Abstract: A method for adjusting three-dimensional (3D) depth including performing block matching on left-eye/right-eye frames of a stereo video signal to generate a motion vector of a specific object and to obtain 3D depth of the specific object; and adjusting 3D depth of an additive object according to that of the specific object, wherein the additive object is one of a subtitle object, an on screen display (OSD) object or a program guide object.

Abstract: A level transducer has a power supply module, a tuning fork module, a sensing-phase corrector and a controller. The tuning fork module has a tuning fork, at least one piezoelectric driving element, and at least one piezoelectric sensing element. The at least one piezoelectric driving element and the at least one piezoelectric sensing element are stacked on each other, and are mounted on the tuning fork. The power supply module is electrically connected and outputs a voltage to the at least one piezoelectric driving element to deform the at least one piezoelectric driving element. The at least one piezoelectric sensing element is extruded and outputs a voltage signal. The sensing-phase corrector obtains the voltage signal and outputs a clock signal to feedback control the voltage on the at least one piezoelectric driving element to optimize a deformation frequency of each piezoelectric element.

Abstract: Techniques for efficient and secure implementation of network policies in a network interface controller (NIC) in a host computing device operating a virtualized computing environment. In some embodiments, the NIC may process and forward packets directly to their destinations, bypassing a parent partition of the host computing device. In particular, in some embodiments, the NIC may store network policy information to process and forward packets directly to a virtual machine (VM). If the NIC is unable to process a packet, then the NIC may forward the packet to the parent partition. In some embodiments, the NIC may use an encapsulation protocol to transmit address information in packet headers. In some embodiments, this address information may be communicated by the MC to the parent partition via a secure channel. The NIC may also obtain, and decrypt, encrypted addresses from the VMs for routing packets, bypassing the parent partition.

Abstract: A microelectronic package can include wire bonds having bases bonded to respective conductive elements on a substrate and ends opposite the bases. A dielectric encapsulation layer extending from the substrate covers portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds which are uncovered by the encapsulation layer. Unencapsulated portions can be disposed at positions in a pattern having a minimum pitch which is greater than a first minimum pitch between bases of adjacent wire bonds.

Abstract: An electrical connector socket includes an insulating base, a first group of signal terminals, a second group of signal terminals, and a third group of signal terminals. The first group of signal terminals includes first terminals for transmitting a first signal. The second group of signal terminals includes second terminals and third terminals, and the second terminals and the third terminals are used for transmitting a second signal. The third group of signal terminals includes fourth terminals, the second terminals are located between the first group of signal terminals and the third group of signal terminals, the fourth terminals are used for transmitting a third signal, and the first group of signal terminals and the third group of signal terminals are used for transmitting a fourth signal.

Abstract: A distributed hash table infrastructure is described that supports pluggable modules for various services. Transport providers, security providers, and other service providers may be swapped, providing flexibility in supporting various devices and networking configurations.

Abstract: The NH3 plasma treatment by remote plasma is firstly proposed to replace the covalent bonding process during surface modification procedure that for amine bond generation.

Abstract: An electrical connector socket includes an outer frame, an insulating base, first socket terminals, and second socket terminals. The outer frame includes a first and second insert space which respectively meets a first and second standard. The insulating base has a tongue including a first and second tongue portion. The thickness of the first tongue portion is different from that of the second tongue portion. One end of the first socket terminals is embedded in the base, and the other end is disposed at the first tongue portion and faces the first insert space. One end of the second socket terminals is embedded in the base, the other end of part of second socket terminals is disposed at the second tongue portion and faces the first insert space, and the other end of the other part is disposed at the second tongue portion and faces the second insert space.

Abstract: An electric connector includes a main body, a plurality of first terminals, a plurality of second terminals, and a plurality of third terminals. The main body includes a socket, a base, and a tongue. The base is disposed in the socket. The tongue includes a first tongue portion and a second tongue portion. The first tongue portion has a first thickness, and the second tongue portion has a second thickness different from the first thickness. The first terminals are disposed on the first tongue portion for transmitting a first signal meeting the first standard. The second terminals and the third terminals are respectively disposed on the two surface of the second tongue portion for transmitting a second signal meeting the second standard.

Abstract: An electric connector includes an insulating socket, a plurality of first socket terminals, a plurality of second socket terminals, a plurality of third socket terminals, a plurality of fourth socket terminals, a plurality of fifth socket terminals, and a mechanical moving member. The mechanical moving member is disposed between a first position and a second position of an insulating base. When the mechanical moving member is positioned at the first position, part of the third socket terminals are connected to the fifth socket terminals, the second socket terminals and the third socket terminals transmit a second signal meeting a second standard. When the mechanical moving member is positioned at the second position, part of the third socket terminals are connected to the fourth socket terminals, the first socket terminals and part of the third socket terminals transmit a third signal meeting a third standard.

Abstract: A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer extends from the first surface and fills spaces between the wire bonds such that the wire bonds are separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.

Abstract: A structure includes a substrate having a first region and a second region, the substrate also having a first surface and a second surface. Electrically conductive elements are exposed at the first surface within the second region. Wire bonds have bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. At least one of the wire bonds has a shape such that the wire bond defines an axis between the free end and the base thereof and such that the wire bond defines a plane. A bent portion of the at least one wire bond extends away from the axis within the plane. A dielectric encapsulation layer covers portions of the wire bonds such that unencapsulated portions, including the ends, of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer.

Abstract: An electrical connector socket includes an insulating base, a first group of signal terminals, a second group of signal terminals, and a third group of signal terminals. The first group of signal terminals includes first terminals for transmitting a first signal. The second group of signal terminals includes second terminals and third terminals, and the second terminals and the third terminals are used for transmitting a second signal. The third group of signal terminals includes fourth terminals, the second terminals are located between the first group of signal terminals and the third group of signal terminals, the fourth terminals are used for transmitting a third signal, and the first group of signal terminals and the third group of signal terminals are used for transmitting a fourth signal.

Abstract: A testing card includes a power interface, a plurality of serial ports connected to a plurality of test instruments. The microprocessor includes a processing unit having been burnt with a plurality of test programs, the processing unit is configured to execute one of the test programs according a user selection and generate a test command, and a serial ports management unit configured to convert the test command into a control signal, and send the control signal to a corresponding test instrument via the corresponding one of the serial port to control the test instrument to test a target device. An electronic device using the test card is also provided.

Abstract: A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features of the lower unit substrate. The microelectronic package also includes an upper unit including an upper unit substrate having conductive features, top and bottom surfaces and a hole extending between such top and bottom surfaces. The upper unit further includes one or more upper unit chips overlying the top surface of the upper unit substrate and electrically connected to the conductive features of the upper unit substrate by connections extending within the hole. The upper unit may include an upper unit encapsulant that covers the connections of the upper unit and the one or more upper unit chips.

Abstract: An electric connector includes an insulating socket, a plurality of first socket terminals, a plurality of second socket terminals, a plurality of third socket terminals, a plurality of fourth socket terminals, a plurality of fifth socket terminals, and a mechanical moving member. The mechanical moving member is disposed between a first position and a second position of an insulating base. When the mechanical moving member is positioned at the first position, part of the third socket terminals are connected to the fifth socket terminals, the second socket terminals and the third socket terminals transmit a second signal meeting a second standard. When the mechanical moving member is positioned at the second position, part of the third socket terminals are connected to the fourth socket terminals, the first socket terminals and part of the third socket terminals transmit a third signal meeting a third standard.

Abstract: An electric connector includes a main body, a plurality of first terminals, a plurality of second terminals, and a plurality of third terminals. The main body includes a socket, a base, and a tongue. The base is disposed in the socket. The tongue includes a first tongue portion and a second tongue portion. The first tongue portion has a first thickness, and the second tongue portion has a second thickness different from the first thickness. The first terminals are disposed on the first tongue portion for transmitting a first signal meeting the first standard. The second terminals and the third terminals are respectively disposed on the two surface of the second tongue portion for transmitting a second signal meeting the second standard.

Abstract: An electrical connector socket includes an outer frame, an insulating base, first socket terminals, and second socket terminals. The outer frame includes a first and second insert space which respectively meets a first and second standard. The insulating base has a tongue including a first and second tongue portion. The thickness of the first tongue portion is different from that of the second tongue portion. One end of the first socket terminals is embedded in the base, and the other end is disposed at the first tongue portion and faces the first insert space. One end of the second socket terminals is embedded in the base, the other end of part of second socket terminals is disposed at the second tongue portion and faces the first insert space, and the other end of the other part is disposed at the second tongue portion and faces the second insert space.

Abstract: A microelectronic package can include wire bonds having bases bonded to respective ones of conductive elements exposed at a surface of a substrate. The wire bonds may have exterior edge surfaces disposed at an angle between 25° and 92° relative to the bases, and ends remote, e.g., opposite, from the bases, and remote from the ends which are connected to the bases. A dielectric encapsulation layer extends from the substrate and covers portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer, the unencapsulated portions including the ends of the wire bonds.