Patents by Inventor Shunji Aoki

Shunji Aoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9403968
    Abstract: A heavy release additive for a release sheet comprises a condensation reaction product of dehydrative condensation reaction between (A) a polydiorganosiloxane of average polymerization degree of 500 to 10,000 and has at least one hydroxy or hydrolysable group per molecule and (B) a polyorganosiloxane resin composed of a (SiO4/2) unit and a (R3SiO1/2) unit (wherein R's independently represent a C1-12 monovalent hydrocarbon group or a C2-6 alkenyl group each having no aliphatic unsaturated bond), has a ratio of the (R3SiO1/2) unit to the (SiO4/2) unit of 0.6 to 1.2 by mole, and contains the hydroxy group and the hydrolysable group in the total content of 2.1 mass % or more and less than 10.0 mass %. The heavy release additive can have the effect of achieving an extremely great peel force compared with cases in which no additive is added.
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: August 2, 2016
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Toshiaki Ihara, Shunji Aoki, Shinji Irifune
  • Patent number: 9365746
    Abstract: An addition curing silicone composition comprising (A) an organopolysiloxane containing at least two alkenyl groups, (B) an adhesion promoter, (C) an organohydrogenpolysiloxane, and (D) a platinum catalyst is suited for use in release paper or film. The adhesion promoter is a compound which contains per molecule at least one substituent group having a functional group capable of radical reaction upon exposure to heat and/or UV, and at least one substituent group having a group capable of reaction with alkenyl and/or SiH group.
    Type: Grant
    Filed: May 6, 2011
    Date of Patent: June 14, 2016
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Kenji Yamamoto, Shunji Aoki
  • Patent number: 9212169
    Abstract: The present invention aims to provide a compound capable of inhibiting PCA-1 that can be a target for a novel treatment method of various diseases, and pharmaceutical use of the compound. A compound represented by the formula (I): wherein each symbol is as defined in the DESCRIPTION, or a pharmaceutically acceptable salt thereof.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: December 15, 2015
    Assignees: HYOGO COLLEGE OF MEDICINE, KAGOSHIMA UNIVERSITY, OSAKA UNIVERSITY
    Inventors: Kazutake Tsujikawa, Akito Tanaka, Shunji Aoki, Hiroaki Mizuno, Miyuki Tokoro, Tatsuhiko Furukawa
  • Publication number: 20150252193
    Abstract: To provide a radiation-curable silicone composition which provides a cured product whose odor is decreased, particularly is odorless, and has excellent curability and releasing properties. A radiation-curable silicone composition including the following components (A) and (B): (A) an epoxy group-containing cation-polymerizable organopolysiloxane which is represented by the following average composition formula (1): R1aR2bSiO(4-a-b)/2 (1) and (B) an iodonium salt having a cation moiety represented by the following general formula (2) in an effective amount to cure said component (A), [(R3)—I—(R3)]+ (2) wherein R3 is, independently of each other, a substituted or unsubstituted monovalent aromatic hydrocarbon group having 15 to 26 carbon atoms, wherein said component (A) may be accompanied by any other compounds volatilizing during heating at 105 degrees C. for 3 hours, a content of said compounds is at most 2.0 mass %, based on a total amount of component (A) and said compound.
    Type: Application
    Filed: March 2, 2015
    Publication date: September 10, 2015
    Inventors: Kenji TANAKA, Shinji IRIFUNE, Shunji AOKI
  • Publication number: 20150133594
    Abstract: A heavy release additive for a release sheet comprises a condensation reaction product of dehydrative condensation reaction between (A) a polydiorganosiloxane of average polymerization degree of 500 to 10,000 and has at least one hydroxy or hydrolysable group per molecule and (B) a polyorganosiloxane resin composed of a (SiO4/2) unit and a (R3SiO1/2) unit (wherein R's independently represent a C1-12 monovalent hydrocarbon group or a C2-6 alkenyl group each having no aliphatic unsaturated bond), has a ratio of the (R3SiO1/2) unit to the (SiO4/2) unit of 0.6 to 1.2 by mole, and contains the hydroxy group and the hydrolysable group in the total content of 2.1 mass % or more and less than 10.0 mass %. The heavy release additive can have the effect of achieving an extremely great peel force compared with cases in which no additive is added.
    Type: Application
    Filed: May 17, 2013
    Publication date: May 14, 2015
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Toshiaki Ihara, Shunji Aoki, Shinji Irifune
  • Patent number: 9029472
    Abstract: The first aspect in the present invention provides a composition that includes (A) 100 parts by mass of an organoalkoxysilane represented by the following formula (1) and/or a compound obtained by partial hydrolysis and condensation of said organoalkoxysilane: R1aSi(OR2)4-a . . . (1), (B) 0.3 to 20 parts by mass of an aluminum dicarboxylate represented by the following formula (2): (R3COO)2Al(OH) . . . (2), and (C) 0.3 to 20 parts by mass of an aliphatic acid having 6 to 24 carbon atoms. The second aspect in the present invention provides a composition that includes components (A), (B) and (C) and further (D) 0.01 to 10 parts by mass of a dicarboxylic acid having 6 to 30 carbon atoms. Further, the present invention provides a method for making a porous material less water-absorptive by applying the composition to a surface of said porous material and a porous material modified by the method.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: May 12, 2015
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Shunji Aoki
  • Publication number: 20150011600
    Abstract: The present invention aims to provide a compound capable of inhibiting PCA-1 that can be a target for a novel treatment method of various diseases, and pharmaceutical use of the compound. A compound represented by the formula (I): wherein each symbol is as defined in the DESCRIPTION, or a pharmaceutically acceptable salt thereof.
    Type: Application
    Filed: March 1, 2013
    Publication date: January 8, 2015
    Inventors: Kazutake Tsujikawa, Akito Tanaka, Shunji Aoki, Hiroaki Mizuno, Miyuki Tokoro, Tatsuhiko Furukawa
  • Publication number: 20140356614
    Abstract: The first aspect in the present invention provides a composition that includes (A) 100 parts by mass of an organoalkoxysilane represented by the following formula (1) and/or a compound obtained by partial hydrolysis and condensation of said organoalkoxysilane: R1aSi(OR2)4-a . . . (1), (B) 0.3 to 20 parts by mass of an aluminum dicarboxylate represented by the following formula (2): (R3COO)2Al(OH) . . . (2), and (C) 0.3 to 20 parts by mass of an aliphatic acid having 6 to 24 carbon atoms. The second aspect in the present invention provides a composition that includes components (A), (B) and (C) and further (D) 0.01 to 10 parts by mass of a dicarboxylic acid having 6 to 30 carbon atoms. Further, the present invention provides a method for making a porous material less water-absorptive by applying the composition to a surface of said porous material and a porous material modified by the method.
    Type: Application
    Filed: May 20, 2014
    Publication date: December 4, 2014
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Shunji AOKI
  • Patent number: 8754174
    Abstract: A solventless addition-curable pressure sensitive silicone adhesive composition is provided. The composition comprises (A) an alkenyl group-containing polydiorganosiloxane; (B) a condensation product of (a) a polydiorganosiloxane having hydroxyl group or an alkoxy group on opposite ends of the molecular chain and (b) a polyorganosiloxane containing R13SiO1/2 unit and SiO2 unit as critical components and also a HOSiO3/2 unit in the molecule; (C1) a polyorganohydrosiloxane having at least three SiH groups per molecule; (C2) a polydiorganohydrosiloxane having SiH group on opposite ends; and (D) a platinum group metal catalyst. Use of the present composition enables production of a pressure sensitive adhesive agent having flexibility, pressure sensitive adhesiveness, and heat resistance, and the present composition is particularly effective for use as a buffer member having pressure sensitive adhesiveness.
    Type: Grant
    Filed: August 4, 2011
    Date of Patent: June 17, 2014
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Shunji Aoki
  • Patent number: 8247502
    Abstract: Provided is an addition reaction-curable silicone pressure-sensitive adhesive composition, including: (A) a specific diorganopolysiloxane consisting of (A1) a linear diorganopolysiloxane having two or more alkenyl groups, and (A2) a linear diorganopolysiloxane having SiOH groups at the terminals and containing no alkenyl groups, (B) a specific organopolysiloxane containing M units, Q units and SiOH group-containing siloxane units, (C) an organohydrogenpolysiloxane containing three or more SiH groups, (D) an addition reaction retarder, (E) a platinum group metal-based catalyst, and (F) a specific organopolysiloxane containing T units and D units. A cured product layer formed from a cured product of this composition can be peeled from a release film with minimal peeling force, and exhibits excellent adhesion to silicone rubbers.
    Type: Grant
    Filed: June 17, 2010
    Date of Patent: August 21, 2012
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Shunji Aoki
  • Patent number: 8206831
    Abstract: This invention relates to a silicone pressure-sensitive adhesive composition including: (A) a polydiorganosiloxane composed of a linear polydiorganosiloxane (A1) having two or more alkenyl groups within each molecule and a linear polydiorganosiloxane (A2) having SiOH groups at terminals thereof and no alkenyl groups, which is represented by the formula R22(HO)SiO—(R22SiO)d—SiR22(OH), wherein d represents an integer satisfying 500?d?20,000; (B) a polyorganosiloxane including R33SiO1/2 units, SiO2 units and Si atom-bonded hydroxyl group-containing units; (C) a polyorganohydrogensiloxane having three or more SiH groups within each molecule; (D) a reaction retarder; (E) a platinum group metal-based catalyst; and (F) a metal compound represented by formula MYx, wherein the polyorganosiloxane (B) is condensed with the linear polydiorganosiloxane (A2). The composition exhibits powerful adhesive strength to silicone rubbers and is useful for, by example, producing a pressure-sensitive tape.
    Type: Grant
    Filed: June 3, 2009
    Date of Patent: June 26, 2012
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Shunji Aoki
  • Publication number: 20120045635
    Abstract: A solventless addition-curable pressure sensitive silicone adhesive composition is provided. The composition comprises (A) an alkenyl group-containing polydiorganosiloxane; (B) a condensation product of (a) a polydiorganosiloxane having hydroxyl group or an alkoxy group on opposite ends of the molecular chain and (b) a polyorganosiloxane containing R13SiO1/2 unit and SiO2 unit as critical components and also a HOSiO3/2 unit in the molecule; (C1) a polyorganohydrosiloxane having at least three SiH groups per molecule; (C2) a polydiorganohydrosiloxane having SiH group on opposite ends; and (D) a platinum group metal catalyst. Use of the present composition enables production of a pressure sensitive adhesive agent having flexibility, pressure sensitive adhesiveness, and heat resistance, and the present composition is particularly effective for use as a buffer member having pressure sensitive adhesiveness.
    Type: Application
    Filed: August 4, 2011
    Publication date: February 23, 2012
    Applicant: Shin -Etsu Chemical Co., Ltd.
    Inventor: Shunji AOKI
  • Patent number: 8057909
    Abstract: A pressure sensitive adhesive film comprising a substrate film and a pressure sensitive adhesive layer formed on a surface of the substrate film, said pressure sensitive adhesive layer being prepared from (A) a silicone composition comprising a diorganopolysiloxane having at least two alkenyl groups per molecule and (C) a polyorganosiloxane having an SiH bond, characterized in that the alkenyl groups are contained in an amount of from 0.0007 to 0.05 mole per 100 g of the diorganopolysiloxane (A) and that the polyorganosiloxane (C) is contained in such an amount that a molar ratio of the SiH bond to the alkenyl group of the diorganopolysiloxane (A) ranges from 0.5 to 20. The adhesive film is useful in protecting the surface of a flat panel display.
    Type: Grant
    Filed: January 2, 2009
    Date of Patent: November 15, 2011
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shunji Aoki, Akira Yamamoto
  • Publication number: 20110274935
    Abstract: An addition curing silicone composition comprising (A) an organopolysiloxane containing at least two alkenyl groups, (B) an adhesion promoter, (C) an organohydrogenpolysiloxane, and (D) a platinum catalyst is suited for use in release paper or film. The adhesion promoter is a compound which contains per molecule at least one substituent group having a functional group capable of radical reaction upon exposure to heat and/or UV, and at least one substituent group having a group capable of reaction with alkenyl and/or SiH group.
    Type: Application
    Filed: May 6, 2011
    Publication date: November 10, 2011
    Inventors: Kenji YAMAMOTO, Shunji Aoki
  • Publication number: 20110274934
    Abstract: A silicone primer is provided comprising an adhesion-providing component which is an alkenyl-containing siloxane of specific structure and/or a compound containing a substituent group having a functional group capable of radical reaction upon exposure to heat and/or UV and a substituent group having a group capable of reaction with alkenyl and/or SiH group. A release paper or film is prepared by coating the silicone primer on a paper or plastic film substrate, exposing it to UV to form a primer layer, overlaying the primed surface with a release silicone composition, and curing the composition.
    Type: Application
    Filed: May 6, 2011
    Publication date: November 10, 2011
    Inventors: Kenji YAMAMOTO, Shunji Aoki
  • Publication number: 20110111217
    Abstract: A pressure-sensitive adhesive film comprising an adhesive layer on a substrate is provided. The layer is made of a silicone composition comprising (A) a diorganopolysiloxane having at least two alkenyl and phenyl groups, (B) an organopolysiloxane comprising R13SiO0.5 and SiO2 units, (C) an organohydrogenpolysiloxane containing at least three SiH groups, (D) a retarder, (E) an addition reaction catalyst, and (F) an organic solvent. The PSA film can be applied to a member without entrapping bubbles. After applied, the PSA film does not slide or peel on its own, but can be easily peeled by hand.
    Type: Application
    Filed: October 25, 2010
    Publication date: May 12, 2011
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yasuyoshi KURODA, Shunji AOKI
  • Patent number: 7915440
    Abstract: A method for preparing a polyorganosiloxane which is sold at 25° C. and has R13SiO0.5 units wherein R1 is a hydrocarbon group having 1 to 10 carbon atoms and SiO2 units, said method comprising the steps of: [1] subjecting at least one selected from an organosilane and an organodisiloxane, and at least one selected from a tetralkoxysilane and a partial condensate of hydrolysates of the tetralkoxysilane to hydrolysis reaction and condensation reaction in the presence of an acidic catalyst; [2] adding a liquid aliphatic hydrocarbon; and subsequently [3] separating a liquid aliphatic hydrocarbon phase and an aqueous phase and then removing said aqueous phase; provided that the step [2] may be performed before, during, or after the step [1].
    Type: Grant
    Filed: April 26, 2007
    Date of Patent: March 29, 2011
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shunji Aoki, Ichiro Ono, Kiyoyuki Mutoh, Akira Yamamoto
  • Publication number: 20100323145
    Abstract: Provided is an addition reaction-curable silicone pressure-sensitive adhesive composition, including: (A) a specific diorganopolysiloxane consisting of (A1) a linear diorganopolysiloxane having two or more alkenyl groups, and (A2) a linear diorganopolysiloxane having SiOH groups at the terminals and containing no alkenyl groups, (B) a specific organopolysiloxane containing M units, Q units and SiOH group-containing siloxane units, (C) an organohydrogenpolysiloxane containing three or more SiH groups, (D) an addition reaction retarder, (E) a platinum group metal-based catalyst, and (F) a specific organopolysiloxane containing T units and D units. A cured product layer formed from a cured product of this composition can be peeled from a release film with minimal peeling force, and exhibits excellent adhesion to silicone rubbers.
    Type: Application
    Filed: June 17, 2010
    Publication date: December 23, 2010
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventor: Shunji AOKI
  • Patent number: 7728080
    Abstract: A solventless silicone pressure-sensitive adhesive composition is provided. The composition includes (A) a polyorganosiloxane with a polymerization degree of 300 to 2,000 and having at least two alkenyl group-containing organic groups, (B) a polyorganohydrosiloxane having at least three silicon-bonded hydrogen atoms, (C) a polydiorganosiloxane having alkenyl groups at both terminals, (D) a polydiorganosiloxane having SiH groups at both terminals, (E) a polyorganosiloxane composed of R23SiO1/2 units and SiO2 units (R2 is a monovalent hydrocarbon group), and (F) a platinum-based catalyst. The composition enables the prevention of problems caused by residual or volatilized organic substances, such as the absorption of ultraviolet radiation or the like, and also enables ready removal of the composition without deforming or damaging the adherend.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: June 1, 2010
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Shunji Aoki
  • Patent number: 7659003
    Abstract: A pressure sensitive adhesive film comprising a substrate film and a pressure sensitive adhesive layer formed on a surface of the substrate film, said pressure sensitive adhesive layer being prepared from (A) a silicone composition comprising a diorganopolysiloxane having at least two alkenyl groups per molecule and (C) a polyorganosiloxane having an SiH bond, characterized in that the alkenyl groups are contained in an amount of from 0.0007 to 0.05 mole per 100 g of the diorganopolysiloxane (A) and that the polyorganosiloxane (C) is contained in such an amount that a molar ratio of the SiH bond to the alkenyl group of the diorganopolysiloxane (A) ranges from 0.5 to 20.
    Type: Grant
    Filed: October 27, 2005
    Date of Patent: February 9, 2010
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shunji Aoki, Akira Yamamoto