Abstract: An imaging lens assembly driving module includes a lens carrier, a first molded structure, a second molded structure, a driving mechanism and a mechanical member. The lens carrier defines an optical axis. The first molded structure is disposed correspondingly to the lens carrier and includes a first light blocking structure. The second molded structure is coupled to the first molded structure for forming an inner space, the lens carrier is accommodated in the inner space, and the second molded structure includes a second light blocking structure. The driving mechanism is for driving the lens carrier to move along the optical axis. The mechanical member is for connecting the lens carrier and the first molded structure. The first molded structure is coupled to the second molded structure so that the first light blocking structure and the second light blocking structure form a light passing hole.

Abstract: An assembly structure and a method for manufacturing an assembly structure are provided. The assembly structure includes a wiring structure and a semiconductor element. The wiring structure includes at least one dielectric layer and at least one circuit layer in contact with the at least one dielectric layer, and defines an accommodating recess recessed from a top surface of the wiring structure. The wiring structure has a smooth surface extending from the top surface of the wiring structure to a surface of the accommodating recess. The semiconductor element is disposed in the accommodating recess.

Abstract: Antibodies and antigen binding fragments thereof directed against Staphylococcus aureus (S. aureus) surface determinant antigens and secreted toxins are disclosed. Methods of detecting, diagnosing and treating S. aureus using the antibodies and antigen binding fragments thereof are also provided.

Abstract: A finFET device and methods of forming a finFET device are provided. The method includes depositing a dummy gate over and along sidewalls of a fin extending upwards from a semiconductor substrate, forming a first gate spacer along a sidewall of the dummy gate, and plasma-doping the first gate spacer with carbon to form a carbon-doped gate spacer. The method further includes forming a source/drain region adjacent a channel region of the fin and diffusing carbon from the carbon-doped gate spacer into a first region of the fin to provide a first carbon-doped region. The first carbon-doped region is disposed between at least a portion of the source/drain region and the channel region of the fin.

Abstract: A metal-oxide semiconductor module includes multiple metal-oxide semiconductor components separated from one another by at least one first trench. Each of the metal-oxide semiconductor components includes a heavily doped semiconductor layer which includes a drain region, an epitaxial layer which is formed with an indentation such that the drain region is partially exposed from the epitaxial layer, and a metallic patterned contact unit. The epitaxial layer also includes a source region and a gate region that are spaced-apart formed therein. The metallic patterned contact unit includes source, gate, and drain patterned contacts which are electrically connected to the source, gate, and drain regions, respectively. A light-emitting diode display device including the metal-oxide semiconductor module is also disclosed.

Abstract: An illumination device, a projection system and operation methods thereof are provided. The illumination device includes a controller, a light source device, a phosphor wheel, a cooling device, and a temperature sensor. The light source device is configured to generate an illumination beam according to a light source control signal. The phosphor wheel is configured to convert the illumination beam into a conversion beam, adjust a rotation speed of the phosphor wheel according to a phosphor wheel control signal, and generate a rotation speed status signal. The temperature sensor is configured to sense a temperature value of the phosphor wheel to generate a temperature status signal. The cooling device is configured to adjust a cooling capacity according to a cooling control signal. The controller generates the cooling control signal according to the temperature status signal, the rotation speed status signal, and the light source control signal.

Abstract: An optical lens assembly has a central axis and includes at least one dual molded lens element. The dual molded lens element includes a light transmitting portion and a light absorbing portion, wherein the light transmitting portion includes an optical effective region and a lens peripheral region, and the lens peripheral region surrounds the optical effective region. The light absorbing portion surrounds the optical effective region. The light transmitting portion and the light absorbing portion are made of different plastic materials with different colors, and are integrally formed by an injection molding. The light transmitting portion or the light absorbing portion includes a plurality of annular convex structures, and the annular convex structures surround the central axis.

Abstract: An illumination system including a laser light source, a phosphor wheel, a first light detection module, a first light sensing device, and a controller is provided. A first color region boundary is formed between the first and second color regions of the phosphor wheel. The first light sensing component is located downstream of the optical path of the phosphor wheel. During the period in which the first color region is cut into the optical path of the laser beam, the laser beam passes through the first color region and is sensed with first laser beam timing information by the first light sensing component. The controller determines a first displacement value between the first label and the first color region boundary according to the first laser beam timing information and the reference color timing information. A projection device and a color wheel calibrating method are also provided.

Abstract: A manufacturing method of a semiconductor device, comprises the following steps: providing a semiconductor substrate; forming a dummy insulation layer and a dummy electrode sequentially stacked on the semiconductor substrate; forming spacers on sidewalls of the dummy electrode; removing the dummy electrode to exposes inner sidewalls of the spacers; and performing an ion implantation process to the inner sidewalls of the spacers and the dummy insulation layer.

Abstract: An imaging lens assembly includes a plastic barrel and an optical element set. The optical element set includes an optical lens element, a light blocking sheet and a light-shielding layer. At least one surface of an object-side peripheral surface and an image-side peripheral surface of the optical lens element includes an annular side wall. An annular abutting surface of the light blocking sheet and the annular side wall of the optical lens element are disposed correspondingly to each other. The light-shielding layer surrounds a central opening of the light blocking sheet and includes an annular concave-curved portion. The annular concave-curved portion is for retaining the light blocking sheet, so that there is no relative displacement in a direction parallel to an optical axis between the annular abutting surface of the light blocking sheet and the annular side wall of the optical lens element.

Abstract: An imaging lens assembly has an optical axis, and includes a plurality of optical elements. The optical elements include a light blocking sheet, and the light blocking sheet includes a through hole surface, a first surface, a second surface, a peripheral surface and a plurality of basin structures. The through hole surface surrounds the optical axis. The first surface and the second surface are connected to and surround the through hole surface. The peripheral surface is connected to the first surface and the second surface, and the peripheral surface is farther from the optical axis than the through hole surface from the optical axis. The basin structures are arranged in interval and around the optical axis, each of the basin structures is caved in from the first surface to the second surface, and each of the basin structures protrudes on the second surface.

Abstract: The present application relates to a polypropylene with high melt flow index and a method for producing the same, and meltblown fiber fabrics. A reacting mixture is firstly provided, and a polymerization process is performed to the reacting mixture in a slurry reaction system to obtain the polypropylene. The reacting mixture includes propylene monomers, Ziegler-Natta catalysts, organoaluminum compounds and electron donor. The polypropylene has high melt flow index and adjustable melting point and molecular weight distribution, such that it is used to produce the meltblown fiber fabrics.

Abstract: A semiconductor device package includes a first semiconductor device; a second semiconductor device; and a first redistribution layer disposed on the first semiconductor device and having a side wall defining an opening that exposes the first semiconductor device. The side wall of the first redistribution layer has an average surface roughness (Ra) in a range up to 2 micrometers (?m).

Abstract: An electronic device is provide, which includes a body, an image capture device, a display, a motor, at least two sensors, and a processor. The image capture device is rotatably disposed on the body, for capturing an image. The display is disposed on the body of the first side. The motor is electrically connected to the image capture device, for driving the image capture device to rotate with a flip angle to make the image capture device to be located at a first position, a second position, or a position between the first position and the second position. The two sensors are respectively disposed on the image capture device and the body, for sensing the flip angle of the image capture device. The processor is electrically connected to the image capture device, the display, the motor and the at least two sensors, for controlling the motor.

Abstract: A light-folding element includes an object-side surface, an image-side surface, a reflection surface and a connection surface. The reflection surface is configured to reflect imaging light passing through the object-side surface to the image-side surface. The connection surface is connected to the object-side, image-side and reflection surfaces. The light-folding element has a recessed structure located at the connection surface. The recessed structure is recessed from the connection surface an includes a top end portion, a bottom end portion and a tapered portion located between the top end and bottom end portions. The top end portion is located at an edge of the connection surface. The tapered portion has two tapered edges located on the connection surface. The tapered edges are connected to the top end and bottom end portions. A width of the tapered portion decreases in a direction from the top end portion towards the bottom end portion.

Abstract: A manufacturing method of a semiconductor device, comprises the following steps: providing a semiconductor substrate; forming a dummy insulation layer and a dummy electrode sequentially stacked on the semiconductor substrate; forming spacers on sidewalls of the dummy electrode; removing the dummy electrode to exposes inner sidewalls of the spacers; and performing an ion implantation process to the inner sidewalls of the spacers and the dummy insulation layer.

Abstract: An imaging lens system includes an imaging lens assembly, a spacer element and a retaining element. The spacer element is configured to maintain a distance between a first lens element and a second lens element of the imaging lens assembly. The spacer element includes a connecting part connected to the second lens element and a supporting part connected to the connecting part and extending from the connecting part towards an optical axis of the imaging lens assembly. The first lens element is disposed on the supporting part. The retaining element is configured to fix the first lens element to the supporting part. The retaining element includes a retaining surface, and the retaining surface and the first lens element are abutted against each other. There is an air gap between the retaining element and the first lens element, and the air gap is adjacent to the retaining surface.

Abstract: A motor brake module for braking a motor is provided. The motor includes a shell, a shaft portion and a driving portion. The motor brake module includes a brake assembly, a block assembly and an armature assembly. The brake assembly includes a shaft hole, plural teeth and plural openings. The shaft portion passes through the shaft hole, and the shaft portion drives the brake assembly to rotate when the shaft portion is rotated. The armature assembly is connected with the block assembly for driving the block assembly to move between the armature assembly and the brake assembly. When the block assembly is moved toward the brake assembly, a portion of the block assembly is contacted with one of the plural teeth and the other portion of the block assembly passes through one of the plural openings.

Abstract: An imaging lens assembly includes a plastic barrel and an optical element set. The optical element set includes an optical lens element, a light blocking sheet and a light-shielding layer. At least one surface of an object-side peripheral surface and an image-side peripheral surface of the optical lens element includes an annular side wall. An annular abutting surface of the light blocking sheet and the annular side wall of the optical lens element are disposed correspondingly to each other. The light-shielding layer surrounds a central opening of the light blocking sheet and includes an annular concave-curved portion. The annular concave-curved portion is for retaining the light blocking sheet, so that there is no relative displacement in a direction parallel to an optical axis between the annular abutting surface of the light blocking sheet and the annular side wall of the optical lens element.

Abstract: An imaging lens system has an optical axis. The imaging lens system includes a plurality of optical elements, a lens barrel, an optical mark structure and a curable liquid. The optical elements are arranged along the optical axis. The lens barrel surrounds the optical axis, and at least one of the optical elements is accommodated in the lens barrel. The optical mark structure is disposed on the lens barrel, and the optical mark structure includes a plurality of optical mark units arranged side by side along a circumference direction that surrounds the optical axis. The curable liquid is disposed on the optical mark structure. The curable liquid is in physical contact with at least one of the optical mark units, and one of the optical elements adjacent to the optical mark structure is fixed to the lens barrel while the curable liquid is cured.