Patents by Inventor Shuichi Oka
Shuichi Oka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145506Abstract: The present technology relates to a semiconductor package and an electronic device capable of providing a semiconductor package capable of enhancing reliability and suppressing characteristic deterioration by adopting a configuration that absorbs a difference in thermal expansion coefficient between a substrate and a cover glass. A semiconductor package includes a substrate, a chip disposed on the substrate, a frame disposed on the substrate so as to surround the chip, and a cover glass disposed on the frame, in which the frame includes a composition of two or more kinds of materials. Alternatively, the frame has a cavity, and the cavity has different sizes between a side of the substrate and a side of the cover glass. The present technology is applicable to, for example, a semiconductor package including an imaging element as a chip.Type: ApplicationFiled: January 14, 2022Publication date: May 2, 2024Inventor: SHUICHI OKA
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Publication number: 20240145901Abstract: The present invention relates to a semiconductor device and an electronic device that facilitate calibration and can obtain favorable characteristics. The semiconductor device includes a substrate, a millimeter wave antenna provided on the substrate, and an image sensor provided on the substrate, in which an antenna surface of the millimeter wave antenna and a light receiving surface of the image sensor are disposed at spatially partitioned positions. The present technology can be applied to a sensor module.Type: ApplicationFiled: March 2, 2022Publication date: May 2, 2024Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Takahiro IGARASHI, Shuichi OKA, Shun MITARAI
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Publication number: 20240093896Abstract: An information processing device has a control unit that acquires information relating to a fluctuation of power consumed by an electrical product operating around a user, and that estimates a product consumed by the user and a consumption quantity of the product based on the information relating to the fluctuation in the power.Type: ApplicationFiled: November 29, 2023Publication date: March 21, 2024Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Toyokazu NAKASHIMA, Takayuki HATORI, Shuichi SAWADA, Daiki KUBO, Tomoki ISHIKAWA, Naoya OKA
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Publication number: 20230135956Abstract: Provided is a semiconductor device enabling the flatness of a glass substrate to be maintained and enabling the end portion of the glass substrate to be sufficiently protected. A semiconductor device according to the present disclosure includes a glass substrate that includes a first surface, a second surface provided on the opposite side of the first surface, and a first side surface provided between the first surface and the second surface, a wiring that is provided on the first and second surfaces, a metal film that covers the first side surface, and a frame that is provided further on the outer side than the metal film, and that is bonded to the metal film at the first side surfaces.Type: ApplicationFiled: March 16, 2021Publication date: May 4, 2023Inventors: SUSUMU HOGYOKU, SHINYA MORITA, REI TAKAMORI, SHUICHI OKA
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Publication number: 20230125605Abstract: Provided is a semiconductor device capable of maintaining the flatness of a glass substrate and sufficiently protecting an end portion of the glass substrate. A semiconductor device according to one aspect of the present disclosure includes: a glass substrate including a first surface, a second surface opposite to the first surface, and a first side surface between the first surface and the second surface; wirings provided on the first and second surfaces; a first insulating film that covers the first surface; a second insulating film that covers the second surface; and a third insulating film that covers the first side surface, the third insulating film being continuous with at least one of the first and second insulating films.Type: ApplicationFiled: March 23, 2021Publication date: April 27, 2023Inventors: YUTO TANAKA, SHUICHI OKA, SHUN MITARAI, KIWAMU ADACHI, TAKAHIRO IGARASHI, HIIZU OHTORII, NAOKI KAKOIYAMA, KOUSUKE SEKI, HIROYUKI SHIGETA
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Publication number: 20220149099Abstract: To eliminate influence caused by a difference in coefficient of linear expansion between a substrate and another material, and to secure a stable mounting structure of a semiconductor element. A semiconductor device includes a glass substrate and the semiconductor element. The glass substrate includes a through hole that penetrates front and back surfaces. Furthermore, the glass substrate includes a stepped portion on an outer periphery of the through hole. The semiconductor element is joined to the stepped portion of the glass substrate. For example, in a case where an imaging element is used as the semiconductor element, image quality of an image obtained by imaging is improved by preventing defocus of light incident on the imaging element.Type: ApplicationFiled: January 9, 2020Publication date: May 12, 2022Inventors: NAOKI KAKOIYAMA, SHUICHI OKA
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Publication number: 20220120768Abstract: The present disclosure provides a dry reagent and a method that enable fibrinogen determination without dilution of the sample. More specifically, the present disclosure provides a fibrinogen measurement dry reagent of an undiluted sample comprising: (i) thrombin or a protein having thrombin activity; (ii) magnetic particles; (iii) a fibrin monomer polymerization inhibitor; (iv) a calcium salt; (v) a dry reagent layer solubility improving agent; (vi) a dry reagent layer reinforcing material; and (vii) a buffer and a method for fibrinogen determination.Type: ApplicationFiled: December 5, 2019Publication date: April 21, 2022Inventors: Takashi NISHIYAMA, Kazuya NAKAMOTO, Masayoshi KIKUCHI, Takayoshi TORAMI, Shuichi OKA
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Publication number: 20220102831Abstract: An antenna device and a wireless communication apparatus capable of implementing increase in bandwidth and reduction of the manufacturing cost are provided. The antenna device includes a first antenna element and a second antenna element arranged on one face side of the first antenna element. The first antenna element includes a first glass substrate and a first patch antenna provided on the first glass substrate. The second antenna element includes a second glass substrate and a second patch antenna provided on the second glass substrate. At least part of the first patch antenna faces the second patch antenna with an air gap interposed therebetween.Type: ApplicationFiled: December 13, 2019Publication date: March 31, 2022Inventors: TAKAHIRO IGARASHI, NAOKI KAKOIYAMA, SHUICHI OKA, SHUSAKU YANAGAWA
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Patent number: 10830972Abstract: An optical connector includes a core block, a flexible wiring board, an optical device array, a drive circuit, and a housing. The core block has a plurality of faces. The flexible wiring board has an external connection terminal, a first area arranged on a first face of the core block, and a second area arranged on a second face of the core block. The optical device array is mounted on the first area of the flexible wiring board and includes at least one group of a plurality of optical devices for transmission and a plurality of optical devices for reception arranged. The drive circuit is mounted on the second area of the flexible wiring board and drives the optical device array. The housing stores the core block, the optical device array, and the drive circuit such that the external connection terminal of the flexible wiring board is arranged outside the housing.Type: GrantFiled: December 20, 2016Date of Patent: November 10, 2020Assignee: Sony CorporationInventors: Eiji Otani, Shuichi Oka, Hiizu Ootorii
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Patent number: 10634862Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.Type: GrantFiled: November 26, 2018Date of Patent: April 28, 2020Assignee: Sony CorporationInventors: Shinji Rokuhara, Shusaku Yanagawa, Eiji Otani, Shuichi Oka, Kazunao Oniki, Hiizu Ootorii
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Patent number: 10483413Abstract: A photoelectric module of the present disclosure includes an optical device including an optical function element array made of a first base material, and a plurality of light emitting/receiving elements made of a second base material, wherein the optical function element array includes an optical substrate and a plurality of optical function elements, the optical substrate having a first surface and a second surface, and the optical function elements being integrated with the optical substrate and being arranged one-dimensionally or two-dimensionally, and the light emitting/receiving elements and their respective optical function elements face each other with the optical substrate in between to be located on a same axis in a direction perpendicular to the optical substrate, and the light emitting/receiving elements are disposed on the second surface with a space in between while being separated in units of a smaller number than array number in the optical function element array.Type: GrantFiled: April 23, 2015Date of Patent: November 19, 2019Assignee: Sony CorporationInventors: Hiizu Ootorii, Kazunao Oniki, Koki Uchino, Hideyuki Suzuki, Hiroshi Ozaki, Kazuki Sano, Eiji Otani, Shinji Rokuhara, Kiwamu Adachi, Shuichi Oka, Shusaku Yanagawa, Hiroshi Morita, Takeshi Ogura
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Patent number: 10410884Abstract: A method of manufacturing a wiring substrate that has a wiring including a through glass via and is formed of a glass substrate includes forming an alteration layer that penetrates the wiring substrate and is patterned, forming the wiring on a front surface of the wiring substrate in which the alteration layer has been formed, and filling an electrode material in a hole formed by removing the alteration layer, thereby forming the through glass via that connects the wiring on the front surface of the wiring substrate and the wiring on a back surface side thereof.Type: GrantFiled: June 27, 2017Date of Patent: September 10, 2019Assignee: Sony CorporationInventors: Shun Mitarai, Shusaku Yanagawa, Shinji Rokuhara, Shuichi Oka
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Publication number: 20190094477Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.Type: ApplicationFiled: November 26, 2018Publication date: March 28, 2019Inventors: Shinji Rokuhara, Shusaku Yanagawa, Eiji Otani, Shuichi Oka, Kazunao Oniki, Hiizu Ootorii
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Publication number: 20190064458Abstract: An optical connector includes a core block, a flexible wiring board, an optical device array, a drive circuit, and a housing. The core block has a plurality of faces. The flexible wiring board has an external connection terminal, a first area arranged on a first face of the core block, and a second area arranged on a second face of the core block. The optical device array is mounted on the first area of the flexible wiring board and includes at least one group of a a plurality of optical devices for transmission and a plurality of optical devices for reception arranged. The drive circuit is mounted on the second area of the flexible wiring board and drives the optical device array. The housing stores the core block, the optical device array, and the drive circuit such that the external connection terminal of the flexible wiring board is arranged outside the housing.Type: ApplicationFiled: December 20, 2016Publication date: February 28, 2019Applicant: SONY CORPORATIONInventors: Eiji OTANI, Shuichi OKA, Hiizu OOTORII
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Patent number: 10168498Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.Type: GrantFiled: April 3, 2017Date of Patent: January 1, 2019Assignee: Sony CorporationInventors: Shinji Rokuhara, Shusaku Yanagawa, Eiji Otani, Shuichi Oka, Kazunao Oniki, Hiizu Ootorii
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Patent number: 10134662Abstract: A method of manufacturing a mounting substrate according to an embodiment of the present technology includes the following three steps: (1) a step of forming a plurality of electrodes on a semiconductor layer, and thereafter forming one of solder bumps at a position facing each of the electrodes; (2) a step of covering the solder bumps with a coating layer, and thereafter selectively etching the semiconductor layer with use of the coating layer as a mask to separate the semiconductor layer into a plurality of elements; and (3) a step of removing the coating layer, and thereafter mounting the elements on a wiring substrate to direct the solder bumps toward the wiring substrate, thereby forming the mounting substrate.Type: GrantFiled: September 8, 2015Date of Patent: November 20, 2018Assignee: Sony CorporationInventors: Kiwamu Adachi, Katsuji Matsumoto, Takeshi Kodama, Shuichi Oka, Hiizu Ootorii, Kazunari Saitou, Kei Satou
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Patent number: 10109571Abstract: A wiring substrate includes a laminated sheet including a first conductor pattern, an inorganic dielectric layer, and a second conductor pattern. The first conductor pattern, the inorganic dielectric layer, and the second conductor pattern are laminated in this order. Also, the first conductor pattern is divided into a plurality of regions.Type: GrantFiled: September 28, 2016Date of Patent: October 23, 2018Assignees: FUJITSU LIMITED, SONY CORPORATIONInventors: Kei Fukui, Kazuya Arai, Koji Komemura, Kazuhiko Iijima, Kenichiro Abe, Shinji Rokuhara, Shuichi Oka
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Patent number: 9929199Abstract: There is provided a radiation detector including: a plurality of photoelectric conversion devices, each photoelectric conversion device formed at least partially within an embedding layer and having a light receiving surface situated at least partially outside of the embedding layer, and a plurality of scintillator crystals, at least a first scintillator crystal of the plurality of scintillator crystals in contact with at least one light receiving surface at a proximal end, wherein a cross-section of the first scintillator crystal at the proximal end is smaller than a cross-section of the first scintillator crystal at a distal end.Type: GrantFiled: August 21, 2014Date of Patent: March 27, 2018Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Takahiro Igarashi, Izuho Hatada, Takeshi Kodama, Kiwamu Adachi, Shuichi Oka, Shun Mitarai, Hiizu Ootorii, Shusaku Yanagawa, Katsuji Matsumoto
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Publication number: 20170301558Abstract: A method of manufacturing a wiring substrate that has a wiring including a through glass via and is formed of a glass substrate includes forming an alteration layer that penetrates the wiring substrate and is patterned, forming the wiring on a front surface of the wiring substrate in which the alteration layer has been formed, and filling an electrode material in a hole formed by removing the alteration layer, thereby forming the through glass via that connects the wiring on the front surface of the wiring substrate and the wiring on a back surface side thereof.Type: ApplicationFiled: June 27, 2017Publication date: October 19, 2017Inventors: Shun Mitarai, Shusaku Yanagawa, Shinji Rokuhara, Shuichi Oka
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Publication number: 20170287823Abstract: A method of manufacturing a mounting substrate according to an embodiment of the present technology includes the following three steps: (1) a step of forming a plurality of electrodes on a semiconductor layer, and thereafter forming one of solder bumps at a position facing each of the electrodes; (2) a step of covering the solder bumps with a coating layer, and thereafter selectively etching the semiconductor layer with use of the coating layer as a mask to separate the semiconductor layer into a plurality of elements; and (3) a step of removing the coating layer, and thereafter mounting the elements on a wiring substrate to direct the solder bumps toward the wiring substrate, thereby forming the mounting substrate.Type: ApplicationFiled: September 8, 2015Publication date: October 5, 2017Applicant: Sony CorporationInventors: Kiwamu Adachi, Katsuji Matsumoto, Takeshi Kodama, Shuichi Oka, Hiizu Ootorii, Kazunari Saitou, Kei Satou