Abstract: The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is intended to improve accuracy in shape of an electrode or other element formed on the sheet, accuracy in its position and uniformity in its thickness. In a process according to the invention, a layer made of a photosensitive material including a powder having a desired electric characteristic is formed on a light transmissive base member. A mask having a desired pattern is disposed on the back side of the base member and the photosensitive material is exposed from the back side of the base member through the mask. Then the photosensitive layer after the exposure is subjected to development.

Abstract: The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is directed to formation of an insulating layer or a like layer having a complex shape with concavities and convexities while maintaining accuracy in its shape, accuracy in its formation position and uniformity in its thickness. In a process according to the invention, a layer made of a photosensitive material including a powder having a desired electric characteristic is formed on a light transmissive base member. Light such as ultraviolet light having a first pattern is radiated to the photosensitive material from the back side of the base member and light such as ultraviolet light having a second pattern is radiated to the photosensitive material from the back side of the base member so that the photosensitive material is exposed. Then the photosensitive layer after the exposure is subjected to development.

Abstract: A pressure-sensitive adhesive tape having a cured layer of a silicone pressure-sensitive adhesive composition containing a phenolic antioxidant is attached to an adherend of metal, typically copper for bonding or masking purposes. Even after exposure to elevated temperatures of 150-250° C., the tape can be smoothly peeled from the adherend without leaving any adhesive residue.

Abstract: A peroxide curable silicon adhesive composition comprising a diorganopolysiloxane (A), a polyorganosiloxane (B) comprising R13SiO0.5 unit and SiO2 unit in a molar ratio of the R13SiO0.5 unit to the SiO2 unit of from 0.6 to 1.7, a hindered amine compound (C), and an organic peroxide (D), and an adhesive tape thereof are provided. Also provided are an addition-reactive silicon adhesive composition comprising a diorganopolysiloxane (A′) having 2 or more alkenyl groups, a polyorganosiloxane (B), a hindered amine compound (C), a polyorganosiloxane (E) having SiH group, a retarder (F), and a platinum catalyst (G), and an adhesive tape thereof.

Abstract: A primer composition comprising (A) a diorganopolysiloxane having an average degree of polymerization of 500-2,000 and alkenyl groups at both ends of its molecular chain in an amount of 0.001-0.005 mol per 100 g of the diorganopolysiloxane, (B) an organohydrogenpolysiloxane having at least two SiH groups in a molecule, (C) a platinum base curing catalyst, and (D) a retarder is effective for improving the adhesion between various plastic films and silicone pressure-sensitive adhesives and thus forming satisfactory pressure-sensitive adhesive tapes.

Abstract: A conductive powder is incorporated in a pressure-sensitive adhesive composition comprising a silicone gum, an MQ resin, and a crosslinking agent. The conductive powder consists of core particles of inorganic material or organic resin, an interlayer of silicon-base polymer, and a metal plating. The resulting conductive silicone pressure-sensitive adhesive composition is satisfactorily adherent to silicone rubber and cures into a product that exhibits stable conductivity and adhesive properties in the temperature region where silicone rubber is used.

Abstract: A primer composition comprising (A) a diorganopolysiloxane having an average degree of polymerization of 500-2,000 and alkenyl groups at both ends of its molecular chain in an amount of 0.001-0.005 mol per 100 g of the diorganopolysiloxane, (B) an organohydrogenpolysiloxane having at least two SiH groups in a molecule, (C) a platinum base curing catalyst, and (D) a retarder is effective for improving the adhesion between various plastic films and silicone pressure-sensitive adhesives and thus forming satisfactory pressure-sensitive adhesive tapes.

Abstract: A pressure-sensitive adhesive tape having a cured layer of a silicone pressure-sensitive adhesive composition containing a phenolic antioxidant is attached to an adherend of metal, typically copper for bonding or masking purposes. Even after exposure to elevated temperatures of 150-250° C., the tape can be smoothly peeled from the adherend without leaving any adhesive residue.

Abstract: A primer composition comprising (A) a diorganopolysiloxane having an average degree of polymerization of 500-2,000 and alkenyl groups at both ends of its molecular chain in an amount of 0.001-0.005 mol per 100 g of the diorganopolysiloxane, (B) an organohydrogenpolysiloxane having at least two SiH groups in a molecule, (C) a platinum base curing catalyst, and (D) a retarder is effective for improving the adhesion between various plastic films and silicone pressure-sensitive adhesives and thus forming satisfactory pressure-sensitive adhesive tapes.

Abstract: A silicone pressure sensitive adhesive composition utilizing addition reaction between alkenyl groups of alkenyl group-containing diorganopolysiloxanes and SiH groups of organohydrogenpolysiloxanes, which comprises (A) diorganopolysiloxanes containing alkenyl groups the number of which is on average at least two a molecule, (B) an organopolysiloxane comprising R23SiOC.5 units, wherein R2 is an unsubstituted or substituted 1-10C monovalent hydrocarbon group, and SiO2 units in a R23SiOC.5/SiO2 ratio of from 0.6 to 1.

Abstract: The invention discloses a silicone-based pressure-sensitive adhesive composition which comprises, as a curing agent of a conventional silicone ingredient consisting of a diorganopolysiloxane and a so-called MQ siloxane resin, a 4,4′-dialkyl dibenzoyl peroxide or, in particular, 4,4′-dimethyl dibenzoyl peroxide instead of conventional organic peroxides such as dibenzoyl peroxide compounds. The inventive pressure-sensitive adhesive composition is advantageous in respect of the excellent adhesion performance which can be exhibited by curing under moderate conditions of temperature and time as compared with conventional silicone-based pressure-sensitive adhesive compositions.

Abstract: A primer composition comprising (A) a diorganopolysiloxane having an average degree of polymerization of 500-2,000 and alkenyl groups at both ends of its molecular chain in an amount of 0.001-0.005 mol per 100 g of the diorganopolysiloxane, (B) an organohydrogenpolysiloxane having at least two SiH groups in a molecule, (C) a platinum base curing catalyst, and (D) a retarder is effective for improving the adhesion between various plastic films and silicone pressure-sensitive adhesives and thus forming satisfactory pressure-sensitive adhesive tapes.

Abstract: An epoxy group-bearing organopolysiloxane or organosilane is prepared by effecting addition reaction between an organohydropolysiloxane or organohydrosilane and an alkenyl group-bearing epoxy compound in the presence of an addition reaction catalyst. A cyano group-bearing compound is co-present in the reaction system. The end organopolysiloxane or organosilane having a stabilized viscosity is obtained while avoiding gelation or thickening during reaction.

Abstract: A curable silicone composition having high compatibility with organic polymers, which comprises (a) 100 parts by weight of a hydroxyl group-containing organopolysiloxane represented by the following formula (I) and (b) 1-50 parts by weight of an isocyanate compound having at least two isocyanate groups per molecule, wherein the number of the hydroxyl groups per molecule in the component (a) plus the number of the isocyanate groups per molecule in the component (b) is at least 5: ##STR1## wherein R.sup.1 is a monovalent saturated hydrocarbon group; R.sup.2 is a phenyl-substituted alkyl group represented by C.sub.6 H.sub.5 --(CH.sub.2).sub.p --CH(R.sup.4)--CH.sub.2 --; R.sup.3 is a hydroxyl-substituted alkyl group represented by --CH.sub.2 --CH.sub.2 --CH.sub.2 --O--(C.sub.2 H.sub.4 O).sub.q --H; two R groups are the same group or different groups selected from the groups represented by R.sup.1, R.sup.2 or R.sup.3 ; R.sup.4 is a hydrogen atom or the same group as R.sub.

Abstract: A curable silicone composition based on an organopolysiloxane having a cyclotrisiloxane structure quickly cures by brief heating or ultraviolet exposure. It further contains an acid, acid generator, base or base generator or an oniom salt photo-initiator as a curing agent. The cured product has release property from adhesive substance which remains unchanged with the lapse of time and good mold release properties, and thus provides a lightly releasable cured film. The composition is widely used as adhesive tape backing agents, mold release agents, protective coating agents, water and oil repellent agents, and paint base.

Abstract: Novel aluminosiloxanes having an Al--O--Si linkage, titanosiloxanes having a Ti--O--Si linkage, and stannosiloxanes having a Sn--O--Si linkage in a molecule are provided. Aluminosiloxanes are formed by reacting aluminum alkoxides with cyclotrisiloxanes. Titanosiloxanes are formed by reacting titanium alkoxides with cyclotrisiloxanes. Stannosiloxanes are formed by reacting diorganotin dialkoxides with cyclotrisiloxanes. Reaction processes are simple.

Abstract: A method of preparing (meth)acryl group-containing organosiloxanes, wherein only the alkoxy group(s) of a (meth)acryl group-containing alkoxysilane compound is(are) selectively hydrolyzed using a cation exchange resin as acid catalyst.

Abstract: A radiation-curable, releasing silicone composition which comprises an organopolysiloxane having methacrylic or acrylic functional groups and represented by the following general formula ##STR1## In the formula, A represents a monovalent hydrocarbon group having a methacrylic or acrylic moiety, R's independently represent an unsubstituted or substituted monovalent organic group, a is an integer of 1, 2 or 3, b is an integer of 2 or 3, and n is an integer of 1 or over. The organopolysiloxane has a viscosity of from 50 to 2,000 cps., at 25.degree. C. The composition exhibits good releasing properties with respect to self-adhesives.

Abstract: A UV light-curable organopolysiloxane composition which comprises (A) 100 parts by weight of an organopolysiloxane having at least one functional epoxy group in one molecule, (B) from 1 to 100 parts by weight of a polyether compound of the formula, R.sup.1 --(OR.sup.2).sub.n --OR.sup.3, wherein R.sup.1 represents an alkyl or alkenyl group having from 1 to 8 carbon atoms, R.sup.2 represents an alkylene group having from 2 to 4 carbon atoms, R.sup.3 represents a hydrogen atom or an alkyl or alkenyl group having from 1 to 8 carbon atoms, and n is an integer of from 1 to 50, and (C) from 0.01 to 40 parts by weight of all onium salt photoinitiator.

Abstract: The invention provides a high-sensitivity ultraviolet-curable organopolysiloxane composition suitable for use as a surface-release treatment of various substrate such as release-paper sheets and the like. The composition comprises, as the essential ingredients, (a) an organopolysiloxane having a viscosity in the range from 50 to 3000 centipoise at 25.degree. C. and containing, in a molecule, at least one (meth)acryloxy-substituted monovalent hydrocarbon group or at least one epoxy- or glycidyloxy-substituted monovalent hydrocarbon group, and (b) a sulfonate compound such as 2-hydroxy-3-oxy-2,3-diphenylpropyl methanesulfonate as the photopolymerization initiator. The sensitivity of the composition to photopolymerization can be further increased by the addition of a specific salt such as sodium hexafluoroantimonate and sodium hexafluorophosphate.