Patents by Inventor Shuichi Oka

Shuichi Oka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7889027
    Abstract: An object is to provide a film bulk acoustic resonator capable of improving resonant characteristics by reducing the generation of a standing wave to be caused by a transverse-mode acoustic wave to a minimum. In a film bulk acoustic resonator including a resonant portion A having a piezoelectric material layer 3 sandwiched between a first electrode 2 and a second electrode 4, the resonant portion A is configured to have a planar shape that is an ellipse having a part thereof cut off along a straight line L. The straight line L intersects at least one of a minor axis and a major axis of the ellipse, and preferably intersects both the minor axis and the major axis, and passes through the center of the ellipse.
    Type: Grant
    Filed: July 5, 2006
    Date of Patent: February 15, 2011
    Assignee: Sony Corporation
    Inventors: Shuichi Oka, Terukazu Ohno
  • Publication number: 20100208439
    Abstract: Disclosed herein is a wiring board including: a shield layer; and n layers (n is an integer of two or more) of inductor wiring formed above the shield layer and forming an inductor; wherein of the n layers of inductor wiring, the inductor wiring closest to the shield layer has a smallest wiring area.
    Type: Application
    Filed: January 15, 2010
    Publication date: August 19, 2010
    Applicant: Sony Corporation
    Inventor: Shuichi OKA
  • Publication number: 20100156565
    Abstract: An object is to provide a film bulk acoustic resonator capable of improving resonant characteristics by reducing the generation of a standing wave to be caused by a transverse-mode acoustic wave to a minimum. In a film bulk acoustic resonator including a resonant portion A having a piezoelectric material layer 3 sandwiched between a first electrode 2 and a second electrode 4, the resonant portion A is configured to have a planar shape that is an ellipse having a part thereof cut off along a straight line L. The straight line L intersects at least one of a minor axis and a major axis of the ellipse, and preferably intersects both the minor axis and the major axis, and passes through the center of the ellipse.
    Type: Application
    Filed: July 5, 2006
    Publication date: June 24, 2010
    Applicant: SONY CORPORATION
    Inventors: Shuichi Oka, Terukazu Ohno
  • Publication number: 20090309185
    Abstract: Disclosed herein is an inductor module including a substrate functioning as a printed wiring board or an interposer; an IC mounting part formed on a surface of the substrate; an inductor which is formed in the substrate at such a position as to overlap with the IC mounting part on a plan-view basis and which is connected to an IC mounted on the IC mounting part; and a magnetic body including a magnetic material selected from among a NiZn ferrite, a NiZnCu ferrite and a Ba ferrite, the magnetic body being disposed intermediately between the IC mounting part and the inductor.
    Type: Application
    Filed: June 10, 2009
    Publication date: December 17, 2009
    Applicant: Sony Corporation
    Inventors: Shuichi OKA, Katsuji MATSUMOTO, Shusaku YANAGAWA
  • Patent number: 7629200
    Abstract: A fingerprint detection device has a fingerprint sensor chip and a diamond-like carbon (DLC) film covering the outermost surface of the sensor chip. The DLC film provides sufficient strength and enhanced electrostatic discharge withstand voltage to the fingerprint sensor chip. Thus, the DLC film protects the fingerprint sensor chip without any conventional protective cover. The DLC film is less scratchable and less stainable. Since the fingerprint detection device has no protective cover, the device can be provided in a thin and compact form. In addition, the device has high reliability.
    Type: Grant
    Filed: March 19, 2007
    Date of Patent: December 8, 2009
    Assignee: Sony Corporation
    Inventors: Seiichi Miyai, Shuichi Oka
  • Publication number: 20070269922
    Abstract: A fingerprint detection device has a fingerprint sensor chip and a diamond-like carbon (DLC) film covering the outermost surface of the sensor chip. The DLC film provides sufficient strength and enhanced electrostatic discharge withstand voltage to the fingerprint sensor chip. Thus, the DLC film protects the fingerprint sensor chip without any conventional protective cover. The DLC film is less scratchable and less stainable. Since the fingerprint detection device has no protective cover, the device can be provided in a thin and compact form. In addition, the device has high reliability.
    Type: Application
    Filed: March 19, 2007
    Publication date: November 22, 2007
    Inventors: Seiichi Miyai, Shuichi Oka
  • Publication number: 20070247268
    Abstract: An inductor element includes a substrate of magnetic material, a coil, and a layer of magnetic material. The coil of conductive material is formed on the substrate. The layer of magnetic material is so formed by aerosol deposition as to enclose the coil on the substrate of magnetic material.
    Type: Application
    Filed: February 27, 2007
    Publication date: October 25, 2007
    Inventors: Yoichi Oya, Shusaku Yanagawa, Shuichi Oka
  • Patent number: 7250774
    Abstract: The present invention relates to a fingerprints detection apparatus by a capacitance detection method. The fingerprints detection apparatus of the present invention includes a sensor portion in which an insulating protection film is formed so as to cover detection electrodes arranged like an array, and the detection electrodes and the wiring beneath the detection electrodes are formed of a refractory metal or a compound of the refractory metal. This structure heightens the Vickers hardness of the detection electrodes and the wiring. This makes it possible to provide a highly reliable fingerprints detection apparatus in which a tolerance to cracks of the insulating protection film in the sensor portion is improved.
    Type: Grant
    Filed: September 11, 2002
    Date of Patent: July 31, 2007
    Assignee: Sony Corporation
    Inventor: Shuichi Oka
  • Patent number: 7235853
    Abstract: A fingerprint detection device has a fingerprint sensor chip and a diamond-like carbon (DLC) film covering the outermost surface of the sensor chip. The DLC film provides sufficient strength and enhanced electrostatic discharge withstand voltage to the fingerprint sensor chip. Thus, the DLC film protects the fingerprint sensor chip without any conventional protective cover. The DLC film is less scratchable and less stainable. Since the fingerprint detection device has no protective cover, the device can be provided in a thin and compact form. In addition, the device has high reliability.
    Type: Grant
    Filed: June 3, 2005
    Date of Patent: June 26, 2007
    Assignee: Sony Corporation
    Inventors: Seiichi Miyai, Shuichi Oka
  • Publication number: 20050269904
    Abstract: A thin film bulk acoustic resonator is provided in which the spurious caused by a lateral vibration mode is reduced. The thin film bulk acoustic resonator includes a laminated body having a first electrode 12, a piezoelectric layer 13 adjacently formed on an upper surface of the first electrode 12, and a second electrode 14 adjacently formed on an upper surface of the piezoelectric layer 13, and is made such that these first and second electrodes 12 and 14 have boundary surfaces contacting with air, in which the whole end surface of the piezoelectric layer 13 is made to exist inside the first electrode 12 and second electrode 14.
    Type: Application
    Filed: June 2, 2005
    Publication date: December 8, 2005
    Inventor: Shuichi Oka
  • Publication number: 20050259853
    Abstract: A fingerprint detection device has a fingerprint sensor chip and a diamond-like carbon (DLC) film covering the outermost surface of the sensor chip. The DLC film provides sufficient strength and enhanced electrostatic discharge withstand voltage to the fingerprint sensor chip. Thus, the DLC film protects the fingerprint sensor chip without any conventional protective cover. The DLC film is less scratchable and less stainable. Since the fingerprint detection device has no protective cover, the device can be provided in a thin and compact form. In addition, the device has high reliability.
    Type: Application
    Filed: June 3, 2005
    Publication date: November 24, 2005
    Inventors: Seiichi Miyai, Shuichi Oka
  • Patent number: 6960790
    Abstract: A fingerprint detection device has a fingerprint sensor chip and a diamond-like carbon (DLC) film covering the outermost surface of the sensor chip. The DLC film provides sufficient strength and enhanced electrostatic discharge withstand voltage to the fingerprint sensor chip. Thus, the DLC film protects the fingerprint sensor chip without any conventional protective cover. The DLC film is less scratchable and less stainable. Since the fingerprint detection device has no protective cover, the device can be provided in a thin and compact form. In addition, the device has high reliability.
    Type: Grant
    Filed: August 16, 2002
    Date of Patent: November 1, 2005
    Assignee: Sony Corporation
    Inventors: Seiichi Miyai, Shuichi Oka
  • Publication number: 20040185590
    Abstract: A fingerprint detection device has a fingerprint sensor chip and a diamond-like carbon (DLC) film covering the outennost surface of the sensor chip. The DLC film provides sufficient strength and enhanced electrostatic discharge withstand voltage to the fingerprint sensor chip. Thus, the DLC film protects the fingerprint sensor chip without any conventional protective cover. The DLC film is less scratchable and less stainable. Since the fingerprint detection device has no protective cover, the device can be provided in a thin and compact form. In addition, the device has high reliability.
    Type: Application
    Filed: August 16, 2002
    Publication date: September 23, 2004
    Inventors: Seiichi Miyai, Shuichi Oka
  • Publication number: 20040051155
    Abstract: The present invention relates to a fingerprints detection apparatus by a capacitance detection method. The fingerprints detection apparatus of the present invention includes a sensor portion in which an insulating protection film is formed so as to cover detection electrodes arranged like an array, and the detection electrodes and the wiring beneath the detection electrodes are formed of a refractory metal or a compound of the refractory metal. This structure heightens the Vickers hardness of the detection electrodes and the wiring. This makes it possible to provide a highly reliable fingerprints detection apparatus in which a tolerance to cracks of the insulating protection film in the sensor portion is improved.
    Type: Application
    Filed: September 26, 2003
    Publication date: March 18, 2004
    Inventor: Shuichi Oka
  • Patent number: 6417327
    Abstract: The present invention provides a peptide partially comprising an amino acid sequence of FGF-5 or FGF-5S (i.e., the alternatively spliced form of FGF-5), the peptide being capable of controlling physiological function(s) of FGF-5. A pharmaceutical composition containing the peptide of the invention as an active component may regulate the physiological function(s) of FGF-5 such as regulation of development or growth of a head or body hair, regulation of nutrition or function of a cranial nerve system, regulation of platelets, and/or promotion or inhibition of proliferation or differentiation of a vascular endothelial cell.
    Type: Grant
    Filed: March 22, 2000
    Date of Patent: July 9, 2002
    Assignee: Agency of Industrial Science and Technology
    Inventors: Shuichi Oka, Yoshimitsu Yamazaki, Toru Imamura, Yasuko Fujita, Saori Yamamoto, Yukiko Okita, Kazuo Ozawa, Reiko Akakura, Chikako Ito