Patents by Inventor Shunji Baba
Shunji Baba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9477920Abstract: A disclosed RFID tag includes: a base member; a semiconductor chip mounted on the base member; and an island-shaped reinforcing member covering the semiconductor chip and being configured to reinforce the base member. The reinforcing member has a side portion to which a recess is provided. The recess serves as an originating point of a fold line such that the fold line is formed away from the semiconductor chip when the reinforcing member is folded.Type: GrantFiled: August 21, 2015Date of Patent: October 25, 2016Assignees: FUJITSU LIMITED, FUJITSU FRONTECH LIMITEDInventors: Takayoshi Matsumura, Yoshiyasu Sugimura, Tsuyoshi Niwata, Mimpei Miura, Shunji Baba
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Publication number: 20160211243Abstract: A laminated chip includes: a first chip; a first wiring layer formed on the first chip; a second chip; a second wiring layer formed on the second chip; and a layer disposed between the first wiring layer and the second wiring layer, the layer includes an adhesive agent configured to bond the first wiring layer and the second wiring layer; a plurality of first bumps connected to the first wiring layer; a plurality of second bumps connected to the second wiring layer; and solder connected to the plurality of first bumps and the plurality of second bumps.Type: ApplicationFiled: December 15, 2015Publication date: July 21, 2016Applicant: FUJITSU LIMITEDInventors: MAKOTO SUWADA, Shunji Baba, TAKASHI KANDA, NORIO KAINUMA
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Patent number: 9362202Abstract: An electronic device includes: a support member; an electronic component stacked over the support member with a plurality of connections therebetween; and a refrigerant pipe through which a refrigerant passes, the refrigerant pipe being provided between at least some connections among the plurality of connections. A method for manufacturing an electric device includes: stacking an electronic component over a support member with a plurality of connections therebetween; and providing a refrigerant pipe, through which a refrigerant passes, between at least some connections among the plurality of connections.Type: GrantFiled: May 16, 2014Date of Patent: June 7, 2016Assignee: FUJITSU LIMITEDInventors: Shunji Baba, Kenji Fukuzono, Yuki Hoshino
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Publication number: 20160155041Abstract: An RFID tag includes a core formed by a first elastic material and having a first surface, a second surface on an opposite side of the first surface, and a pair of end parts provided on mutually opposite sides and connecting to the first surface and the second surface. The RFID tag further includes a metal layer provided on the first surface, a semiconductor chip provided on the second surface, and a dipole antenna provided on the second surface and electrically connected to the semiconductor chip. One of the metal layer and the dipole antenna is folded at folded parts at the pair of end parts, and the metal layer and the dipole antenna overlap at the folded parts.Type: ApplicationFiled: February 2, 2016Publication date: June 2, 2016Applicant: FUJITSU LIMITEDInventors: Noritsugu OZAKI, Shunji BABA, Takayoshi MATSUMURA
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Publication number: 20160118322Abstract: A laminated substrate includes: a core portion; a first wiring portion configured to be stacked on the core portion and to include a first exposed surface formed by exposing at least part of a surface of the first wiring portion; and a second wiring portion configured to be stacked on the first wiring portion, to include a second exposed surface formed by exposing at least part of a surface of the second wiring portion, and to have higher wiring density of conductor than the first wiring portion has, wherein the first exposed surface and the second exposed surface are provided respectively with a first pad and a second pad which are to be connected to electrodes of one semiconductor chip to be mounted on both the first exposed surface and the second exposed surface.Type: ApplicationFiled: August 27, 2015Publication date: April 28, 2016Applicant: FUJITSU LIMITEDInventors: Takashi KANDA, Shunji BABA
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Publication number: 20160071002Abstract: A disclosed RFID tag includes: a base member; a semiconductor chip mounted on the base member; and an island-shaped reinforcing member covering the semiconductor chip and being configured to reinforce the base member. The reinforcing member has a side portion to which a recess is provided. The recess serves as an originating point of a fold line such that the fold line is formed away from the semiconductor chip when the reinforcing member is folded.Type: ApplicationFiled: August 21, 2015Publication date: March 10, 2016Inventors: Takayoshi MATSUMURA, Yoshiyasu SUGIMURA, Tsuyoshi NIWATA, Mimpei MIURA, Shunji BABA
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Patent number: 9208425Abstract: An RFID tag including an inlay having a sheet-like shape and including an antenna and an IC chip electrically connected to the antenna, an outer covering member that covers the inlay, the outer covering member having a planar shape and including a main surface and a rear surface, and a frame part arranged on at least one of the main surface and the rear surface. The frame part is erected in a thickness direction of the outer covering member. The frame part surrounds the IC chip in a plan view.Type: GrantFiled: August 15, 2014Date of Patent: December 8, 2015Assignee: FUJITSU LIMITEDInventors: Takayoshi Matsumura, Kenzo Nishide, Shigeru Gotou, Noritsugu Ozaki, Shunji Baba
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Publication number: 20150264810Abstract: A circuit board includes: a substrate; a through hole formed in the substrate; and a connection terminal provided in the through hole; wherein the connection terminal includes a pedestal portion provided within the through hole and a pin which is provided at a center of the pedestal portion and extends from the pedestal portion toward a first surface of the substrate, so that a first end portion protrudes from the first surface.Type: ApplicationFiled: March 3, 2015Publication date: September 17, 2015Inventors: Shunji BABA, Manabu WATANABE, Kenji FUKUZONO, Satoshi OHSAWA, Tetsuro YAMADA, Akihiro WAKABAYASHI, Yasushi MASUDA, Yohei MIURA
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Patent number: 9006876Abstract: A semiconductor apparatus includes: a package substrate on which a semiconductor device is disposed; a mounting board over which the package substrate is mounted; a first restraint that penetrates through the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are separated from each other; and a second restraint that is disposed between the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are closer to each other.Type: GrantFiled: March 26, 2014Date of Patent: April 14, 2015Assignee: Fujitsu LimitedInventors: Manabu Watanabe, Kenji Fukuzono, Shunji Baba
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Publication number: 20150060554Abstract: An RFID tag including an inlay having a sheet-like shape and including an antenna and an IC chip electrically connected to the antenna, an outer covering member that covers the inlay, the outer covering member having a planar shape and including a main surface and a rear surface, and a frame part arranged on at least one of the main surface and the rear surface. The frame part is erected in a thickness direction of the outer covering member. The frame part surrounds the IC chip in a plan view.Type: ApplicationFiled: August 15, 2014Publication date: March 5, 2015Inventors: Takayoshi Matsumura, Kenzo NISHIDE, Shigeru Gotou, NORITSUGU OZAKI, Shunji Baba
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Publication number: 20150008018Abstract: A multilayer substrate includes a first substrate a second substrate that is stacked on and electrically connected to the first substrate, the second substrate having a different characteristic from a characteristic of the first substrate, a third substrate that is provided on a side of the first substrate, the second substrate being provided on the side of the first substrate, and the third substrate is electrically connected to the second substrate, and a connection member that electrically connects the first substrate and the third substrate to each other while the second substrate is bypassed.Type: ApplicationFiled: June 27, 2014Publication date: January 8, 2015Inventors: Shunji Baba, TAKASHI KANDA
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Publication number: 20150003012Abstract: An electronic device includes: a support member; an electronic component stacked over the support member with a plurality of connections therebetween; and a refrigerant pipe through which a refrigerant passes, the refrigerant pipe being provided between at least some connections among the plurality of connections. A method for manufacturing an electric device includes: stacking an electronic component over a support member with a plurality of connections therebetween; and providing a refrigerant pipe, through which a refrigerant passes, between at least some connections among the plurality of connections.Type: ApplicationFiled: May 16, 2014Publication date: January 1, 2015Applicant: FUJITSU LIMITEDInventors: Shunji BABA, Kenji FUKUZONO, Yuki HOSHINO
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Publication number: 20140376187Abstract: A package mounting structure includes: a first substrate having wiring; a second substrate having wiring; at least one cooling unit having a first face and a second face different from the first face; at least one power supply unit that is mounted on the first substrate and is joined to the first face of the cooling unit; and at least one electronic component that is mounted on the second substrate and is joined to the second face of the cooling unit, wherein the power supply unit supplies power to the electronic component through the wiring of the first substrate, the cooling unit, and the wiring of the second substrate.Type: ApplicationFiled: May 5, 2014Publication date: December 25, 2014Applicant: FUJITSU LIMITEDInventors: Shunji Baba, Masateru Koide, Manabu Watanabe, Takashi Kanda, Kenji Fukuzono, Yuki Hoshino, Makoto Suwada
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Publication number: 20140361090Abstract: An RFID tag that includes a spacer made of a first member having flexibility and elasticity, the spacer having a top surface, a lateral surface and a bottom surface, an antenna made of a conductive material having flexibility and elasticity and disposed on the top surface, the lateral surface and the bottom surface of the spacer, and an IC chip electrically connected to the antenna.Type: ApplicationFiled: August 27, 2014Publication date: December 11, 2014Inventor: Shunji Baba
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Patent number: 8876007Abstract: An RFID tag includes a first flexible sheet covering a surface of a base part, an antenna and an IC chip; a second flexible sheet covering an another surface of the base part; a first reinforcing member including third and fourth sheets and covering the chip and a connecting portion of the chip and the antenna, the third sheet having flexibility and elasticity and being disposed on the first sheet, the fourth sheet having flexibility and being disposed on the third sheet; a second reinforcing member including fifth and sixth sheets and covering the chip and the connecting portion, the fifth sheet having flexibility and elasticity and being disposed on the second sheet, the sixth sheet having flexibility and being disposed on the fifth sheet; and an outer member having flexibility and elasticity and covering the first and the second sheets and the first and the second reinforcing members.Type: GrantFiled: March 14, 2013Date of Patent: November 4, 2014Assignees: Fujitsu Limited, Fujitsu Frontech LimitedInventors: Shunji Baba, Shigeru Hashimoto, Yoshiyasu Sugimura, Tsuyoshi Niwata, Mimpei Miura
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Publication number: 20140319667Abstract: A semiconductor apparatus includes: a package substrate on which a semiconductor device is disposed; a mounting board over which the package substrate is mounted; a first restraint that penetrates through the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are separated from each other; and a second restraint that is disposed between the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are closer to each other.Type: ApplicationFiled: March 26, 2014Publication date: October 30, 2014Applicant: FUJITSU LIMITEDInventors: Manabu WATANABE, Kenji FUKUZONO, Shunji BABA
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Patent number: 8763911Abstract: An RFID tag is disclosed that includes a first sheet having flexibility and elasticity; an antenna having flexibility and elasticity and configured to be formed on a surface of the first sheet; an IC chip configured to be electrically connected to the antenna; a second sheet having flexibility and elasticity and configured to be attached to the first sheet and to cover the antenna and the IC chip with the first sheet; and a reinforcing member having flexibility and elasticity and configured to cover the IC chip and a connecting portion of the IC chip and the antenna.Type: GrantFiled: March 19, 2012Date of Patent: July 1, 2014Assignees: Fujitsu Limited, Fujitsu Frontech LimitedInventors: Shunji Baba, Naoki Ishikawa, Shigeru Hashimoto, Tsuyoshi Niwata, Yoshiyasu Sugimura, Satoru Nogami, Mimpei Miura
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Patent number: 8698633Abstract: In a manufacturing method of a thin and small RFID tag, an antenna metal pattern is formed on a substrate, going once around a dielectric plate, and a recess is formed on the substrate to house an IC chip. A strap on which the IC chip is mounted is connected and fastened to the substrate in the position and orientation in which the IC chip is housed in the recess.Type: GrantFiled: March 21, 2011Date of Patent: April 15, 2014Assignee: Fujitsu LimitedInventors: Hiroshi Kobayashi, Naoki Ishikawa, Takayoshi Matsumura, Shunji Baba
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Patent number: 8662382Abstract: A non-contact storage medium fixing structure includes a non-contact storage medium that has a memory unit which stores predetermined information of an object to be controlled, a pair of wire connection guide members respectively provided at at least two positions on a body of the non-contact storage medium, and a wire connection member that fixes the non-contact storage medium at a predetermined position of the object to be controlled, by way of the pair of wire connection guide members.Type: GrantFiled: October 29, 2008Date of Patent: March 4, 2014Assignees: Fujitsu Limited, Fujitsu Frontech LimitedInventors: Shunji Baba, Shigeru Hashimoto, Yasushi Kasahara
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Patent number: 8629809Abstract: A tag patch antenna includes: a slit formed in the vicinity of an edge of an antenna pattern along a part of the edge; and a feeding point to which a tag LSI is connected and which is formed by cutting an intermediate portion of the part of the edge separated by the slit from a body of the antenna pattern by a width of the slit.Type: GrantFiled: January 12, 2010Date of Patent: January 14, 2014Assignees: Fujitsu Limited, Fujitsu Frontech LimitedInventors: Takashi Yamagajo, Toru Maniwa, Manabu Kai, Yoshiyasu Sugimura, Shunji Baba