Patents by Inventor Shunji Baba
Shunji Baba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6787925Abstract: A method of mounting a semiconductor device having bumps on a board having pads so that each of the bumps is joined to a corresponding one of the pads is provided. Adhesive to be hardened by heat is provided between the semiconductor device and the board. The method includes the steps of pressing the bumps of the semiconductor device on the pads of the board, and heating a portion in which each of the bumps and a corresponding one of the pads are in contact with each other. A pressure of the bumps to the pads reaches a predetermined value before a temperature of the adhesive to which heat is supplied in the above step reaches a temperature at which the adhesive is hardened.Type: GrantFiled: March 14, 2001Date of Patent: September 7, 2004Assignee: Fujitsu LimitedInventors: Kazuhisa Tsunoi, Hidehiko Kira, Shunji Baba, Akira Fujii, Toshihiro Kusagaya, Kenji Kobae, Norio Kainuma, Naoki Ishikawa, Satoshi Emoto
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Patent number: 6770319Abstract: A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.Type: GrantFiled: March 20, 2001Date of Patent: August 3, 2004Assignee: Fujitsu LimitedInventors: Shunji Baba, Takatoyo Yamakami, Norio Kainuma, Kenji Kobae, Hidehiko Kira, Hiroshi Kobayashi
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Patent number: 6716665Abstract: A wafer receiving conductive input/output bumps on the upward front side is placed on a platen. An underfill material sheet, adhered to the surface of the thin film tape, is superposed on the front side of the wafer. The underfill material sheet is forced to soften. When the underfill material sheet is urged against the wafer, the input/output bumps is allowed to penetrate through the underfill material sheet. After the underfill material is hardened, the thin film tape is peeled off from the hardened underfill material sheet. The underfill material can thus be supplied commonly to a large number of individual semiconductor chips included in the wafer. As compared with the case where the underfill material is supplied separately to the individual semiconductor chips, the working time can greatly be shortened.Type: GrantFiled: January 4, 2001Date of Patent: April 6, 2004Assignee: Fujitsu LimitedInventors: Shunji Baba, Takatoyo Yamakami, Norio Kainuma, Kenji Kobae, Hidehiko Kira, Hiroshi Kobayashi
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Patent number: 6582993Abstract: Prior to setting of a semiconductor device upon the surface of a wiring substrate, the fluid of a light curable reaction resin is supplied from a nozzle to the surface of the wiring substrate. When the predetermined amount of the fluid has been discharged from the nozzle, the fluid within the nozzle is irradiated through a transparent window defined in the nozzle. A hardening reaction is induced in the irradiated segment of the fluid. The reduction in the fluidity can be achieved in the irradiated segment of the fluid. The irradiated segment forms a partition mass in the fluid within the nozzle. A reliable split can thus be achieved between the partition mass and the fluid discharged from the tip end of the nozzle. The split can be utilized to control the supplied amount of the fluid at a higher accuracy.Type: GrantFiled: September 11, 2000Date of Patent: June 24, 2003Assignee: Fujitsu LimitedInventors: Shunji Baba, Kenji Kobae, Hidehiko Kira, Norio Kainuma
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Publication number: 20030057552Abstract: An apparatus and method for improving the underfill filling of a semiconductor chip element 100 which is ultrasonically bonded to and mounted on a circuit board. A semiconductor chip element 100 includes a silicon chip 101 and a group of stud bumps 117 formed on a bottom surface 101a of the chip 101. Signal stud bumps 113 are made of gold while power stud bumps 114, ground stud bumps 115 and dummy stud bumps 116 are all made of a gold-palladium alloy, which are harder than the signal stud bumps 113 and thus do not deform easily during ultrasonic treatment. Therefore, in a state in which the semiconductor chip element 100 is mounted, a gap of approximately 30 &mgr;m is maintained between the bottom surface 101a of the chip 100 and a top surface of the circuit board 120 on which the semiconductor chip element 100 is mounted.Type: ApplicationFiled: August 20, 2002Publication date: March 27, 2003Applicant: FUJITSU LIMITEDInventors: Norio Kainuma, Shunji Baba, Hidehiko Kira, Toru Okada
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Patent number: 6506849Abstract: There are provided a rubber composition having a high modulus of elasticity and a good workability, and a pneumatic tire. A rubber composition comprising at least one of natural rubber and synthetic diene rubbers as a rubber ingredient, at least one maleimide compound, and at least one nitrogen-containing compound selected from the group consisting of polyaniline, hydrazide, and amine compound is used in a tread.Type: GrantFiled: January 5, 2001Date of Patent: January 14, 2003Assignee: Bridgestone CorporationInventors: Masahiro Hojo, Yukitoshi Ajiro, Kentaro Fujino, Shunji Baba
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Publication number: 20020195476Abstract: A suspension of a head assembly provided in a disk apparatus is prevented from being deformed due to mounting of a head IC chip onto the suspension. The head IC chip mounted on the suspension has protruding electrodes made of gold. The suspension has electrode pads connected to the respective protruding electrodes of the head IC chip. Each of the electrode pads has a surface layer made of gold. The protruding electrodes of the head IC chip are bonded to the electrode pads of the suspension by ultrasonic bonding.Type: ApplicationFiled: June 27, 2002Publication date: December 26, 2002Applicant: Fujitsu LimitedInventors: Shunji Baba, Hidehiko Kira, Norio Kainuma, Toru Okada
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Patent number: 6482676Abstract: A method of mounting a semiconductor chip part on a substrate, which is capable of realizing high efficiency and high reliability of the mounting works. A leading end of a conductive wire is contact-bonded onto each pad of a semiconductor chip part, followed by tearing of the wire, to form a two-step bump having an upper step portion and a lower step portion larger in volume than the upper step portion. Only the upper step portions of the bumps are then brought in press-contact with a single flattening tool member having a flat surface in such a manner that heights of all of the bumps are made nearly equal to each other. A conductive paste is stuck on the bumps, and the substrate is coated with an adhesive. Thus, the semiconductor chip part is heated and pressurized onto the substrate by a mounting tool in such a state in which the pads are aligned with the corresponding lands of the substrate, to plastically deform the whole of the upper step portions and the lower step portions of the bumps.Type: GrantFiled: July 1, 1997Date of Patent: November 19, 2002Assignee: Fujitsu LimitedInventors: Kazuhisa Tsunoi, Akira Fujii, Shunji Baba, Yoshikazu Hirano
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Patent number: 6483190Abstract: An apparatus and method for improving the underfill filling of a semiconductor chip element 100 which is ultrasonically bonded to and mounted on a circuit board. A semiconductor chip element 100 includes a silicon chip 101 and a group of stud bumps 117 formed on a bottom surface 101a of the chip 101. Signal stud bumps 113 are made of gold while power stud bumps 114, ground stud bumps 115 and dummy stud bumps 116 are all made of a gold-palladium alloy, which are harder than the signal stud bumps 113 and thus do not deform easily during ultrasonic treatment. Therefore, in a state in which the semiconductor chip element 100 is mounted, a gap of approximately 30 &mgr;m is maintained between the bottom surface 101a of the chip 100 and a top surface of the circuit board 120 on which the semiconductor chip element 100 is mounted.Type: GrantFiled: July 18, 2000Date of Patent: November 19, 2002Assignee: Fujitsu LimitedInventors: Norio Kainuma, Shunji Baba, Hidehiko Kira, Toru Okada
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Publication number: 20020164837Abstract: A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the underfill is made to have a preferable shape. To accomplish this, a head IC chip provided with bumps is placed on a suspension that is covered with the underfill adhesive and is provided with pads. A bonding tool presses the head IC chip and applies ultrasonic oscillation to the head IC chip, so that the bumps are properly bonded to the pads. When the head IC chip is pressed and subjected to ultrasonic oscillation, the ultraviolet rays 108 are emitted so as to harden the peripheral portion 151a of the adhesive 151 spread out between the head IC chip 11 and the suspension 12.Type: ApplicationFiled: July 3, 2002Publication date: November 7, 2002Applicant: Fujitsu LimitedInventors: Shunji Baba, Takatoyo Yamakami, Norio Kainuma, Kenji Kobae, Hidehiko Kira, Hiroshi Kobayashi
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Patent number: 6458237Abstract: A method of mounting a semiconductor device having bumps on a board having pads so that each of the bumps is joined to a corresponding one of the pads is provided. Adhesive to be hardened by heat is provided between the semiconductor device and the board. The method includes the steps of pressing the bumps of the semiconductor device on the pads of the board, and heating a portion in which each of the bumps and a corresponding one of the pads are in contact with each other. A pressure of the bumps to the pads reaches a predetermined value before a temperature of the adhesive to which heat is supplied in the above step reaches a temperature at which the adhesive is hardened.Type: GrantFiled: March 20, 1998Date of Patent: October 1, 2002Assignee: Fujitsu LimitedInventors: Kazuhisa Tsunoi, Hidehiko Kira, Shunji Baba, Akira Fujii, Toshihiro Kusagaya, Kenji Kobae, Norio Kainuma, Naoki Ishikawa, Satoshi Emoto
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Patent number: 6437450Abstract: A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the underfill is made to have a preferable shape. To accomplish this, a head IC chip provided with bumps is placed on a suspension that is covered with the underfill adhesive and is provided with pads. A bonding tool presses the head IC chip and applies ultrasonic oscillation to the head IC chip, so that the bumps are properly bonded to the pads. When the head IC chip is pressed and subjected to ultrasonic oscillation, the ultraviolet rays 108 are emitted so as to harden the peripheral portion 151a of the adhesive 151 spread out between the head IC chip 11 and the suspension 12.Type: GrantFiled: July 12, 2000Date of Patent: August 20, 2002Assignee: Fujitsu, LimitedInventors: Shunji Baba, Takatoyo Yamakami, Norio Kainuma, Kenji Kobae, Hidehiko Kira, Hiroshi Kobayashi
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Patent number: 6400529Abstract: A head assembly has a head slider including a magnetic head and a first electrode, an IC chip supporting the head slider on a principal surface of the IC chip, and a suspension supporting the IC chip, the IC chip comprising a second electrode and a third electrode on the principal surface thereof, the third electrode being connected to the suspension, the second electrode being electrically connected to the first electrode.Type: GrantFiled: March 20, 2000Date of Patent: June 4, 2002Assignee: Fujitsu LimitedInventors: Shunji Baba, Hidehiko Kira, Norio Kainuma, Toru Okada
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Publication number: 20020048847Abstract: A method of mounting a semiconductor chip part on a substrate, which is capable of realizing high efficiency and high reliability of the mounting works. A leading end of a conductive wire is contact-bonded onto each pad of a semiconductor chip part, followed by tearing of the wire, to form a two-step bump having an upper step portion and a lower step portion larger in volume than the upper step portion. Only the upper step portions of the bumps are then brought in press-contact with a single flattening tool member having a flat surface in such a manner that heights of all of the bumps are made nearly equal to each other. A conductive paste is stuck on the bumps, and the substrate is coated with an adhesive. Thus, the semiconductor chip part is heated and pressurized onto the substrate by a mounting tool in such a state in which the pads are aligned with the corresponding lands of the substrate, to plastically deform the whole of the upper step portions and the lower step portions of the bumps.Type: ApplicationFiled: July 1, 1997Publication date: April 25, 2002Inventors: KAZUHISA TSUNOI, AKIRA FUJII, SHUNJI BABA, YOSHIKAZU HIRANO
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Publication number: 20020037363Abstract: A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.Type: ApplicationFiled: March 20, 2001Publication date: March 28, 2002Inventors: Shunji Baba, Takatoyo Yamakami, Norio Kainuma, Kenji Kobae, Hidehiko Kira, Hiroshi Kobayashi
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Publication number: 20010040298Abstract: A wafer receiving conductive input/output bumps on the upward front side is placed on a platen. An underfill material sheet, adhered to the surface of the thin film tape, is superposed on the front side of the wafer. The underfill material sheet is forced to soften. When the underfill material sheet is urged against the wafer, the input/output bumps is allowed to penetrate through the underfill material sheet. After the underfill material is hardened, the thin film tape is peeled off from the hardened underfill material sheet. The underfill material can thus be supplied commonly to a large number of individual semiconductor chips included in the wafer. As compared with the case where the underfill material is supplied separately to the individual semiconductor chips, the working time can greatly be shortened.Type: ApplicationFiled: January 4, 2001Publication date: November 15, 2001Inventors: Shunji Baba, Takatoyo Yamakami, Norio Kainuma, Kenji Kobae, Hidehiko Kira, Hiroshi Kobayashi
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Patent number: 6291269Abstract: A semiconductor bare chip includes a plurality of stud bumps provided on the surface of the semiconductor bare chip body, each of the stud bumps including a seat and a head protruding from the seat. A height of the head is less than a thickness of electrodes on said board.Type: GrantFiled: October 1, 1999Date of Patent: September 18, 2001Assignee: Fujitsu LimitedInventors: Hidehiko Kira, Kiyoshi Fukui, Kazuhisa Tsunoi, Shunji Baba
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Publication number: 20010011774Abstract: A method of mounting a semiconductor device having bumps on a board having pads so that each of the bumps is joined to a corresponding one of the pads is provided. Adhesive to be hardened by heat is provided between the semiconductor device and the board. The method includes the steps of pressing the bumps of the semiconductor device on the pads of the board, and heating a portion in which each of the bumps and a corresponding one of the pads are in contact with each other. A pressure of the bumps to the pads reaches a predetermined value before a temperature of the adhesive to which heat is supplied in the above step reaches a temperature at which the adhesive is hardened.Type: ApplicationFiled: March 14, 2001Publication date: August 9, 2001Applicant: Fujitsu LimitedInventors: Kazuhisa Tsunoi, Hidehiko Kira, Shunji Baba, Akira Fujii, Toshihiro Kusagaya, Kenji Kobae, Norio Kainuma, Naoki Ishikawa, Satoshi Emoto
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Patent number: 6177730Abstract: A semiconductor bare chip includes a plurality of stud bumps provided on the surface of the semiconductor bare chip body, each of the stud bumps including a seat and a head protruding from the seat. A height of the head is less than a thickness of electrodes on said board.Type: GrantFiled: February 10, 1998Date of Patent: January 23, 2001Assignee: Fujitsu LimitedInventors: Hidehiko Kira, Kiyoshi Fukui, Kazuhisa Tsunoi, Shunji Baba