Abstract: A device for measuring solution concentration includes housing, a catadioptric structure, an electromagnetic radiation emitter and an electromagnetic radiation detector. The housing is formed with a detecting part for receiving a solution to be detected. The catadioptric structure is received in the housing, and includes a ray entrance portion, a first total internal reflection part, a second total internal reflection part and a ray exit portion. An accommodation part corresponds to the detecting part. The emitter is disposed at one side of the ray entrance portion, and a ray sequentially passes the ray entrance portion, the detecting part, the solution to be detected, and the first total internal reflection part. Then, the ray is totally internally reflected and converged to the second total internal reflection part, and is reflected again. Finally, the ray passes the ray exit portion and is received by the detector.

Abstract: Disclosed is a method for enhancing the effect of an immunotherapy for cancer in a subject, comprising administering to the subject an effective amount of a polysaccharide extract of Astragalus membranaceus. Also disclosed is a method for increasing a subject's pool of M1 macrophages, wherein the subject is suffering from one or more conditions associated with undesirable M2 macrophage activation, the method comprising administering to the subject an effective amount of a polysaccharide extract of Astragalus membranaceus.

Abstract: A cooperative communication method and a cooperative communication system are provided for the transmission between multiple transmission devices and their corresponding receiving devices. In a first phase of a communication period, at least one of the multiple transmission devices performs a first phase precoding on data using a multicasting precoding matrix so as to transmit the data precoded by the first phase precoding to other transmission devices. In a second phase of the communication period, the multiple transmission devices performs a second phase precoding on data received in the first phase using a joint precoding matrix so as to transmit the data precoded by the second phase precoding to the multiple receiving devices corresponding to the multiple transmission devices.

Abstract: Methods and apparatus are provided for controlling communication between a virtualized network and non-virtualized entities using a virtualization gateway. A packet is sent by a virtual machine in the virtualized network to a non-virtualized entity. The packet is routed by the host of the virtual machine to a provider address of the virtualization gateway. The gateway translates the provider address of the gateway to a destination address of the non-virtualized entity and sends the packet to the non-virtualized entity. The non-virtualized entity may be a physical resource, such as a physical server or a storage device. The physical resource may be dedicated to one customer or may be shared among customers.

Abstract: A variable focus lighting fixture includes a fixed sleeve assembly, a moveable sleeve assembly, a light emitting unit, a lens and an actuation assembly. The moveable sleeve assembly penetrates into the fixed sleeve assembly and moves relative to the fixed sleeve assembly. The light emitting unit is secured onto the fixed sleeve assembly. The lens is secured onto the moveable sleeve assembly. The actuation assembly is connected between the moveable sleeve assembly and the fixed sleeve assembly. The actuation assembly includes a spiral curve slot and a sliding pin penetrating into the spiral curve slot. When the moveable sleeve assembly rotates along a central axis of the moveable sleeve assembly, the sliding pin moves along the spiral curve slot to drive the moveable sleeve assembly to move along the axial direction thereof. Accordingly, the projection path of the light from the light emitting unit through the lens is altered.

Abstract: A device for measuring solution concentration includes housing, a catadioptric structure, an electromagnetic radiation emitter and an electromagnetic radiation detector. The housing is formed with a detecting part for receiving a solution to be detected. The catadioptric structure is received in the housing, and includes a ray entrance portion, a first total internal reflection part, a second total internal reflection part and a ray exit portion. An accommodation part corresponds to the detecting part. The emitter is disposed at one side of the ray entrance portion, and a ray sequentially passes the ray entrance portion, the detecting part, the solution to be detected, and the first total internal reflection part. Then, the ray is totally internally reflected and converged to the second total internal reflection part, and is reflected again. Finally, the ray passes the ray exit portion and is received by the detector.

Abstract: An illumination device and the optical lens assembly thereof are provided. The illumination device includes the optical lens assembly, a light source and a driving device. The optical lens assembly includes an inner lens and an outer lens. The inner lens has a reflector having a light emission portion and a light incidence portion. An accommodating space is formed in the reflector adjacent to the light incident portion. The outer lens has a light guiding column and an outer light emission portion connected to the top of the light guiding column. The outer lens is disposed at a side of the inner lens, the light guiding column corresponds to the accommodating space, the outer light emission portion corresponds to the light emission portion. The driving device enables the outer and inner lenses to move toward or away from each other. The guiding column moves relative to the accommodating space.

Abstract: A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.

Abstract: A method is provided for attaching components to pads on a PCB, where total accumulated tolerances are reduced by separating accumulated tolerances into multiple processes. The method includes performing first and second processes having first and second accumulated tolerances, respectively. The first process includes placing a first stencil over the PCB, the first stencil defining first apertures corresponding to the pads; printing solder paste onto the pads using the first stencil; and reflowing the printed solder paste to form corresponding solder bumps on the pads. The second process includes placing a second stencil over the PCB, the second stencil defining second apertures corresponding to the pads; printing flux onto the solder bumps using the second stencil; placing at least one component on the printed flux; and reflowing the printed flux and the solder bumps to form corresponding solder joints between the at least one component and the first pads, respectively.

Abstract: A wafer processing apparatus includes at least one pedestal, at least one ultraviolet (UV) light source, and a window. The pedestal is configured to support a wafer. The UV light source is configured to generate UV radiation to the wafer. The window is present between the pedestal and the UV light source. The UV radiation is capable of passing through the window, and the window is a convex lens, a concave lens, or combinations thereof.

Abstract: A magnetic separator comprising a concurrent tank body and a permanently magnetic barrel, wherein the rotation direction of the permanently magnetic barrel is opposite to the inlet direction of the ore slurry; a stationary magnetic system is provided; the inlet side of the tank body is connected to a tubular ore-feeding box; the included angle of the magnetic system is in the range of 200°-280°; the region of the magnetic system closer to the inlet side of the tank body is a refining region of the magnetic system; at an upstream position in the tank body, a plurality of rinsing water pipes are provided; several spraying nozzles are provided at intervals on the rinsing water pipes; and several stripe-shaped magnetically conductive thin sheets are provided at intervals on an inner wall of the permanently magnetic barrel.

Abstract: A signal transmission module with a USB Type-C socket connector, comprising a circuit substrate, a USB Type-C female electrical connector, a central processing unit, at least one multi-media output device and a power control unit, which are electrically connected to each other, wherein, the central processing unit computes and processes a first signal supplied by the USB Type-C socket connector and generates a second signal, which is transmitted to the multi-media output device, and the power control unit is to regulate an initial electric power, generate an regulated electric power, and transmit it to the circuit substrate, the USB Type-C female electrical connector, the central processing unit and the multi-media output device.

Abstract: A microelectronic assembly may include a substrate including a rigid dielectric layer having electrically conductive elements, a microelectronic element having a plurality of contacts exposed at a face thereof, and conductive vias extending through a compliant dielectric layer overlying the rigid dielectric layer. The vias electrically connect the substrate contacts respectively to the conductive elements, and the substrate contacts are joined respectively to the contacts of the microelectronic element. The vias, compliant layer and substrate contacts are adapted to appreciably relieve stress at the substrate contacts associated with differential thermal contact and expansion of the assembly.

Abstract: A method is provided for attaching components to pads on a PCB, where total accumulated tolerances are reduced by separating accumulated tolerances into multiple processes. The method includes performing first and second processes having first and second accumulated tolerances, respectively. The first process includes placing a first stencil over the PCB, the first stencil defining first apertures corresponding to the pads; printing solder paste onto the pads using the first stencil; and reflowing the printed solder paste to form corresponding solder bumps on the pads. The second process includes placing a second stencil over the PCB, the second stencil defining second apertures corresponding to the pads; printing flux onto the solder bumps using the second stencil; placing at least one component on the printed flux; and reflowing the printed flux and the solder bumps to form corresponding solder joints between the at least one component and the first pads, respectively.

Abstract: Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.

Abstract: A thermoelectric cooling module includes a first circuit board, a second circuit board, first conducting members, second conducting members and TED chips. The first circuit board includes first circuit regions, each having a first conducting layer and first penetrating holes; the second circuit board includes second circuit regions, each having a second conducting layer and second penetrating holes; each first conducting member is passed and fixed into each respective first penetrating hole; each second conducting member is passed and fixed into each respective second penetrating hole; each TED chip is clamped between the first circuit board and the second circuit board, and each first conducting member has an end attached to the TED chip and the other end attached to the first conducting layer, and each second conducting member has an end attached to the TED chip and the other end attached to the second conducting layer.

Abstract: A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.

Abstract: Controlling aggregation of shared content from multiple presenters during an online conference session includes, at a server having network connectivity, at a server having network connectivity, identifying a master presenter at an endpoint among a plurality of endpoints participating in an online conference session in which at least one of the plurality of endpoints is sharing content with other participants among the plurality of participants at their respective endpoints. One or more assistant presenters are determined among the plurality of participants at their respective endpoints. A master user interface is generated to serve as the user interface on the endpoint of the master presenter and a command is received, via the master user interface, to designate a layout. The layout aggregates shared content from the endpoints of one or more of the assistant presenters to make the layout viewable at the plurality of endpoints.

Abstract: A multifunctional signal isolation converter (10) is arranged in a safe area (20), and is applied to an electronic apparatus (40) arranged in a dangerous area (30). The multifunctional signal isolation converter (10) includes a microprocessor (108) and a power supply unit (116). The microprocessor (108) determines whether internal functions of the multifunctional signal isolation converter (10) are normal or not to obtain a first judgment value. The electronic apparatus (40) sends an input signal (42) to the microprocessor (108). The microprocessor (108) determines whether functions of the electronic apparatus (40) are normal or not to obtain a second judgment value according to the input signal (42). The microprocessor (108) controls whether the power supply unit (116) supplies a driving power (122) to the electronic apparatus (40) or not according to the first judgment value and the second judgment value.

Abstract: A thermoelectric cooling module includes a first circuit board, a second circuit board, first conducting members, second conducting members and TED chips. The first circuit board includes first circuit regions, each having a first conducting layer and first penetrating holes; the second circuit board includes second circuit regions, each having a second conducting layer and second penetrating holes; each first conducting member is passed and fixed into each respective first penetrating hole; each second conducting member is passed and fixed into each respective second penetrating hole; each TED chip is clamped between the first circuit board and the second circuit board, and each first conducting member has an end attached to the TED chip and the other end attached to the first conducting layer, and each second conducting member has an end attached to the TED chip and the other end attached to the second conducting layer.