Abstract: A radio-frequency-identification tag antenna includes a film base, a plurality of antenna patterns for transmission and reception, which is formed in parallel on the film base, and a cut line that is formed on the film base between adjacent antenna patterns along the antenna patterns from an inside to an outer edge of the film base. A part of the film base on which the antenna patterns are formed is folded or bent in a predetermined direction using the cut line.

Abstract: With the RFID comprising a transmitting and receiving antenna, a detecting block formed in the circumference of the antenna, and an electronic component connected to the antenna and detecting block to detect breakdown of the detecting block, illegal use can be prevented, matching between the tag antenna and IC chip can also be attained with inclusion of the detecting means, and higher radiation and receiving characteristics of antenna can also be obtained without deterioration of antenna gain. Moreover, the RFID is very effective for keeping security because illegal use of the RFID tag through re-adhesion thereof to an item can be prevented.

Abstract: An RFID tag includes: a tag member in which a communication antenna is wired on a predetermined base and a circuit chip which carries out radio communication through the antenna is electrically connected to the antenna, a covering body which covers the tag member and encloses the tag member therein, a reflection plate which reflects radio communication radio wave and which extends along the base, and a spacer sandwiched between the covering body and the reflection plate.

Abstract: An RFID tag includes an inlay which has a base, an antenna formed on the base, and an IC chip. The IC chip is enclosed in a surface mount package and soldered to the antenna and carries out radio communication through the antenna. The RFID tag further includes underfill that fills a gap between the base and the surface mount package, and a sheath protecting material enclosing the entire inlay.

Abstract: The present invention relates to an RFID tag performing exchange of information with an external device without contact, and is to improve the resistance to bending while avoiding an increase in the thickness of the RFID tag. A circuit chip is bonded to a base portion of a base with a thermosetting adhesive. The base is folded, and an ultraviolet curing adhesive is applied on the circuit chip. The fold-back portions of the base are folded back onto the circuit chip, to which portions ultraviolet light is irradiated, as a result, both of the surfaces of the circuit chip are bonded to the base with the adhesives.

Abstract: A radio-frequency-identification tag antenna includes a film base, a plurality of antenna patterns for transmission and reception, which is formed in parallel on the film base, and a cut line that is formed on the film base between adjacent antenna patterns along the antenna patterns from an inside to an outer edge of the film base. A part of the film base on which the antenna patterns are formed is folded or bent in a predetermined direction using the cut line.

Abstract: A RFID tag includes an inlet in which an antenna for communication and a circuit chip performing radio communication with the antenna are electrically connected to each other. The RFID tag further includes a thermal storage section which encloses the inlet, which is made of a nonmetal, and which prevents thermal diffusion into the inlet and a thermal insulating section which encloses the thermal storage section, which prevents thermal conduction to the thermal storage section, and which has higher thermal diffusivity than thermal diffusivity of the thermal storage section and lower thermal conductivity than thermal conductivity of the thermal storage section.

Abstract: An RFID tag includes: a tag main body having a communication antenna, a circuit chip electrically connected to the antenna to perform wireless communication via the antenna, and a tabular sealing member in which the antenna and the circuit chip are enclosed; a print layer formed on a first surface of the tag main body by printing; and a protective film that covers the print layer. The print layer is formed only in a central area of the first surface surrounded by a marginal area of the first surface extending along the outer edge of the first surface. The protective film includes a covering portion that covers the print layer and an adhering portion that lies off the print layer while surrounding the outer edge of the print layer and adheres to the first surface.

Abstract: An apparatus and method for improving the underfill filling of a semiconductor chip element 100 which is ultrasonically bonded to and mounted on a circuit board. A semiconductor chip element 100 includes a silicon chip 101 and a group of stud bumps 117 formed on a bottom surface 101a of the chip 101. Signal stud bumps 113 are made of gold while power stud bumps 114, ground stud bumps 115 and dummy stud bumps 116 are all made of a gold-palladium alloy, which are harder than the signal stud bumps 113 and thus do not deform easily during ultrasonic treatment. Therefore, in a state in which the semiconductor chip element 100 is mounted, a gap of approximately 30 ?m is maintained between the bottom surface 101a of the chip 100 and a top surface of the circuit board 120 on which the semiconductor chip element 100 is mounted.

Abstract: An RFID tag including a first part which has a first base and a communication antenna formed on the first base by use of a paste of resin material mixed with metallic filler; and a second part disposed on the first part, which has a second base, a metallic patch disposed on the second base and electrically connected to the antenna on the first part, and a circuit chip connected onto the metallic patch via a bump, the circuit chip performing radio communication via the antenna.

Abstract: An RFID tag is constructed by pasting a first component and second component together. The first component includes a tabular first base made of dielectric and a metal layer covering one of the front and back of the first base. The second component includes a sheet-like second base, a metal pattern provided on the second base and electrically connected to the metal layer of the first component to constitute a communication antenna, a circuit chip connected to the metal pattern which carries out a radio communication through the communication antenna, and an adhesive material layer which bonds the second base to the other of the front and back of the first base. The metal layer of the first component and the metal pattern of the second component are electrically connected by the conductive component.

Abstract: According to an aspect of an embodiment, a radio frequency tag comprising: a base; a radio frequency antenna disposed on the base; a circuit chip mounted on the base and electrically connected to the radio frequency antenna, the circuit chip performing radio communication via the radio frequency antenna; and a protection sheet disposed on the radio frequency antenna, the protection sheet comprising a flexible material and rigid bodies dispersed in the flexible material so as to prevent the protection sheet from being collapsed when the radio frequency tag is bent and compressed.

Abstract: A RFID tag includes a base that extends in a predetermined longitudinal direction; an antenna for communication that is wired on the base; a circuit chip that is electrically connected to the antenna and conducts radio communication via the antenna; and a sealant that covers a top of the circuit chip and seals the circuit chip in cooperation with the base. A portion of the antenna that is exposed without being covered with the sealant extends in the width direction perpendicular to the longitudinal direction.

Abstract: A first pad has first and second sub-pads that are connected to each other by a connection section extending in a manner overlapping with a mounted circuit chip and that are connected to two terminals formed at two positions on a diagonal of a lower surface of the circuit chip, respectively. The second pad has third and fourth sub-pads that are connected to each other via a route bypassing the mounted circuit chip and that are connected to two terminals formed at two positions on the other diagonal of the lower surface of the circuit chip, respectively.

Abstract: A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the underfill is made to have a preferable shape. To accomplish this, a head IC chip provided with bumps is placed on a suspension that is covered with the underfill adhesive and is provided with pads. A bonding tool presses the head IC chip and applies ultrasonic oscillation to the head IC chip, so that the bumps are properly bonded to the pads. When the head IC chip is pressed and subjected to ultrasonic oscillation, the ultraviolet rays 108 are emitted so as to harden the peripheral portion 151a of the adhesive 151 spread out between the head IC chip 11 and the suspension 12.

Abstract: An RFID tag includes a dielectric member, an antenna pattern formed on and around a surface of the dielectric member, and an IC chip that is electrically connected to the antenna pattern by means of two chip pads.

Abstract: An RFID tag that includes a base, an antenna for communication wired to the base, a circuit chip electrically connected to the antenna for radio communication via the antenna, a first reinforcing member and a second reinforcing member. The first reinforcing member covers and fills the whole of the circuit chip and part of the antenna. The second reinforcing member is positioned underside of the first reinforcing member across the base and has an edge that is displaced from the edge of the first reinforcing member at least in the point where the edge of the first reinforcing member meets the antenna.

Abstract: A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

Abstract: An RFID tag includes a dielectric member, an antenna pattern formed on and around a surface of the dielectric member, and an IC chip that is electrically connected to the antenna pattern by means of two chip pads.

Abstract: The RFID tag includes: a main unit consisting of a base, a communication antenna that is wired on the base, a circuit chip that is electrically connected to the antenna and performs radio communication via the antenna, a chip reinforcing member covering the periphery of the circuit chip, an underside reinforcing member that is disposed at a position that sandwiches the base with respect to the chip reinforcing member, and a rubber cover member that covers these components; and protective layers that sandwich the main unit from the front and rear sides and have greater slipperiness than the slipperiness between the main unit and a contactant.