventors: Chien-Ko LIAO, Ya-Hsun HSUEH, Sheng-Hsiang CHUANG, Hsu-Shui LIU, Jiun-Rong PAI, Shou-Wen KUO
  • Publication number: 20210063984
    Abstract: A semiconductor equipment management method applicable to an electronic device for managing multiple pieces of semiconductor equipment is provided. The pieces of semiconductor equipment are respectively controlled through multiple control hosts, and the control hosts and the electronic device are connected to a switch device. The method includes: receiving real-time image information of each control host through the switch device; determining whether the real-time image information of each control host includes a triggering event by performing an image recognition on the real-time image information; executing a macro corresponding to the triggering event, where the macro includes at least one self-defined operation; generating at least one input command according to the self-defined operation of the executed macro; and controlling the control hosts to execute the self-defined operation of the executed macro by transmitting the input command to the control hosts through the switch device.
    Type: Application
    Filed: November 16, 2020
    Publication date: March 4, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sing-Tsung Li, Hsu-Shui Liu, Jiun-Rong Pai, Sheng-Hsiang Chuang, Shou-Wen Kuo, Chien-Ko Liao
  • Publication number: 20210043481
    Abstract: The present disclosure relates to an equipment front end module (EFEM) teaching element. The EFEM teaching element includes a memory element configured to store data describing an initial position of an EFEM robot within an EFEM chamber. A position measurement device is configured to take measurements describing a new position of the EFEM robot within the EFEM chamber that is different than the initial position of the EFEM robot. A controller is configured to determine a set of new movement commands describing a path of the EFEM robot based upon the data describing the initial position of the EFEM robot and the measurements.
    Type: Application
    Filed: October 28, 2020
    Publication date: February 11, 2021
    Inventors: Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo
  • Patent number: 10876976
    Abstract: The present disclosure provides an apparatus for substrate inspection, including a chamber, a movable holder in the chamber and configured to hold a substrate and transfer the substrate between a first position and a second position, a first inspector under the first position and the second position in the chamber, and configured to inspect a backside of the substrate, a lifter under the second position in the chamber, and configured to support the substrate and move the substrate from the second position to a third position, and a second inspector near the third position in the chamber and configured to inspect an edge of the substrate at the third position.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: December 29, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Bo-Han Shih, Sheng-Hsiang Chuang, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo
  • Patent number: 10872794
    Abstract: A system and method for inline detection of defects on a semiconductor wafer surface during a semiconductor device manufacturing process is disclosed herein. In one embodiment, a method includes: automatically transporting the wafer from a first processing station to an inspection station; scanning a wafer surface using a camera in the inspection station; generating at least one image of the wafer surface; analyzing the at least one image to detect defects on the wafer surface based on a set of predetermined criteria; if the wafer is determined to be defective, automatically transporting the wafer from the inspection station to a stocker; and if the wafer is determined to be not defective, automatically transporting the wafer to a second processing station for further processing in accordance with the semiconductor device manufacturing process.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: December 22, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Ko Liao, Hsu-Shui Liu, Jiun-Rong Pai, Sheng-Hsiang Chuang, Shou-Wen Kuo, Ya Hsun Hsueh
  • Patent number: 10861723
    Abstract: The present disclosure relates to a method of automatically re-programming an EFEM to account for positional changes of the EFEM robot. In some embodiments, the method is performed by determining an initial position of an EFEM robot within an EFEM chamber. The EFEM robot at the initial position moves along a first plurality of steps defined relative to the initial position and that extend along a path between a first position and a second position. Positional parameters are determined, which describe a change between an initial position and a new position of the EFEM robot that is different than the initial position. A second plurality of steps are determined based upon the positional parameters. The EFEM robot at the new position moves along the second plurality of steps defined relative to the new position and that extend along the path between the first position and the second position.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: December 8, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo
  • Patent number: 10852704
    Abstract: A semiconductor equipment management method applicable to an electronic device for managing multiple pieces of semiconductor equipment is provided. The pieces of semiconductor equipment are respectively controlled through multiple control hosts, and the control hosts and the electronic device are connected to a switch device. The method includes: receiving real-time image information of each control host through the switch device; determining whether the real-time image information of each control host includes a triggering event by performing an image recognition on the real-time image information; executing a macro corresponding to the triggering event, where the macro includes at least one self-defined operation; generating at least one input command according to the self-defined operation of the executed macro; and controlling the control hosts to execute the self-defined operation of the executed macro by transmitting the input command to the control hosts through the switch device.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: December 1, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sing-Tsung Li, Hsu-Shui Liu, Jiun-Rong Pai, Sheng-Hsiang Chuang, Shou-Wen Kuo, Chien-Ko Liao
  • Patent number: 10839507
    Abstract: A method includes: receiving a defect map from a defect scanner, wherein the defect map comprises at least one defect location of a semiconductor workpiece; annotating the defect map with a reference fiducial location of the semiconductor workpiece; determining a detected fiducial location within image data of the semiconductor workpiece; determining an offset correction based on comparing the detected fiducial location with the reference fiducial location; producing a corrected defect map by applying the offset correction to the defect map, wherein the applying the offset correction translocates the at least one defect location; and transferring the corrected defect map to a defect reviewer configured to perform root cause analysis based on the corrected defect map.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: November 17, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Ko Liao, Ya-Hsun Hsueh, Sheng-Hsiang Chuang, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo
  • Publication number: 20200343115
    Abstract: An apparatus for inspecting wafer carriers is disclosed. In one example, the apparatus includes: a housing; a load port; a robot arm inside the housing; and a processor. The load port is configured to load a wafer carrier into the housing. The robot arm is configured to move a first camera connected to the robot arm. The first camera is configured to capture a plurality of images of the wafer carrier. The processor is configured to process the plurality of images to inspect the wafer carrier.
    Type: Application
    Filed: July 13, 2020
    Publication date: October 29, 2020
    Inventors: Cheng-Kang HU, Shou-Wen KUO, Sheng-Hsiang CHUANG, Jiun-Rong PAI, Hsu-Shui LIU
  • Publication number: 20200251367
    Abstract: The present disclosure, in some embodiments, relates to an integrated chip processing tool. The integrated chip processing tool includes a first transfer module and a second transfer module. The first transfer module has a first robotic arm disposed within a housing. The first transfer module is configured to receive a single and unitary first die tray configured to hold a plurality of integrated chip (IC) die and to concurrently transfer all of the plurality of IC die held by the single and unitary first die tray to a single and unitary die boat. The second transfer module has an additional robotic arm disposed within the housing and configured to concurrently transfer all of the plurality of IC die from the single and unitary die boat to a single and unitary second die tray.
    Type: Application
    Filed: April 21, 2020
    Publication date: August 6, 2020
    Inventors: Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Pin-Yi Hsin, Shou-Wen Kuo, Patrick Lin
  • Patent number: 10734206
    Abstract: Some embodiments relate to a system. The system includes a radio frequency (RF) generator configured to output a RF signal. A transmission line is coupled to the RF generator. A plasma chamber is coupled to RF generator via the transmission line, wherein the plasma chamber is configured to generate a plasma based on the RF signal. A micro-arc detecting element is configured to determine whether a micro-arc has occurred in the plasma chamber based on the RF signal.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: August 4, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Feng-Kuang Wu, Chih-Kuo Chang, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo, Sing-Tsung Li