Abstract: A series-connected fan includes a first fan and a second fan. The first fan includes a first frame, a first base, first static blades and a first impeller. The second fan includes a second frame, a second base, second static blades and a second impeller. A first underframe of the first frame is connected to a second underframe of the second frame. The first static blades are disposed around the first base and connected to the first base and the first underframe. The second static blades are disposed around the second base and connected to the second base and the second underframe. The first impeller includes a first hub and first rotor blades. The second impeller includes a second hub and second rotor blades. The cross-sectional area of the first hub increases along a direction from the top of the first hub to the bottom of the first hub.

Abstract: A three-dimensional printer includes a projector, a tank, and a platform. The projector includes a light source, a digital micromirror device, and a controller. The digital micromirror device includes a micromirror, and the micromirror may be switched between an on state and an off state according to a control signal. The controller is electrically connected to the digital micromirror device and the light source. The controller further includes a judgement unit. The judgement unit may output the control signal to switch the micromirror to the off state when the light source is in the off state. The platform is adjacent to the tank. In addition, a manufacturing method for a three-dimensional printer is provided.

Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

Abstract: In a method of manufacturing a semiconductor device, a layout is prepared. The layout includes active region patterns, each of the active region patterns corresponding to one or two fin structures, first fin cut patterns and second fin cut patterns. At least one pattern selected from the group consisting of the first fin cut patterns and the second fin cut patterns has a non-rectangular shape. The layout is modified by adding one or more dummy active region patterns and by changing the at least one pattern to be a rectangular pattern. Base fin structures are formed according to a modified layout including the active region patterns and the dummy active region patterns. Part of the base fin structures is removed according to one of a modified layout of the first fin cut patterns and a modified layout of the second fin cut patterns.

Abstract: A display device includes: a first substrate including: a switch unit; and a pixel electrode electrically connecting to the switch unit and including: first and second finger portions; a contacting portion electrically connecting to the switch unit through a contact via; a first bending portion between and connecting the first finger portion and the contacting portion, and having a third inner edge; and a second bending portion between and connecting the second finger portion and the contacting portion, and having a fourth inner edge and a second outer edge, wherein the fourth inner edge is between the third inner edge and the second outer edge, a first acute angle included between the third inner edge and a reference line parallel to a first direction substantially parallel to a gate-line-extending direction is greater than a second acute angle included between the second outer edge and the reference line.

Abstract: A contra-rotating fan structure includes a first base, a first fan, a second base, and a second fan. The first fan is rotatably disposed on the first base and includes a first hub. The first hub has a first largest width. The second fan is rotatably disposed on the second base and includes a second hub. The second hub has a second largest width. The first base and the second base are located between the first fan and the second fan. The second largest width is greater than the first largest width.

Abstract: A method includes forming a first mandrel pattern and a second mandrel pattern. The first mandrel pattern includes at least first and second mandrels for a mandrel-spacer double patterning process. The second mandrel pattern includes at least a third mandrel inserted between the first and second mandrels. The first mandrel pattern and the second mandrel pattern include a same material. The first and second mandrels are merged together with the third mandrel to form a single pattern.

Abstract: The disclosure is related to a system for obstacle detection adapted to a self-guiding machine. The system includes a controller for driving the system, a light emitter, and a light sensor. The light emitter and the light sensor are set apart at a distance. When the light emitter emits an indicator light being a vertical linear light projected onto a path the self-guiding machine travels toward, the light sensor senses the indicator light. The vertical linear light is segmented into a first segment projected to a ground and a second segment projected to a floating obstacle when the self-guiding machine approaches the floating obstacle with a height from the ground and the indicator light is projected to the floating obstacle, in which the second segment of the light sensed by the light sensor is determined as the floating obstacle in front of the self-guiding machine.

Abstract: An electronic design flow generates an electronic architectural design layout for analog circuitry from a schematic diagram. The electronic design flow assigns analog circuits of the schematic diagram to various categories of analog circuits. The electronic design flow places various analog standard cells corresponding to these categories of analog circuits into analog placement sites assigned to the analog circuits. These analog standard cells have a uniform cell height which allows these analog standard cells to be readily connected or merged to digital standard cells which decreases the area of the electronic architectural design layout. This uniformity in height between these analog standard cells additionally provides a more reliable yield when compared to non-uniform analog standard cells.

Abstract: A power module including a circuit board, a chip, a first heat-conduction and insulation substrate and a second heat-conduction and insulation substrate is provided. The circuit board includes a board and a metal block embedded in the board and exposed from a first surface and a second surface of the board opposite to one another. The chip is disposed on a side of the second surface of the board corresponding to the metal block, and the chip is electrically and thermally connected to the metal block. The first heat-conduction and insulation substrate is located on a side of the first surface of the board to be disposed on the circuit board. The second heat-conduction and insulation substrate is electrically and thermally connected to the chip.

Abstract: A mixed flow fan includes a bottom base, an outer cover disposed on the bottom base, a motor disposed on the base, and a hub located between the outer case and the motor. The hub includes a first outer surface and a second outer surface connected to the first outer surface and inclined relative to the first outer surface. The slope of the first outer surface relative to the central axis is greater than the slope of the second outer surface relative to the central axis. The base includes a side surface adjacent to the second outer surface. The slope of the side surface relative to the central axis is equal to the slope of the second outer surface relative to the central axis.

Abstract: A method for estimating an position of wireless network equipment, including setting a wireless network transmission parameter, wherein the wireless network transmission parameter includes a transmitting power, a carrier frequency and a spreading factor index, which are used for performing an initial operation setting of wireless network; according to the wireless network transmission parameter, providing a path loss index and a reference distance for simulating an actual wireless network environment; selecting a noise power to simulate a signal state of a transmission path; and according to a field domain, setting a received power threshold to calculate a predetermined transmission distance of wireless network equipment erection.

Abstract: A utility knife is provided, including: a first housing, a second housing, a blade carrier and a locking mechanism. The first housing includes a shaft disposed thereon and having an axis. The second housing is rotatably mounted to the shaft and includes a first engaging portion. The blade carrier is movably received between the first housing and the second housing, and is operable to move. The locking mechanism is disposed through the second housing and non-rotatable relative to the shaft. The locking mechanism is axially slidable between a locking position and a releasing position along the shaft and rotatable about the axis. When the locking mechanism is in the locking position, the second housing is non-rotatable relative to the first housing; when the locking mechanism is in the releasing position, the second housing is rotatable about the locking mechanism and rotatable relative to the first housing.

Abstract: A memory circuit includes a bias voltage generator, a drive circuit, and a resistive random-access memory (RRAM) device. The bias voltage generator includes a first transistor configured to generate a voltage difference based on a first current and an activation voltage, and is configured to output the activation voltage and a bias voltage based on the voltage difference. The drive circuit is configured to receive the bias voltage and output a drive voltage having a voltage level based on the bias voltage, and the RRAM device is configured to receive the activation voltage and conduct a second current responsive to the drive voltage and the activation voltage.

Abstract: A ratchet wrench is provided, including: a main body and a handling assembly. The main body includes a head portion being assembled with a ratchet head and a handling portion remote from the head portion. The handling assembly includes a casing coveringly disposed on the handling portion, and the casing defines a receiving space which is configured to receive at least one object and has at least one opening disposed therethrough. Part of an outer surface of the handling portion is flush with or protrusive beyond the at least one opening, and a material of the handling portion is different from a material of the casing.

Abstract: A semiconductor device includes a first active fin on a substrate; a second active fin on the substrate and separate from the first active fin; and a first fin stub on the substrate, wherein the first fin stub connects a first end of the first active fin and a first end of the second active fin, wherein the fin stub is lower than both the first and the second active fins in height, wherein from a top view the first active fin is oriented lengthwise in a first direction, and the first fin stub is oriented lengthwise in a second direction that is different from the first direction.

Abstract: The disclosure is related to a method and a system for obstacle detection adapted to a self-guiding machine. The method is performed in the system including a controller for driving the system, a light emitter, a light sensor, an image processor and a central processor. The light emitter and the light sensor are set apart at a distance. When the light emitter emits an indicator light being projected onto a path the self-guiding machine travels toward, the light sensor senses the indicator light. An image containing the indicator light is generated. After analyzing the image, at least one feature of the indicator light being sensed can be obtained and used to obtain a spatial relationship between the self-guiding machine and an obstacle. The spatial relationship allows the system to determine if the self-guiding machine will collide with a wall or fall from a cliff.

Abstract: A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.

Abstract: The present disclosure provides a method for semiconductor manufacturing in accordance with some embodiments. The method includes providing a substrate and a patterning layer over the substrate and forming a plurality of openings in the patterning layer. The substrate includes a plurality of features to receive a treatment process. The openings partially overlap with the features from a top view while a portion of the features remains covered by the patterning layer. Each of the openings is free of concave corners. The method further includes performing an opening expanding process to enlarge each of the openings and performing a treatment process to the features through the openings. After the opening expanding process, the openings fully overlap with the features from the top view.