Abstract: Provided are a display substrate and a display device. The display substrate includes: a base substrate; a first electrode; a light-emitting layer; a second electrode; an optical extraction layer; a protective layer; an encapsulation layer including a first intercalation layer and a second intercalation layer The color deviation adjustment layer of display substrate is configured to adjust color deviation of display substrate, so that the color deviation has a maximum value at observation angle in range of 0 to 90 degrees. The color deviation adjustment layer includes a first intercalation layer and a second intercalation layer located in the encapsulation layer. The color deviation adjustment layer also includes one of a film layer taken from the encapsulation layer except for the first intercalation layer and the second intercalation layer, the second electrode, the optical extraction layer, and the protective layer.

Abstract: The disclosure provides an arm-based sphygmomanometer which comprises: a measuring host, a female connector, and a male connector. The measuring host includes a housing, and the female connector is disposed within the housing. The female connector includes a gas manifold member, a hermetic ring disposed within the gas manifold member, and an embedded buckle also disposed within the gas manifold member. There is a deformable clearance between the embedded buckle and the hermetic ring. The embedded buckle includes a brim portion being an annular body and a crown portion extending from a periphery of the brim portion, wherein the crown portion includes a plurality of notches and the notches evenly divide the crown portion to correspondingly form a plurality of buckling pieces, and wherein a protrusion is formed on a foremost end of each of the buckling pieces.

Abstract: A display baseplate and a display panel related to the technical field of display. The display baseplate includes a substrate; a pixel definition layer located on the substrate, wherein the pixel definition layer includes a partition part portion and a plurality of first openings, the partition part comprises a plurality of second openings, and depths of the plurality of first openings along a direction perpendicular to a plane where the substrate is located are greater than depths of the plurality of second openings along the direction perpendicular to the plane where the substrate is located; a plurality of light-emitting units each including a light-emitting functional layer, each first opening is provided with one of the light-emitting functional layers, and at least part of the second openings are provided with the light-emitting functional layers.

Abstract: A light-emitting device includes a first electrode; a second electrode; N light-emitting units stacked between the first electrode and the second electrode; and a connection layer disposed between any two adjacent light-emitting units. A peak of an intrinsic spectrum of at least part of light-emitting units is in a range from 400 nm to 480 nm. A sum of peaks of intrinsic spectra of the N light-emitting units is in a range from N×400 nm to N×480 nm; N?2, and N is a positive integer. A difference between a color coordinate y value of the light-emitting device under a blue image at a preset viewing angle that is in a range from 60° to 75° and a color coordinate y value of the light-emitting device under the blue image at a viewing angle of 0° is in a range from 0 to 0.07.

Abstract: A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.

Abstract: A confined silica/multi-walled carbon nanotube composite material, its preparation method, and application are provided. The preparation method includes the following steps: S1: dispersing multi-walled carbon nanotubes in a methyl-substituted benzene solvent and subjecting them to ultrasonication for 10 minutes at room temperature; S2: after the completion of ultrasonication, adding liquid silicon tetrachloride to the multi-walled carbon nanotube/xylene suspension and continuing ultrasonication for 10 minutes at room temperature; S3: heating the mixture in an oil bath to 145° C. and performing reflux; S4: after the reaction is complete, naturally cooling to room temperature, centrifuging, washing, and drying the obtained solid to obtain a dry sample, thereby obtaining the confined silica/multi-walled carbon nanotube composite material.

Abstract: A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.

Abstract: A display substrate, a mask assembly and a display panel are provided. The display substrate includes: pixel units arranged in an array and including first pixel units and second pixel units, where, in a row direction, the first pixel units and the second pixel units are alternately arranged; in a column direction, the first pixel units and the second pixel units are alternately arranged; the first pixel unit includes a first sub-pixel, two second sub-pixels, and a third sub-pixel in a virtual quadrilateral; the second pixel unit includes a first sub-pixel, two second sub-pixels, and a third sub-pixel in a virtual hexagon; where adjacent first pixel unit and second pixel unit in the column direction share a first sub-pixel or a third sub-pixel, and adjacent first pixel unit and second pixel unit in the row direction share a second sub-pixel.

Abstract: A display panel and a method for manufacturing a display panel, and a display apparatus are provided. The display panel includes a substrate, a driving layer and a light-emitting layer, the driving layer includes a plurality of groups of pixel circuits, the source-drain metal layer of the driving layer includes an auxiliary electrode located on a side of a group of pixel circuits; the light-emitting layer includes a light-emitting device and a transition structure, a second electrode of the light emitting device covers at least a part of the transition structure and is connected to the auxiliary electrode.

Abstract: An ocean current detection device and method based on double-helix and double-core vibration fiber-optic cable, comprises a double-core fiber-optic cable and a ?-OTDR system; the double-core fiber-optic cable comprises a first and a second optical fiber core, provided symmetrically in the double helix structure. The terminate ends of the first and the second optical fiber core are connected, and the start end of the first or the second optical fiber core is connected with the ?-OTDR system. When measuring the ocean current characteristics in the target sea area, the double-core fiber-optic cable is provided underwater to generate vortex-induced vibration. The ?-OTDR system is provided for emitting laser towards the cable, receiving returned double-core vibration signals, extracting vibration characteristics from the double-core vibration signals to determine ocean current characteristics, including ocean current flow velocity and direction, to improve the detection accuracy.

Abstract: A monitoring system and method for broken wires in PCCP based on distributed optical fiber sensing relates to the technical field of optical fiber sensing. The monitoring system for broken wires in PCCP comprises a Sagnac interferometer, a ?-OTDR system, a dual loopback system and a signal processing system. The Sagnac interferometer comprises a first laser, a first optical coupler, a first delay optical fiber, a Faraday rotating mirror and a first photodetector. The ?-OTDR system comprises a second laser, a second optical coupler, an acousto-optic modulator, a circulator, a third optical coupler and a second photodetector. The dual loopback system comprises a wavelength division multiplexer and a second delay optical fiber. The invention solves the problems of low positioning accuracy, limited frequency measurement range, detection dead zone and high computing pressure in monitoring broken wires in PCCP.

Abstract: The present disclosure discloses a combined air-cooling and liquid-cooling refrigeration system and a data center. The combined air-cooling and liquid-cooling refrigeration system at least includes a closed area, a combined device group, a circulating liquid-cooling system, and a plurality of air cooling devices. The combined device group and the circulating liquid-cooling system are installed inside the closed area, and the plurality of air cooling devices are installed outside the closed area. The combined device group includes a first device group and a second device group, and a closed hot aisle is formed between the first device group and the second device group. Both the first device group and the second device group include a plurality of server cabinets. The circulating liquid-cooling system is connected to primary heating sources of the plurality of server cabinets.

Abstract: Embodiments of the present disclosure provide an air-conditioning system for a data center computer room and a control method thereof, belonging to the field of data center technology. The system includes one or more refrigeration subsystems and one or more server clusters, where pipelines of each of the refrigeration subsystem are independent of each other. Each of the refrigeration subsystems includes at least one outdoor refrigeration module and a plurality of indoor heat exchange modules respectively arranged in the server clusters, and the plurality of indoor heat exchange modules are connected in parallel through the pipelines.

Abstract: Disclosed are a method and system for overlay error compensation and a storage medium. The method includes that N wafer groups are provided, wherein each wafer group includes M wafers each including a present and previous layer, and N and M are positive integers greater than or equal to 2; for each wafer, a first overlay error is determined according to device structures of the present and previous layers, and a photoetching compensation value is calculated according to the first overlay error; for each wafer group, a first average compensation value is calculated according to photoetching compensation values; a second average compensation value of the N wafer groups is calculated according to first average compensation values; and in response to that the second average compensation value is within a preset range, the second average compensation value is fed to a batch control system to compensate an (N+1)th wafer group.

Abstract: Provided are a display panel and a manufacturing method thereof and a display device. The display panel includes: a base substrate; a pixel defining layer including first openings defining sub-pixels; an encapsulation layer; and a light modulation layer. The light modulation layer is configured such that light from each of at least one sub-pixel propagates along a direction away from the base substrate after total reflection upon incidence on an interface between the first light modulation portion in a corresponding second opening and the first light modulation sub-layer. The display panel satisfies at least one of a first condition or a second condition. The first condition is that at least a part of edge of the first orthographic projection has a recess. The second condition is that at least a part of edge of the second orthogonal projection has at least one of a recess or a protrusion.

Abstract: An adapter device for a mobile terminal includes: an adapter plug configured to connect to the mobile terminal; a supporting body including a housing portion and a support portion; and an adapter socket connected to the supporting body. The adapter plug is connected to the housing portion. One end of the support portion is connected to the housing portion, and another end of the support portion is configured to be supported on a support surface. When the mobile terminal is charging, an earphone plug can be inserted to play audio of the mobile terminal. Besides, the mobile terminal is provided with stable support through the supporting body, which is convenient for users to watch videos.

Abstract: Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.

Abstract: Embodiments of the present disclosure provide a multi-split air-conditioning system and a method for air conditioning. The system includes a cold source module, a pump driving module and an indoor module connected to a loop through a pipeline, where the cold source module includes a plurality of cold source submodules. Outlet pipelines of the plurality of cold source submodules are connected to an inlet pipeline of the pump driving module. The indoor module includes a plurality of indoor terminals. An outlet pipeline of the pump driving module is connected to inlet pipelines of the plurality of indoor terminals. Outlet pipelines of the plurality of indoor terminals converge and merge, and then are connected to an inlet pipeline of the cold source module.

Abstract: The present disclosure discloses a power distribution room and a refrigeration system. The power distribution room has an accommodation space internally provided with a first heat generating device. The first heat generating device has a vent, and a refrigeration device is connected to the vent of the first heat generating device. The refrigeration device includes a heat exchange apparatus and an induced draft apparatus, where the heat exchange apparatus is positioned between the induced draft apparatus and the vent. The induced draft apparatus is configured to generate an airflow flowing through the first heat generating device to generate hot air transmitted to the heat exchange apparatus, such that the heat exchange apparatus carries out heat exchange to convert the hot air into cold air and discharges the cold air into the accommodation space.

Abstract: A probe head includes a probe seat, and vertical probes each having a head portion including a head portion installation section with a first width, and a probe tip section including a probe tip contact part with a second width smaller than the first width and a probe tip gradually narrowing part which is located between the head portion installation section and the probe tip contact part, gradually narrows from the first width to the second width, and has a first length smaller than a second length of the probe tip contact part. The head portion installation section protrudes out of a lower surface of the probe seat for a length smaller than the sum of the first and second lengths. The vertical probe is great in current withstanding capability, structural strength and life time, and meets the requirement of probing tiny electrically conductive contacts.