Abstract: Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.

Abstract: An electronic device and a knob module thereof are provided. The knob module includes a circuit board, a rotary encoder, a light guide structure, a plurality of light emitting units, and a rotation cover. The rotary encoder is disposed on the circuit board. The light guide structure is disposed on the circuit board. The light guide structure includes a light guide ring and an annular light guide wall. The light guide ring surrounds the rotary encoder. The annular light guide wall extends downward from the light guide ring to abut against the circuit board. The plurality of light emitting units is disposed on the circuit board and located between the annular light guide wall and the rotary encoder for emitting light toward the annular light guide wall. The rotation cover is disposed on the rotary encoder.

Abstract: The present disclosure discloses a method for forming a lead-carbon compound interface layer on a lead-based substrate, wherein the lead-based substrate has a surface, and the method includes steps of: causing an acidic solution to contact with a carbon material and a lead-containing material to form a carbon-containing plumbate precursor having an ionic lead; and reducing the ionic lead in the carbon-containing plumbate precursor to form the lead-carbon compound interface layer on the surface.

Abstract: A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.

Abstract: An electronic device is provided here, which includes a casing, a keycap and a keyboard backlight module. The casing has a first opening. The keycap is disposed corresponding to the first opening, and a gap is formed between the keycap and a periphery of the first opening. The keyboard backlight module includes a shielding layer, the shielding layer includes a light transmission area corresponding to the first opening and a light block portion, and the light block portion is located in the light transmission area and covers a region where at least one light path passes through the gap and intersects the light transmission area through.

Abstract: A method for generating training models includes generating a preliminary training model based on a group of first images, the first images including different types of objects; processing a group of second images with the preliminary model to generate a probability array for each of the second images, the probability array indicating likelihoods that an object is a particular type of object; generating correlations between the different types of objects based on the probability arrays; generating a plurality of object groups based on the correlations, where each object group includes a plurality of different types of objects that have a relatively low correlation with the other types of objects in the same object group; and for each object group, generating a final training model based on a group of third images, the third images each including an object having an object type corresponding to one of the object types.

Abstract: A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.

Abstract: A method for generating training models includes generating a preliminary training model based on a group of first images, the first images including different types of objects; processing a group of second images with the preliminary model to generate a probability array for each of the second images, the probability array indicating likelihoods that an object is a particular type of object; generating correlations between the different types of objects based on the probability arrays; generating a plurality of object groups based on the correlations, where each object group includes a plurality of different types of objects that have a relatively low correlation with the other types of objects in the same object group; and for each object group, generating a final training model based on a group of third images, the third images each including an object having an object type corresponding to one of the object types.

Abstract: The electronic device provided includes a housing with two first through holes and two second through holes, a light guiding structure, and a light source. A first section is provided between the two first through holes, and a second section is provided between the two second through holes. The length of the first section is less than the length of the second section. The light guiding structure includes a light guiding layer, a diffusion layer, and a light adjusting layer. The light adjusting layer is disposed at the position of the first section. The light source is disposed at a position that corresponds to an intersection of the first section and the second section. Light emitted by the light source passes through the light transmitting portion and the intersection, and is separately emitted through the first through holes and the second through holes along the light transmitting portion.

Abstract: The electronic device provided includes a housing with two first through holes and two second through holes, a light guiding structure, and a light source. A first section is provided between the two first through holes, and a second section is provided between the two second through holes. The length of the first section is less than the length of the second section. The light guiding structure includes a light guiding layer, a diffusion layer, and a light adjusting layer. . The light adjusting layer is disposed at the position of the first section. The light source is disposed at a position that corresponds to an intersection of the first section and the second section. Light emitted by the light source passes through the light transmitting portion and the intersection, and is separately emitted through the first through holes and the second through holes along the light transmitting portion.

Abstract: An electronic device is provided here, which includes a casing, a keycap and a keyboard backlight module. The casing has a first opening. The keycap is disposed corresponding to the first opening, and a gap is formed between the keycap and a periphery of the first opening. The keyboard backlight module includes a shielding layer, the shielding layer includes a light transmission area corresponding to the first opening and a light block portion, and the light block portion is located in the light transmission area and covers a region where at least one light path passes through the gap and intersects the light transmission area through.

Abstract: The application provides an ear thermometer with a probe cover ejection device. The ear thermometer comprises a holding body and a measuring assembly disposed at one end of the holding body, which comprises a probe, a rotating member, and a socket. The rotating member includes a ring cover with an opening formed in a middle of the ring cover, at least one first abutting portion axially extended from a lateral side of the ring cover, and a lever portion radially extended from the lateral side of the ring cover. The socket includes a circular bottom surface and a closed section and an open section defined on a periphery of the circular bottom surface, a side wall surface vertically provided on the closed section, an accommodating space sandwiched between the side wall surface and the circular bottom surface, and at least one second abutting portion formed on the circular bottom surface.

Abstract: Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.

Abstract: A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.

Abstract: Provided is a sheet-shaped nitrogen-phosphorus co-doped porous carbon material, prepared and obtained according to the following method: mixing aniline and hexachlorocyclotriphosphazene, undergoing a closed reaction for 2-24 h at a pressure of 1-10 MPa and a temperature of 140-260° C., then pressure is released to atmospheric pressure and steam drying is performed to obtain a solid substance; under inert gas protection, the obtained solid substance is treated for 1-6 h at a high temperature of 400-1000° C., and the finished product is obtained; the sheet-shaped nitrogen-phosphorus co-doped porous carbon material thus provided has excellent electrical properties and may be used for fabricating capacitor electrodes and especially supercapacitor electrodes; thus it may be used in capacitors and especially supercapacitors, and has great application potential and industrial value in the field of energy storage.

Abstract: The present invention pertains to a pharmaceutical, or nutraceutical, “self-emulsifying solid dispersion” composition for oral administration which contains (a) a drug or a nutraceutical that is water-insoluble or poorly water-soluble; (b) at least one surfactant; (c) one carrier selected from the group consisting of silicic acid, a silicate, or any combination thereof; and (d) at least one carbohydrate filler.

Abstract: Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.

Abstract: A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.