Abstract: A microelectronic assembly may include a substrate including a rigid dielectric layer having electrically conductive elements, a microelectronic element having a plurality of contacts exposed at a face thereof, and conductive vias extending through a compliant dielectric layer overlying the rigid dielectric layer. The vias electrically connect the substrate contacts respectively to the conductive elements, and the substrate contacts are joined respectively to the contacts of the microelectronic element. The vias, compliant layer and substrate contacts are adapted to appreciably relieve stress at the substrate contacts associated with differential thermal contact and expansion of the assembly.

Abstract: A method is provided for attaching components to pads on a PCB, where total accumulated tolerances are reduced by separating accumulated tolerances into multiple processes. The method includes performing first and second processes having first and second accumulated tolerances, respectively. The first process includes placing a first stencil over the PCB, the first stencil defining first apertures corresponding to the pads; printing solder paste onto the pads using the first stencil; and reflowing the printed solder paste to form corresponding solder bumps on the pads. The second process includes placing a second stencil over the PCB, the second stencil defining second apertures corresponding to the pads; printing flux onto the solder bumps using the second stencil; placing at least one component on the printed flux; and reflowing the printed flux and the solder bumps to form corresponding solder joints between the at least one component and the first pads, respectively.

Abstract: Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.

Abstract: A thermoelectric cooling module includes a first circuit board, a second circuit board, first conducting members, second conducting members and TED chips. The first circuit board includes first circuit regions, each having a first conducting layer and first penetrating holes; the second circuit board includes second circuit regions, each having a second conducting layer and second penetrating holes; each first conducting member is passed and fixed into each respective first penetrating hole; each second conducting member is passed and fixed into each respective second penetrating hole; each TED chip is clamped between the first circuit board and the second circuit board, and each first conducting member has an end attached to the TED chip and the other end attached to the first conducting layer, and each second conducting member has an end attached to the TED chip and the other end attached to the second conducting layer.

Abstract: A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.

Abstract: Controlling aggregation of shared content from multiple presenters during an online conference session includes, at a server having network connectivity, at a server having network connectivity, identifying a master presenter at an endpoint among a plurality of endpoints participating in an online conference session in which at least one of the plurality of endpoints is sharing content with other participants among the plurality of participants at their respective endpoints. One or more assistant presenters are determined among the plurality of participants at their respective endpoints. A master user interface is generated to serve as the user interface on the endpoint of the master presenter and a command is received, via the master user interface, to designate a layout. The layout aggregates shared content from the endpoints of one or more of the assistant presenters to make the layout viewable at the plurality of endpoints.

Abstract: A multifunctional signal isolation converter (10) is arranged in a safe area (20), and is applied to an electronic apparatus (40) arranged in a dangerous area (30). The multifunctional signal isolation converter (10) includes a microprocessor (108) and a power supply unit (116). The microprocessor (108) determines whether internal functions of the multifunctional signal isolation converter (10) are normal or not to obtain a first judgment value. The electronic apparatus (40) sends an input signal (42) to the microprocessor (108). The microprocessor (108) determines whether functions of the electronic apparatus (40) are normal or not to obtain a second judgment value according to the input signal (42). The microprocessor (108) controls whether the power supply unit (116) supplies a driving power (122) to the electronic apparatus (40) or not according to the first judgment value and the second judgment value.

Abstract: A thermoelectric cooling module includes a first circuit board, a second circuit board, first conducting members, second conducting members and TED chips. The first circuit board includes first circuit regions, each having a first conducting layer and first penetrating holes; the second circuit board includes second circuit regions, each having a second conducting layer and second penetrating holes; each first conducting member is passed and fixed into each respective first penetrating hole; each second conducting member is passed and fixed into each respective second penetrating hole; each TED chip is clamped between the first circuit board and the second circuit board, and each first conducting member has an end attached to the TED chip and the other end attached to the first conducting layer, and each second conducting member has an end attached to the TED chip and the other end attached to the second conducting layer.

Abstract: A microelectronic assembly may include a substrate including a rigid dielectric layer having electrically conductive elements, a microelectronic element having a plurality of contacts exposed at a face thereof, and conductive vias extending through a compliant dielectric layer overlying the rigid dielectric layer. The vias electrically connect the substrate contacts respectively to the conductive elements, and the substrate contacts are joined respectively to the contacts of the microelectronic element. The vias, compliant layer and substrate contacts are adapted to appreciably relieve stress at the substrate contacts associated with differential thermal contact and expansion of the assembly.

Abstract: A biosensor device includes a substrate, a sensing transistor, an isolation layer and a main interface layer. The sensing transistor is formed on the substrate and including a bottom gate structure, a top gate structure and a semiconductor layer disposed between the bottom gate structure and the top gate structure. The bottom gate structure is electrically connected to the top gate structure. The isolation layer is formed on the sensing transistor for covering the sensing transistor, and includes a first opening. The main interface layer is disposed in the first opening for receiving biomolecules to be sensed. The main interface layer is electrically connected to the top gate structure.

Abstract: A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.

Abstract: A security camera system for safeguarding a designated area includes at least one camera for encoding and transmitting streaming video of the designated area, and a video receiver for receiving, decoding and analyzing the streaming video for relevant motion, such as movement indicative of the presence of a person. Upon detecting a motion event, the video receiver triggers an alert condition, which results in storing each video steam into memory. Each camera is provided with a PIR detector circuit for measuring infrared radiation within the designated area, the video steam and IR data being transmitted to the receiver via analog communication means to reduce implementation costs. To minimize the risk of false trigger events, the receiver monitors both pixel changes in the streaming video signals as well as measured IR radiation levels within the designated area that fall within the traditional thermal energy range of human body heat.

Abstract: A module includes a circuit package and a top external shield layer. The circuit package includes multiple electronic components on a substrate; at least one side shield structure located at a corresponding at least one side edge region of the circuit package and electrically connected to ground, the at least one side shield structure being positioned on the substrate or on a pad on the substrate; and a molded compound disposed over the substrate, the electronic components, and the at least one side shield structure. The top external shield layer is disposed on a top outer surface of the circuit package and is electrically connected to ground. The at least one side shield structure and the top external shield layer provide an external shield of the module configured to protect the circuit package from external electromagnetic radiation and environmental stress.

Abstract: A pogo stick-type jumping device includes a lower stanchion on which an upper frame is slidably mounted in a coaxial, generally telescoping relationship. A compression spring connects the upper frame to the lower stanchion and receives the energy required to lift the device off the ground during normal operation. A pair of spark mechanisms is fixedly coupled to the upper frame and is resiliently biased into continuous contact with the lower stanchion. Each spark mechanism includes a wheel assembly that rolls along a length of the lower stanchion and continuously engages a pair of internally-housed flints. Accordingly, in use, displacement of the upper frame relative to the lower stanchion causes the wheel assembly for each spark mechanism to frictionally contact the pair of corresponding flints in such a manner so as to produce an externally visible spark condition that has a visual and/or auditory aesthetic.

Abstract: An electrical connector includes a housing and a conductive terminal. The housing includes a terminal slot and an insertion entrance in front of the terminal slot. The conductive terminal is correspondingly mounted in the terminal slot. The conductive terminal comprises a base portion, two side portions and two elastic arms, the base portion extends in a front-rear direction, the two side portions extend upwardly respectively at two sides of a rear end of the base portion, the two elastic arms extend respectively from the two side portions toward the insertion entrance of the housing so that a front end of each elastic arm is close to the insertion entrance. As depicted, a clamping portion is formed close to the front end of each elastic arm by punching a tab therein.

Abstract: A luminous system is disclosure. The luminous system is used for projecting light to a plane and includes a luminous component and an angle-adjustable device. The luminous component is used for generating the light ray. The angle-adjustable device is used for adjusting luminous angle of the light ray. The angle-adjustable device is arranged between the plane and the luminous component and located on the route of the light ray, the angle-adjustable comprises a first lens element, and the first lens element comprises a light-emitting portion and a light-incident portion connected to the light-emitting portion. The light-including portion comprises a recess opposite to the light-emitting portion. An outer diameter of the light-emitting portion is larger than an outer diameter of the light-incident portion, and the outer diameter of the light-incident portion decreases along a direct away from the light-emitting portion.

Abstract: A magnetic separator comprising a concurrent tank body and a permanently magnetic barrel, wherein the rotation direction of the permanently magnetic barrel is opposite to the inlet direction of the ore slurry; a stationary magnetic system is provided; the inlet side of the tank body is connected to a tubular ore-feeding box; the included angle of the magnetic system is in the range of 200°-280°; the region of the magnetic system closer to the inlet side of the tank body is a refining region of the magnetic system; at an upstream position in the tank body, a plurality of rinsing water pipes are provided; several spraying nozzles are provided at intervals on the rinsing water pipes; and several stripe-shaped magnetically conductive thin sheets are provided at intervals on an inner wall of the permanently magnetic barrel.

Abstract: An illumination device includes an optical component and a light-emitting module. The optical component includes a light-transmitting body, a first optical unit, and a second optical unit. The first optical unit has a light input surface and a plurality of surrounding structures surrounding the light input surface and arranged in a pattern of concentric circles, and each surrounding structure has a first surrounding surface and a second surrounding surface. The second optical unit has a spiral structure surrounding the light output surface of the light-transmitting body and a surrounding frame surrounding the light output surface of the light-transmitting body and the spiral structure, and a relative height from a topmost surface of the spiral structure to the light output surface of the light-transmitting body is increased gradually from inner to outer. The light-emitting module is disposed under the light input surface of the first optical unit.

Abstract: A conveying apparatus (10) includes a dynamic axis (20), an idler axis (30), a conveying belt (40), a work-energy conversion wireless monitoring apparatus (50) and at least an on-site wireless controller (60). The on-site wireless controller (60) is used to sense an operation status of the conveying apparatus (10) to generate a sense data (622) and to wirelessly send the sense data (622) to the work-energy conversion wireless monitoring apparatus (50). The work-energy conversion wireless monitoring apparatus (50) includes an electric generator (502), a battery (504), a rotating speed measuring sensor (506), a microprocessor (508) and a transmission antenna (510). The electric generator (502) is coupled to and connected to the idler axis (30). The electric generator (502) is driven with a rotating motion of the idler axis (30) to generate an electricity power. The battery (504) is electrically connected to the electric generator (502).