Abstract: An RFID tag is constructed by pasting a first component and second component together. The first component includes a tabular first base made of dielectric and a metal layer covering one of the front and back of the first base. The second component includes a sheet-like second base, a metal pattern provided on the second base and electrically connected to the metal layer of the first component to constitute a communication antenna, a circuit chip connected to the metal pattern which carries out a radio communication through the communication antenna, and an adhesive material layer which bonds the second base to the other of the front and back of the first base. The metal layer of the first component and the metal pattern of the second component are electrically connected by the conductive component.

Abstract: The present invention relates to an RFID tag and is provided with a function of detecting peeling while maintaining a good antenna characteristic. A first conductive pattern includes two extending sections extending from an IC chip, each end of which is connected to the IC chip, and a correction pattern for antenna characteristic correction which bypasses the IC chip and connects the two extending sections, and a peeling detection pattern is formed in an area enclosed by the two extending sections and the correction pattern.

Abstract: An RFID tag, including: a base; an antenna pattern that is provided on the base to form a communication antenna and has a tapered connection end portion which provides a connection terminal to the antenna; an electric conductor that is attached onto the connection end portion of the antenna pattern and is smaller than the connection end portion; and a circuit chip that is electrically connected to the antenna pattern via the electric conductor and performs radio communication by use of the antenna.

Abstract: With the RFID comprising a transmitting and receiving antenna, a detecting block formed in the circumference of the antenna, and an electronic component connected to the antenna and detecting block to detect breakdown of the detecting block, illegal use can be prevented, matching between the tag antenna and IC chip can also be attained with inclusion of the detecting means, and higher radiation and receiving characteristics of antenna can also be obtained without deterioration of antenna gain. Moreover, the RFID is very effective for keeping security because illegal use of the RFID tag through re-adhesion thereof to an item can be prevented.

Abstract: An RFID tag is provided which comprises: a first part which has a first base and a communication antenna formed on the first base by use of a paste of resin material mixed with metallic filler; and a second part disposed on the first part, which has a second base, a metallic patch disposed on the second base and electrically connected to the antenna on the first part, and a circuit chip connected onto the metallic patch via a bump, the circuit chip performing radio communication via the antenna.

Abstract: It is an object of the present invention to improve mechanical durability of a portable display device using cholesteric liquid crystal with a memory function such as a non-contact IC card. A display element comprising two substrates 1 which oppose each other and a display portion (liquid crystal) 2 which is sandwiched by the substrates 1, comprises a wall structure 3 bearing a substrate on portions other than the display portion 2, in which the wall is perpendicular to the substrate 1 and a surface perpendicular to the wall is adhered to the substrate 1. Further, in the above display element, an area of the surface which is adhered to the substrate 1 is larger than an area of a surface of the display portion 2 which faces the substrate 1.

Abstract: A meander line antenna formed by folding a conductive pattern of a folded dipole antenna in the shape of meander is disclosed. The basic structure of the meander line antenna includes a bottom half section formed by a folded conductive pattern, and a feeding point arranged approximately at the center of the folded conductive pattern for mounting an IC chip, a top half section consisting of a folded conductive pattern shaped like the bottom half section, a coarse tuning section consisting of two or more short circuit conductive patterns for coarse tuning that connects countering conductive patterns of either or both of the bottom half section and the top half section at a predetermined interval, and a fine-tuning section consisting of two or more short circuit conductive patterns for fine tuning that connect countering conductive patterns of the top half section, the countering conductive patterns being located at a position that counters the feeding point, at a predetermined interval.

Abstract: The present invention provides a radio frequency identification (RFID) tag which exchanges information with an external device in a noncontact manner, in which a paste is used as a material for an antenna, and which is designed to avoid the problem due to swelling of the paste caused by a pressing force from bumps of an IC chip. A paste escape recess is provided in which part of the paste provided to form the antenna is caused to flow therein by the pressure received from the bumps when the IC chip with the bumps is connected to the antenna.

Abstract: The present invention provides a radio frequency identification (RFID) tag which exchanges information with an external device in a noncontact manner, in which a paste is used as a material for an antenna, and which is designed to prevent sinking of bumps. A stopper for limiting sinking of bumps of a circuit chip caused by a pressing force when the circuit chip is connected to an antenna is provided on the circuit chip or a base at a position adjacent to the bumps.

Abstract: The present invention is directed to a peroxide cured rubber composition containing a non-crosslinked or significantly non-crosslinked (<10 wt. % gel) butyl rubber polymer, a multiolefin crosslinking agent, a peroxide curing agent and at least one filler. The present invention is also directed to a process for preparing a peroxide cured rubber composition which includes mixing a non-crosslinked or significantly non-crosslinked butyl rubber with a multiolefin crosslinking agent, at least one filler and a peroxide curing agent, wherein the process does not include the addition of non-peroxide curing agents such as sulfur, quinoids, resins and sulfur donors.

Abstract: The present invention provides an RFID tag that is very effective in preventing fraudulent uses. The RFID tag includes a base, an antenna pattern provided on the base, a breakdown pattern provided on the base, a circuit chip connected to both the antenna pattern and the breakdown pattern, and a cover that is bonded to the base in a strippable condition so as to cover the antenna pattern, the breakdown pattern and the circuit chip and is caused to come off together with all or a part of the breakdown pattern during stripping from the base. The breakdown pattern is transparent, or the cover conceals a remaining part of the breakdown pattern, or the breakdown pattern has a specific part that produces predetermined electrical properties and the cover conceals the specific part.

Abstract: A radio-frequency-identification tag antenna includes a film base, a plurality of antenna patterns for transmission and reception, which is formed in parallel on the film base, and a cut line that is formed on the film base between adjacent antenna patterns along the antenna patterns from an inside to an outer edge of the film base. A part of the film base on which the antenna patterns are formed is folded or bent in a predetermined direction using the cut line.

Abstract: An RFID tag includes a dielectric member, an antenna pattern formed on and around a surface of the dielectric member, and an IC chip that is electrically connected to the antenna pattern by means of two chip pads.

Abstract: A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.

Abstract: A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.

Abstract: A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.

Abstract: An electronic part mounting structure includes a printed circuit board, a plurality of electronic parts mounted on the printed circuit board, a folded portion of the printed circuit board bent and layered between the electronic parts, through holes formed in both sides of the folded portion, and a wiring connecting the electronic parts via the through holes and connecting the electronic parts to the through holes.

Abstract: A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

Abstract: A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

Abstract: A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.