Abstract: A resin composition is provided. The resin composition comprises the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.008 at 10 GHz and comprises a bismaleimide resin of the following formula (I), wherein M1 and the Z1 groups are as defined in the specification; and (b) an organic compound of the following formula (II) or formula (III), wherein R?, R11 to R19 and R21 to R28 are as defined in the specification, and wherein the amount of the organic compound (b) ranges from 1 wt % to 30 wt % based on the total weight of the resin system (a) and the organic compound (b).

Abstract: A prepreg is provided. The prepreg is prepared by impregnating a liquid crystal polymer non-woven fabric with a thermal-curable resin composition or by coating a thermal-curable resin composition onto a liquid crystal polymer non-woven fabric and drying the impregnated or coated liquid crystal polymer non-woven fabric, wherein the thermal-curable resin composition includes: (A) an unsaturated monomer; and (B) a cyclic olefin copolymer including the following repeating units: (B-1) a repeating unit of formula (I), (B-2) a repeating unit of formula (II), and (B-3) a repeating unit of formula (III), R1 to R22, m, n, o, and p in formulas (I) to (III) are as defined in the specification, wherein based on the total moles of the repeating units (B-1) to (B-3), the content of the repeating unit (B-2) is 19 mol % to 36 mol %, and wherein the weight ratio of the cyclic olefin copolymer (B) to the unsaturated monomer (A) is 0.5 to 7.

Abstract: A resin composition is provided. The resin composition comprises the following: (a) a resin system, which comprises a thermosetting resin constituent and a vinyl-containing elastomer and has a dissipation factor (Df) of not higher than 0.008 at 10 GHz after curing; and (b) a phosphorous-containing flame retardant, which is a compound of formula (I), a compound of formula (II), or a combination thereof: wherein R1, R2, R21, R22, R23, R24, and n are as defined in the specification.

Abstract: A halogen-free low dielectric resin composition is provided. The halogen-free low dielectric resin composition comprises: (A) a resin system, which includes: (a1) a polyphenylene ether resin with unsaturated functional groups, and (a2) a polyfunctional vinyl aromatic copolymer; and (B) an allyl cyclophosphazene compound represented by the following formula (I): in formula (I), t is an integer ranging from 1 to 6, wherein, the polyfunctional vinyl aromatic copolymer (a2) is prepared by copolymerizing one or more divinyl aromatic compounds and one or more monovinyl aromatic compounds.

Abstract: An adhesive composition is provided including the following components: (A) an unsaturated monomer; and (B) an olefin copolymer comprising the following repeating units: (B-1) a repeating unit of formula (I), (B-2) a repeating unit of formula (II), and (B-3) a repeating unit of formula (III), R1 to R21, m, n, o, and p in formulas (I) to (III) are as defined in the specification, wherein based on the total moles of the repeating units (B-1), (B-2) and (B-3), the amount of the repeating unit (B-2) ranges from 19 mol % to 36 mol %; and wherein the weight ratio of the olefin copolymer (B) to the unsaturated monomer (A) ranges from 2 to 20.

Abstract: A solvent-free resin composition is provided. The solvent-free resin composition includes: (A) an epoxy resin component, including at least two multi-functional epoxy resins, each of which has at least three epoxy groups in a molecule; (B) an epoxy resin hardener; and (C) inorganic fillers, including a hollow filler and a non-hollow spherical filler, wherein the weight ratio of the hollow filler to the non-hollow spherical filler is from 1:5 to 6:1.

Abstract: A halogen-free low dielectric resin composition is provided.

Abstract: A dielectric composite is provided. The dielectric composite includes: at least one first dielectric layer; and at least one second dielectric layer, wherein the first dielectric layer has a thermal coefficient of dielectric constant (TCDk) not higher than ?150 ppm/° C., and the second dielectric layer has a TCDK not lower than 50 ppm/° C.; and the dielectric composite has a dielectric constant (Dk) not lower than 4, and a TCDk ranging from 0 to ?150 ppm/° C.

Abstract: A resin composition, comprising: (a) a resin of formula (I): (b) triallyl isocyanurate (TAIC) as a first hardener; and (c) a hardening promoter, which is a metallic salt compound of formula (II): wherein, R1, R2, R3, R4, A1, A2, Ma+, b, and n are as defined in the specification, and wherein the weight ratio of the resin (a) to the first hardener (b) is about 10:1 to about 1:1, and the content of the hardening promoter (c) is about 0.1 wt % to less than 15 wt % based on the total weight of the resin (a) and the first hardener (b), and the weight ratio of the resin (a) to the total amount of the first hardener (b) and BMI is not lower than 1:1.

Abstract: A dielectric composite is provided. The dielectric composite includes: at least one first dielectric layer; and at least one second dielectric layer, wherein the first dielectric layer has a thermal coefficient of dielectric constant (TCDk) not higher than ?150 ppm/° C., and the second dielectric layer has a TCDK not lower than 50 ppm/° C.; and the dielectric composite has a dielectric constant (Dk) not lower than 4, and a TCDk ranging from 0 to ?150 ppm/° C.

Abstract: A resin composition is provided. The resin composition comprises the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.008 at 10 GHz and comprises a bismaleimide resin of the following formula (I), wherein M1 and the Z1 groups are as defined in the specification; and (b) an organic compound of the following formula (II) or formula (III), wherein R?, R11 to R19 and R21 to R28 are as defined in the specification, and wherein the amount of the organic compound (b) ranges from 1 wt % to 30 wt % based on the total weight of the resin system (a) and the organic compound (b).

Abstract: A resin composition is provided.

Abstract: An adhesive composition is provided including the following components: (A) an unsaturated monomer; and (B) an olefin copolymer comprising the following repeating units: (B-1) a repeating unit of formula (I), (B-2) a repeating unit of formula (II), and (B-3) a repeating unit of formula (III), R1 to R21, m, n, o, and p in formulas (I) to (III) are as defined in the specification, wherein based on the total moles of the repeating units (B-1), (B-2) and (B-3), the amount of the repeating unit (B-2) ranges from 19 mol % to 36 mol %; and wherein the weight ratio of the olefin copolymer (B) to the unsaturated monomer (A) ranges from 2 to 20.

Abstract: A resin composition is provided. The resin composition comprises: (a) a resin of formula (I); (b) a cross-linking agent; and (c) a compound of formula (II); wherein, R1, R2, A1, A2, n, and R? are as defined in the specification; and the weight ratio of the resin (a) and the cross-linking agent (b) are about 6:1 to about 1:1, and the weight ratio of the compound (c) and the total weight of the resin (a) and the cross-linking agent (b) are about 1:1 to about 1:20.

Abstract: A resin composition is provided. The resin composition comprises the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.008 at 10 GHz and comprises a bismaleimide resin of the following formula (I), wherein M1 and the Z1 groups are as defined in the specification; and (b) an organic compound of the following formula (II) or formula (III), wherein R?, R11 to R19 and R21 to R28 are as defined in the specification, and wherein the amount of the organic compound (b) ranges from 1 wt % to 30 wt % based on the total weight of the resin system (a) and the organic compound (b).

Abstract: A solvent-free thermosetting filling resin composition is provided. The resin composition comprises the following components: (A) a benzoxazine resin of formula (I), (B) an epoxy resin with an alicyclic skeleton; (C) an epoxy resin hardener; (D) a benzoxazine resin hardener; and (E) a modified filler, wherein, A, B, R, and n in formula (I) are as defined in the specification.

Abstract: A solvent-free thermosetting filling resin composition is provided. The resin composition comprises the following components: (A) a benzoxazine resin of formula (I), (B) an epoxy resin with an alicyclic skeleton; (C) an epoxy resin hardener; (D) a benzoxazine resin hardener; and (E) a modified filler, wherein, A, B, R, and n in formula (I) are as defined in the specification.

Abstract: A resin composition, comprising the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.004 at 10 GHz; and (b) an alkenyl phenoxy phosphazene component, wherein the amount of the component (b) is 1 wt % to 30 wt % based on the total weight of the resin system (a) and the component (b).

Abstract: A method of manufacturing a metal-clad laminate and uses of the same are provided. The method comprises the following steps: (a) impregnating a reinforcement material with a first fluoropolymer solution, and drying the impregnated reinforcement material under a first temperature to obtain a first prepreg; (b) impregnating the first prepreg with a second fluoropolymer solution, and drying the impregnated first prepreg under a second temperature to obtain a second prepreg; and (c) laminating the second prepreg and a metal-clad to obtain a metal-clad laminate, wherein the first fluoropolymer solution has a first fluoropolymer, the second fluoropolymer solution has a second fluoropolymer, and the first fluoropolymer and the second fluoropolymer are different.

Abstract: A resin composition is provided. The resin composition comprises: (a) a resin of formula (I): and (b) a solvent, wherein, X, Y, R1 to R4, A1, A2, m and n are as defined in the specification.