Abstract: A three-dimensional measuring device includes a ball-shaped structure, an X-axis measuring module, a Y-axis measuring module and a Z-axis measuring module. The ball-shaped structure is moved and/or rotated in response to a movement of a movable object. The X-axis measuring module includes a first measuring structure and a first position sensor. The first measuring structure is movable along an X-axis direction and contacted with the ball-shaped structure. The Y-axis measuring module includes a second measuring structure and a second position sensor. The second measuring structure is movable along a Y-axis direction and contacted with the ball-shaped structure. The Z-axis measuring module includes a third measuring structure and a third position sensor. The third measuring structure is movable along a Z-axis direction and contacted with the ball-shaped structure.

Abstract: An imaging lens assembly includes a plurality of optical elements and an accommodating assembly, wherein the accommodating assembly is for containing the optical elements. The accommodating assembly includes a conical-shaped light blocking sheet and a lens barrel. The conical-shaped light blocking sheet includes an out-side portion and a conical portion, and the conical portion is connected to the out-side portion. The conical portion includes a conical structure tapered from the out-side portion toward one of an object-side and an image-side along the optical axis. The lens barrel is disposed on one side of the conical portion. The optical elements include a most object-side optical element, a most image-side optical element and at least one optical element. The conical structure of the conical-shaped light blocking sheet is physically contacted with only one of the lens barrel, the most object-side optical element and the most image-side optical element.

Abstract: An imaging lens module with auto focus function includes an imaging lens assembly, an electromagnetic driving component assembly and a lens carrier. The imaging lens assembly has an optical axis. The electromagnetic driving component assembly drives the imaging lens assembly to move in a direction parallel to the optical axis by a Lorentz force. The imaging lens assembly is mounted to the lens carrier such that the imaging lens assembly can be wholly driven by the Lorentz force. The lens carrier includes an object-side part, a mounting structure and a plurality of plate portions. The object-side part includes a tip-end minimal aperture configured for light to travel through; and a tapered surface which surrounds an area tapered off from image side to object side. The mounting structure and the plate portions are configured for at least a part of the electromagnetic driving component assembly to be mounted thereto.

Abstract: A tape laying device includes a tape transmission mechanism, a compaction head mechanism, a cutter mechanism, a heating mechanism and a motion mechanism. The tape transmission mechanism is configured to transmit the pre-impregnated tape. The compaction head mechanism, connected with the tape transmission mechanism, is configured to depress and drive the pre-impregnated tape transmitted by the tape transmission mechanism to follow a moving path so as to adhere the pre-impregnated tape onto the mould surface. The cutter mechanism is configured to cut the pre-impregnated tape. The heating mechanism, disposed downstream to the cutter mechanism, is configured to heat the pre-impregnated tape. The motion mechanism is used to have the cutter mechanism having an active path to move toward the moving path while the cutter mechanism cuts the pre-impregnated tape.

Abstract: An imaging lens assembly module has an optical axis, and includes an optical element set, a light blocking element assembling surface, and a light absorbing layer. The optical element set includes an optical lens element and a light blocking sheet. The optical lens element is a plastic lens element, and includes an optical effective portion and an outer peripheral portion. The light blocking sheet is disposed on the outer peripheral portion, and spaced apart from the outer peripheral portion. The light blocking sheet includes an object-side surface, an image-side surface and an inner opening surface. The inner opening surface surrounds a through hole of the light blocking sheet. The light blocking sheet is disposed on the light blocking element assembling surface. The light absorbing layer is disposed on the image-side surface and for fixing the light blocking sheet on the light blocking element assembling surface.

Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

Abstract: The present disclosure describes a method for forming metallization layers that include a ruthenium metal liner and a cobalt metal fill. The method includes depositing a first dielectric on a substrate having a gate structure and source/drain (S/D) structures, forming an opening in the first dielectric to expose the S/D structures, and depositing a ruthenium metal on bottom and sidewall surfaces of the opening. The method further includes depositing a cobalt metal on the ruthenium metal to fill the opening, reflowing the cobalt metal, and planarizing the cobalt and ruthenium metals to form S/D conductive structures with a top surface coplanar with a top surface of the first dielectric.

Abstract: A device including an inverter circuit, a hysteresis control circuit, and a high-side input level shifter. The inverter circuit having an output and including at least two series connected PMOS transistors connected, at the output, in series to at least two series connected NMOS transistors. The hysteresis control circuit coupled to the output to provide feedback to the at least two series connected PMOS transistors and to the at least two series connected NMOS transistors. The high-side input level shifter connected to gates of the at least two PMOS transistors and configured to shift a low level of an input signal to a higher level and provide the higher level to one or more of the gates of the at least two PMOS transistors.

Abstract: Antibodies, and antigen-binding fragments thereof, that specifically bind to Cluster of Differentiation 1a (CD1a) are provided. Embodiments include uses, and associated methods of using the antibodies, and antigen-binding fragments thereof.

Abstract: A three-dimensional measuring device includes a ball-shaped structure, an X-axis measuring module, a Y-axis measuring module and a Z-axis measuring module. The ball-shaped structure is moved and/or rotated in response to a movement of a movable object. The X-axis measuring module includes a first measuring structure and a first position sensor. The first measuring structure is movable along an X-axis direction and contacted with the ball-shaped structure. The Y-axis measuring module includes a second measuring structure and a second position sensor. The second measuring structure is movable along a Y-axis direction and contacted with the ball-shaped structure. The Z-axis measuring module includes a third measuring structure and a third position sensor. The third measuring structure is movable along a Z-axis direction and contacted with the ball-shaped structure.

Abstract: A method includes forming a fin structure over a substrate; depositing a dummy gate layer over the substrate and the fin structure; depositing a hard mask stack over the dummy gate layer; depositing a photoresist bottom layer over the hard mask stack, wherein the photoresist bottom layer has a first stress; performing an implantation process to the photoresist bottom layer to form an implanted bottom layer with a second stress closer to 0 than the first stress; patterning the implanted bottom layer; patterning the hard mask stack and the dummy gate layer by using the patterned implanted bottom layer as an etch mask to form a dummy gate structure over the fin structure; and replacing the dummy gate structure with a metal gate structure.

Abstract: An imaging lens module with auto focus function includes an imaging lens assembly, an electromagnetic driving component assembly and a lens carrier. The imaging lens assembly has an optical axis. The electromagnetic driving component assembly drives the imaging lens assembly to move in a direction parallel to the optical axis by a Lorentz force. The imaging lens assembly is mounted to the lens carrier such that the imaging lens assembly can be wholly driven by the Lorentz force. The lens carrier includes an object-side part, a mounting structure and a plurality of plate portions. The object-side part includes a tip-end minimal aperture configured for light to travel through; and a tapered surface which surrounds an area tapered off from image side to object side. The mounting structure and the plate portions are configured for at least a part of the electromagnetic driving component assembly to be mounted thereto.

Abstract: An actuator is configured to drive an imaging lens system. The actuator includes a frame portion configured to accommodate the imaging lens system, a supporting portion disposed on the frame portion, a driving portion configured to drive the imaging lens system to move, an optical mark structure disposed on part of the frame portion, the supporting portion or the driving portion and a liquid disposed on the optical mark structure. The supporting portion is configured to support the imaging lens system and give the imaging lens system a degree of freedom of movement with respect to the frame portion. The optical mark structure includes a plurality of optical mark units arranged side by side. The liquid is in physical contact with the imaging lens system, the frame portion, the supporting portion or the driving portion that is adjacent to the optical mark structure.

Abstract: Various techniques pertaining to non-coherent noise reduction for audio enhancement on a multi-microphone mobile device are proposed. A processor receives a plurality of signals from a plurality of audio sensors corresponding to a plurality of channels responsive to sensing by the plurality of audio sensors. The processor then performs a non-coherent noise reduction on one or more signals of the plurality of signals to suppress one or more non-coherent noises in each of the one or more signals based on a respective signal-to-noise ratio (SNR) associated with each of the one or more signals. The processor further combines the plurality of signals subsequent the noise reduction to generate an output signal.

Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.

Abstract: A light-folding element includes an object-side surface, an image-side surface, a reflection surface and a connection surface. The reflection surface is configured to reflect imaging light passing through the object-side surface to the image-side surface. The connection surface is connected to the object-side, image-side and reflection surfaces. The light-folding element has a recessed structure located at the connection surface. The recessed structure is recessed from the connection surface an includes a top end portion, a bottom end portion and a tapered portion located between the top end and bottom end portions. The top end portion is located at an edge of the connection surface. The tapered portion has two tapered edges located on the connection surface. The tapered edges are connected to the top end and bottom end portions. A width of the tapered portion decreases in a direction from the top end portion towards the bottom end portion.

Abstract: A plastic lens element includes an optical effective portion and a peripheral portion. The peripheral portion surrounds the optical effective portion and includes a peripheral surface and an optical inspecting structure. The optical inspecting structure is disposed between the optical effective portion and the peripheral surface and includes a first optical inspecting surface and a second optical inspecting surface. The first optical inspecting surface and the second optical inspecting surface are disposed on two sides of the peripheral portion respectively and correspond to each other.

Abstract: A trench-gate field effect transistor includes a plurality of trenches, a plurality of gate electrode units, and a plurality of source electrode units. Each of the trenches has a first trench region, a second trench region having a width less than that of the first trench region, and a neck trench region extending between the first trench region and the second trench region. Each of the gate electrode units includes a pair of first gate electrode portions disposed in the first trench region, a pair of second gate electrode portions disposed in the neck trench region, and a third gate electrode portion disposed in the second trench region. Each of the source electrode units includes a first source electrode portion disposed between a pair of the first gate electrode portions, and a second source electrode portion connected to the first source electrode portion.

Abstract: A method for manufacturing a semiconductor device includes: forming a patterned structure on a substrate, the patterned structure including a dielectric layer and a dummy gate structure disposed in the dielectric layer; and subjecting the patterned structure to an ion implantation process so as to modulate a profile of the dummy gate structure.