Abstract: A sensor device in which flexibility is ensured over the entirety of the device and that can be manufactured at low costs is provided. The sensor device having flexibility includes a flexible substrate, a temperature/humidity sensor connected to the flexible substrate, and an exterior body formed of a soft material. The temperature/humidity sensor has a waterproof moisture-permeable material that covers a detection surface. The exterior body has an opening that exposes the waterproof moisture-permeable material. The flexible substrate is bonded at at least a peripheral part thereof to the exterior body.

Abstract: A sensor device to be installed on an installation surface includes: a substrate including a substrate body that is disposed along the installation surface and an extension portion that extends from the substrate body in a direction away from the installation surface; and a temperature sensor that is mounted on the extension portion and that detects an ambient temperature around the sensor device.

Abstract: An electronic device includes: an electronic component; a first protective member disposed so as to face one surface of the electronic component, the first protective member configured to be deformed by a shock from outside of the electronic component so as to relieve the shock; and at least one second protective member disposed so as to face a surface of the first protective member opposite the electronic component, the at least one second protective member being harder than the first protective member, the at least one second protective member having a rod shape.

Abstract: A pressure detection cloth includes a first cloth, a second cloth, a spacer formed between the first cloth and the second cloth, a gap formed by the spacer between the first cloth and the second cloth, a first conductive thread formed over a first surface exposed to the gap of the first cloth, and a second conductive thread formed over a second surface exposed to the gap of the second cloth, wherein the first surface and the second surface are opposed to each other, and wherein the first conductive thread and the second conductive thread are coupled to each other by a pressure of at least the first cloth and the second cloth.

Abstract: An RFID tag includes an antenna extending in a longitudinal direction and a reinforcing member extending such that the center thereof projects to opposite sides in a transverse direction. The reinforcing member includes first and second crossover edge portions crossing with the antenna at one and the other side in the longitudinal direction, a first inclination edge portion inclined so as to approach the antenna from the center side toward one side in the longitudinal direction, a second inclination edge portion inclined so as to approach the antenna from the center side toward the other side in the longitudinal direction, a third inclination edge portion inclined so as to approach the antenna from the center side toward one side in the longitudinal direction, and a fourth inclination edge portion inclined so as to approach the antenna from the center side toward the other side in the longitudinal direction.

Abstract: An electric element includes a first substrate made of an insulator having bendability, a second substrate provided over a first surface of the first substrate and having bendability-and-elasticity, a first conductive-film formed over the second substrate, a third substrate having bendability-and-elasticity and provided over a position at which the third substrate overlaps the second substrate over a second surface of the first substrate, a second conductive-film formed at a position at which the second conductive-film overlaps the first conductive-film over the third substrate, a first lead-wire to include a first thread-like-member having conductivity and sewn into the first substrate in an elasticity state, the first thread-like-member being extended from the first conductive-film to the first substrate, and a second lead-wire to include a second thread-like-member having conductivity and sewn into the first substrate in an elasticity state, the second thread-like-member being extended from the second cond

Abstract: An electronic device includes a first substrate having bendability, a second substrate configured to include a first electrode and provided over the first substrate, a third substrate configured to include a second electrode and provided over the first substrate with a space from the second substrate, a first electronic component configured to be electrically coupled to the first electrode and provided over the second substrate, a second electronic component configured to be electrically coupled to the second electrode and provided over the third substrate, and a wiring configured to include a plurality of conductive thread-shaped members sewn into the first substrate in an extensible and contractible state so as to be electrically coupled the first electrode to the second electrode.

Abstract: A board includes a substrate having a bending property, a wiring pattern formed over the substrate and having a bending property, a conductive member formed over the wiring pattern, an electronic component; and a bonding member that bonds the conductive member and the electronic component to each other. And an electronic device includes a board having a bending property, a wiring pattern formed over the substrate and having a bending property, a conductive member formed over the wiring pattern, an electronic component; and a bonding member that bonds the conductive member and the electronic component to each other.

Abstract: Electronic equipment includes: a substrate configured to include a first component, a second component, and an interconnection part that couples the first component with the second component by electric interconnections; and an exterior part configured to cover the first component, the second component, and the interconnection parts, and include a first exterior section that covers at least a portion of the first component, and a second exterior section that covers at least a portion of the interconnection parts, a thickness of the first exterior section being different from a thickness of the second exterior section to form a level difference in a boundary part between the first exterior section and the second exterior section.

Abstract: An RFID tag includes: a flexible, sheet-shaped substrate; an antenna pattern that is formed on the substrate; an IC chip that is mounted on the substrate and that is connected to the antenna pattern; an adhesive member that adheres the IC chip to the substrate; and a reinforcement member that covers the IC chip and the adhesive, and that is at a position such that a central portion of the reinforcement member is offset along a length direction of the substrate with respect to the IC chip and the adhesive member.

Abstract: A wiring board includes: a base member having stretchability; and a wiring including a plurality of conductive thread-like members that are sewn in the base member in a meandering manner and do not have stretchability.

Abstract: A wiring board includes a base having extensibility and a wiring formed on the base. The wiring includes a wiring portion and a conductor portion. The wiring portion is formed on the base and extends in a first direction crossing (for example, perpendicular to) a longitudinal direction of the base. The conductor portion is formed on the wiring portion and extends in the first direction. Even when the wiring board is extended along a main extension axis in parallel with the longitudinal direction of the base, change of the resistance of the wiring is prevented. Thus, the wiring board represents stable characteristics.

Abstract: A board includes a substrate having a bending property, a wiring pattern formed over the substrate and having a bending property, a conductive member formed over the wiring pattern, an electronic component; and a bonding member that bonds the conductive member and the electronic component to each other. And an electronic device includes a board having a bending property, a wiring pattern formed over the substrate and having a bending property, a conductive member formed over the wiring pattern, an electronic component; and a bonding member that bonds the conductive member and the electronic component to each other.

Abstract: An RFID tag includes: a flexible, sheet-shaped substrate; an antenna pattern that is formed on the substrate; an IC chip that is mounted on the substrate and that is connected to the antenna pattern; an adhesive member that adheres the IC chip to the substrate; and a reinforcement member that covers the IC chip and the adhesive, and that is at a position such that a central portion of the reinforcement member is offset along a length direction of the substrate with respect to the IC chip and the adhesive member.

Abstract: Electronic equipment includes: a substrate configured to include a first component, a second component, and an interconnection part that couples the first component with the second component by electric interconnections; and an exterior part configured to cover the first component, the second component, and the interconnection parts, and include a first exterior section that covers at least a portion of the first component, and a second exterior section that covers at least a portion of the interconnection parts, a thickness of the first exterior section being different from a thickness of the second exterior section to form a level difference in a boundary part between the first exterior section and the second exterior section.

Abstract: An RFID tag includes a core formed by a first elastic material and having a first surface, a second surface on an opposite side of the first surface, and a pair of end parts provided on mutually opposite sides and connecting to the first surface and the second surface. The RFID tag further includes a metal layer provided on the first surface, a semiconductor chip provided on the second surface, and a dipole antenna provided on the second surface and electrically connected to the semiconductor chip. One of the metal layer and the dipole antenna is folded at folded parts at the pair of end parts, and the metal layer and the dipole antenna overlap at the folded parts.

Abstract: A substrate includes: a base member that has flexibility and insulation properties; an electrically conductive member disposed on the base member and has flexibility and electrical conductivity; an electronic component disposed over the base member and coupled to the electrically conductive member; and a covering member that has flexibility and insulation properties and that covers a portion of the base member and a portion of the electronic component, wherein the covering member has a hardness higher than a hardness of the base member, and wherein the base member is bent so as to hold the covering member inside.

Abstract: A substrate includes: a base member that has flexibility and insulation properties; an electrically conductive member that is disposed on a top surface of the base member and that has flexibility and electrical conductivity; an electronic component that is disposed over the base member and that includes a terminal joined to the electrically conductive member; and a reinforcing member that is disposed on a bottom surface of the base member at a portion corresponding to a portion of the top surface of the base member at which the electrically conductive member is disposed, wherein the reinforcing member is larger in size than an area over which the terminal and the electrically conductive member are joined together.

Abstract: A multilayer substrate includes a first substrate a second substrate that is stacked on and electrically connected to the first substrate, the second substrate having a different characteristic from a characteristic of the first substrate, a third substrate that is provided on a side of the first substrate, the second substrate being provided on the side of the first substrate, and the third substrate is electrically connected to the second substrate, and a connection member that electrically connects the first substrate and the third substrate to each other while the second substrate is bypassed.

Abstract: A package mounting structure includes: a first substrate having wiring; a second substrate having wiring; at least one cooling unit having a first face and a second face different from the first face; at least one power supply unit that is mounted on the first substrate and is joined to the first face of the cooling unit; and at least one electronic component that is mounted on the second substrate and is joined to the second face of the cooling unit, wherein the power supply unit supplies power to the electronic component through the wiring of the first substrate, the cooling unit, and the wiring of the second substrate.