Abstract: An optical reflecting assembly includes a reflective member, a reflective element holder and a structure component. The reflective member includes a reflective surface for folding a light. The reflective element holder includes an assembling surface correspondingly disposed to the reflective member. The structure component is made of a metal material and has a three-dimensional structure, at least one portion of the structure component is inserted in the reflective element holder, and the structure component includes a first supporting wall, a second supporting wall and at least one extending wall. The first supporting wall and the second supporting wall are bent to form a first bending line with an angle. The extending wall and the second supporting wall are bent to form an extending bending line being a non-closed line.

Abstract: An imaging lens assembly module has an optical axis, and includes an optical element set, a light blocking element assembling surface, and a light absorbing layer. The optical element set includes an optical lens element and a light blocking sheet. The optical lens element is a plastic lens element, and includes an optical effective portion and an outer peripheral portion. The light blocking sheet is disposed on the outer peripheral portion, and spaced apart from the outer peripheral portion. The light blocking sheet includes an object-side surface, an image-side surface and an inner opening surface. The inner opening surface surrounds a through hole of the light blocking sheet. The light blocking sheet is disposed on the light blocking element assembling surface. The light absorbing layer is disposed on the image-side surface and for fixing the light blocking sheet on the light blocking element assembling surface.

Abstract: A semiconductor package structure includes a semiconductor die and at least one pillar structure. The semiconductor die has an upper surface and includes at least one conductive pad disposed adjacent to the upper surface. The pillar structure is electrically connected to the conductive pad of the semiconductor die, and defines a recess portion recessed from a side surface of the pillar structure. A conductivity of the pillar structure is greater than a conductivity of the conductive pad.

Abstract: A method for periodically activating a battery unit applied to an electronic device equipped with the battery unit includes steps as follows. A plurality of intervals are defined, wherein each of the intervals has an initial voltage value and a target voltage value, and the initial voltage value is greater than the target voltage value. An activation strategy for each of the intervals is defined. A voltage value of the battery unit is detected. One of the intervals is selected as a selected interval according to the voltage value of the battery unit, wherein the voltage value of the battery unit is less than or equal to the initial voltage value of the selected interval, and the voltage value of the battery unit is greater than the target voltage value of the selected interval. The battery unit is activated according to the activation strategy of the selected interval.

Abstract: A safety stirrup includes a C-shaped frame and a supporting assembly. A pivot portion and a first connecting portion are respectively disposed at two ends of the opening of the frame. An arm with a second connecting portion is pivotally connected to the pivot portion and is selectively connected with the first connecting portion. The supporting assembly consists of a first plate, a second plate with elasticity and a third plate. The third plate is stacked on the bottom portion of the frame. The second plate is stacked on the third plate. The first plate is stacked on the second plate with a higher position of a front end than that of a rear end.

Abstract: The present disclosure provides an optical lens module. By assembling a first lens barrel, an optical folding element and a second lens barrel, the optical lens module can be miniaturized, image quality of the optical lens module in a compact assembly space can be increased, and the size of a light passage opening of a display panel module can be reduced so as to increase consistency of a display area.

Abstract: An imaging lens module with auto focus function includes an imaging lens assembly, an electromagnetic driving component assembly and a lens carrier. The imaging lens assembly has an optical axis. The electromagnetic driving component assembly drives the imaging lens assembly to move in a direction parallel to the optical axis by a Lorentz force. The imaging lens assembly is mounted to the lens carrier such that the imaging lens assembly can be wholly driven by the Lorentz force. The lens carrier includes an object-side part, a mounting structure and a plurality of plate portions. The object-side part includes a tip-end minimal aperture configured for light to travel through; and a tapered surface which surrounds an area tapered off from image side to object side. The mounting structure and the plate portions are configured for at least a part of the electromagnetic driving component assembly to be mounted thereto.

Abstract: An imaging lens system includes a plastic lens element. The plastic lens element includes an optical effective portion and an outer ring portion. The optical axis passes through the optical effective portion. The outer ring portion surrounds the optical effective portion and includes an annular groove structure, a conical surface, a flat abutting portion and a full-circle connecting portion. The annular groove structure is tapered off. Each of the conical surface and the flat abutting portion is located closer to the optical effective portion than the annular groove structure. The flat abutting portion is in physical contact with an optical element. The full-circle connecting portion is connected to the annular groove structure and located farther away from the optical effective portion than the annular groove structure. The annular groove structure has an annular bottom end surface extending in a direction substantially perpendicular to the optical axis.

Abstract: A buckle for harness includes a ring member, a bar member and an elastic sheet. The ring member includes two opposite side portions and a cross portion connected with the side portions. A shaft pivotally connected with the side portions is disposed on the bar member for the bar member rotating relative to the ring member. A protruding portion sticks out from the shaft. The elastic sheet includes a fastened end secured to the ring member and a free end firmly abutting against the protruding portion with a rebounding force generated by the elastic sheet. An angle ? defined between the protruding portion and the free end changes as the bar member rotates. The bar member keeps standing if the angle ? is greater than 90 degrees.

Abstract: An annular optical component includes a plastic element and a metal element disposed on the plastic element. The plastic element includes a plastic part, and the metal element includes a metal part. The plastic part surrounds a central axis of the annular optical component so as to form a central opening. An outer annular surface and an inner annular surface of the annular optical component are opposite to each other. An object-side surface of the annular optical component faces an image-side direction of the annular optical component and is connected to the outer annular surface and the inner annular surface. An image-side surface of the annular optical component faces an image-side direction of the annular optical component and is connected to the outer annular surface and the inner annular surface. The image-side surface and the object-side surface are opposite to each other.

Abstract: A method includes moving a plurality of sensors along a translation path with respect to an ion beam, acquiring sensor signals produced by the plurality of sensors, converting the acquired sensor signals into a data set representative of a two-dimensional (2D) profile of the ion beam, generating a plurality of first one-dimensional (1D) profiles of the ion beam from the data set, generating a plurality of second 1D profiles of the ion beam by spatially inverting each of the plurality of first 1D profiles, generating a plurality of third 1D profiles of the ion beam by superposing first current density values of each of the plurality of first 1D profiles with second current density values of a corresponding one of the plurality of second 1D profiles and determining whether to continue an implantation process with the ion beam in accordance with the plurality of third 1D profiles.

Abstract: A lens driving module includes a base, a shield can, a driving mechanism, a space maintaining element and a damping element. The base has an opening. The shield can is coupled to the base and has a central aperture corresponding to the opening. The driving mechanism is disposed in the shield and configured to drive a lens unit to move. The space maintaining element is in physical contact with the shield can. The space maintaining element includes a plastic frame portion and a metal structure portion. The metal structure portion includes pins extending toward the base. The metal structure portion is insert-molded with the plastic frame portion to form the space maintaining element. The damping element is connected to the pins and the lens unit. The pins of the metal structure portion are located closer to the optical axis than part of the metal structure portion without the pins.

Abstract: The present invention provides novel antibodies that specifically bind to GUCY2c and uses thereof in the treatment of cancer. The present invention further provides novel bispecific antibodies comprising such antibodies and uses thereof in the treatment of cancer.

Abstract: A semiconductor device package includes a first dielectric layer, a conductive pad and an electrical contact. The first dielectric layer has a first surface and a second surface opposite to the first surface. The conductive pad is disposed within the first dielectric layer. The conductive pad includes a first conductive layer and a barrier. The first conductive layer is adjacent to the second surface of the first dielectric layer. The first conductive layer has a first surface facing the first surface of the first dielectric layer and a second surface opposite to the first surface. The second surface of the first conductive layer is exposed from the first dielectric layer. The barrier layer is disposed on the first surface of the first conductive layer. The electrical contact is disposed on the second surface of the first conductive layer of the conductive pad.

Abstract: An imaging lens module with auto focus function includes an imaging lens assembly, an electromagnetic driving component assembly and a lens carrier. The imaging lens assembly has an optical axis. The electromagnetic driving component assembly drives the imaging lens assembly to move in a direction parallel to the optical axis by a Lorentz force. The imaging lens assembly is mounted to the lens carrier such that the imaging lens assembly can be wholly driven by the Lorentz force. The lens carrier includes an object-side part, a mounting structure and a plurality of plate portions. The object-side part includes a tip-end minimal aperture configured for light to travel through; and a tapered surface which surrounds an area tapered off from image side to object side. The mounting structure and the plate portions are configured for at least a part of the electromagnetic driving component assembly to be mounted thereto.

Abstract: A semiconductor package structure includes a semiconductor die and at least one pillar structure. The semiconductor die has an upper surface and includes at least one conductive pad disposed adjacent to the upper surface. The pillar structure is electrically connected to the conductive pad of the semiconductor die, and defines a recess portion recessed from a side surface of the pillar structure. A conductivity of the pillar structure is greater than a conductivity of the conductive pad.

Abstract: A method includes forming a source/drain region in a semiconductor fin; after forming the source/drain region, implanting first impurities into the source/drain region; and after implanting the first impurities, implanting second impurities into the source/drain region. The first impurities have a lower formation enthalpy than the second impurities. The method further includes after implanting the second impurities, annealing the source/drain region.

Abstract: A semiconductor package device includes a transparent carrier, a first patterned conductive layer, a second patterned conductive layer, and a first insulation layer. The transparent carrier has a first surface, a second surface opposite to the first surface and a third surface extended between the first surface and the second surface. The first patterned conductive layer is disposed on the first surface of the transparent carrier. The first patterned conductive layer has a first surface coplanar with the third surface of the transparent carrier. The second patterned conductive layer is disposed on the first surface of the transparent carrier and electrically isolated from the first patterned conductive layer. The first insulation layer is disposed on the transparent carrier and covers the first patterned conductive layer.

Abstract: A lock device includes a shell, a bolt mechanism, a magnetic member, and a magnetic sensing module. The magnetic member is movable with the bolt mechanism. When the bolt mechanism is moved between a locking position and an unlocking position, the magnetic sensing module senses a magnetic force variation of the magnetic member. The lock device further includes a magnetic force generation member disposed on a wall. When a door located at a door-closed position with the bolt mechanism being moved to the locking position is shaken relative to the wall, the magnetic sensing module senses a magnetic force variation of the magnetic force generation member.

Abstract: An imaging lens module includes a plastic barrel, an optical lens assembly and a glue material. The plastic barrel includes an outer object-end surface, an outer image-end surface and an inner tube surface. The inner tube surface connects the outer object-end surface and the outer image-end surface, and includes a plurality of parallel inner surfaces. A plurality of stripe structures are disposed on and protruded from at least one of the parallel inner surfaces, wherein the stripe structures are regularly arranged along a circumferential direction of the parallel inner surface. The optical lens assembly includes a plurality of optical elements disposed in the plastic barrel and arranged along the optical axis, wherein an outer annular surface of at least one of the optical elements is disposed correspondingly to the stripe structures. The glue material is applied among the outer annular surface and the stripe structures.