Patents by Inventor Shur-Fen Liu
Shur-Fen Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8488299Abstract: The disclosure provides a capacitor structure. A first dielectric layer is disposed over the first electrode layer. A second electrode layer is disposed over the first dielectric layer. At least one of the first electrode layer and the second electrode layer has a peak-valley like structure to create at least two different gap distances therebetween, thereby providing parallel combinations of at least two different capacitances.Type: GrantFiled: July 22, 2010Date of Patent: July 16, 2013Assignee: Industrial Technology Research InstituteInventors: Shih-Hsien Wu, Min-Lin Lee, Shinn-Juh Lai, Shur-Fen Liu, Meng-Hua Chen, Chin-Hsien Hung
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Patent number: 8420745Abstract: A thermally curable solder resist composition for a flexible printed circuit board is provided. The solder resist composition includes (a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin includes at least an aliphatic polyester modified epoxy resin having formula (I) or (II), in which, each of R1 and R2, independently, is a C6-38 saturated or an unsaturated carbon chain, R3 is ether, phenyl, a C6-38 heterocyclic or C6-38 saturated carbon chain, n is an integer of 1-10 and the aliphatic polyester modified epoxy resin had a molecular weight of 1000-5000; (b) 1-10 parts by weight of a curing agent; and (c) 1-10 parts by weight of a catalyst.Type: GrantFiled: August 24, 2011Date of Patent: April 16, 2013Assignee: Industrial Technology Research InstituteInventors: Jhy-Long Jeng, Jeng-Yu Tsai, Shur-Fen Liu, Jinn-Shing King
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Patent number: 8390984Abstract: The disclosed is a capacitor substrate structure to reduce the high leakage current and low insulation resistance issue of organic/inorganic hybrid materials with ultra-high dielectric constant. The insulation layer, disposed between two conductive layers, includes multi-layered dielectric layers. At least one of the dielectric layers has high dielectric constant, including high dielectric constant ceramic powder and conductive powder evenly dispersed in organic resin. The other dielectric layers can be organic resin, or further include high dielectric constant ceramic powder dispersed in the organic resin. The substrate has an insulation resistance of about 50K? and leakage current of below 100 ?Amp under operational voltage.Type: GrantFiled: August 21, 2009Date of Patent: March 5, 2013Assignee: Industrial Technology Research InstituteInventors: Shur-Fen Liu, Meng-Huei Chen, Bih-Yih Chen, Yun-Tien Chen
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Publication number: 20130029049Abstract: A polyimide copolymer represented by formula (I) or formula (II) is provided. In formula (I) or formula (II), B is a cycloaliphatic group or aromatic group, A is an aromatic group, R is hydrogen or phenyl, and m and n are 20-50. The invention also provides a method for fabricating a patterned metal oxide layer.Type: ApplicationFiled: December 23, 2011Publication date: January 31, 2013Inventors: Jhy-Long JENG, Jeng-Yu TSAI, Shur-Fen LIU, Chin-Ching LIN, Yu-Chun CHEN, Wen-Ching SUN, Jinn-Shing KING
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Patent number: 8304666Abstract: A plurality of coaxial leads is made within a single via in a circuit substrate to enhance the density of vertical interconnection so as to match the demand for higher density multi-layers circuit interconnection between top circuit layer and bottom circuit layer of the substrate. Coaxial leads provide electromagnetic interference shielding among the plurality of coaxial leads in a single via.Type: GrantFiled: May 19, 2009Date of Patent: November 6, 2012Assignee: Industrial Technology Research InstituteInventors: Cheng-Ta Ko, Min-Lin Lee, Wei-Chung Lo, Shur-Fen Liu, Jinn-Shing King, Shinn-Juh Lai, Yu-Hua Chen
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Patent number: 8289679Abstract: A decoupling device includes a lead frame, a capacitor unit, a metal layer, and a high dielectric organic-inorganic composite material layer. The lead frame includes a cathode terminal portion and an anode terminal portion. The capacitor unit is disposed on the lead frame. The capacitor unit includes a cathode portion, an anode portion, and an insulation portion located between the cathode portion and the anode portion. The cathode portion is electrically connected to the cathode terminal portion, and the anode portion is electrically connected to the anode terminal portion. The high dielectric organic-inorganic composite material layer is connected to the capacitor unit in parallel via the metal layer.Type: GrantFiled: May 10, 2010Date of Patent: October 16, 2012Assignee: Industrial Technology Research InstituteInventors: Cheng-Liang Cheng, Chi-Lun Chen, Li-Duan Tsai, Min-Lin Lee, Shur-Fen Liu
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Patent number: 8227894Abstract: A stepwise capacitor structure includes at least one stepwise conductive layer. The stepwise capacitor represents a feature of multiple capacitors. When currents flow through the stepwise capacitor, different current paths are presented in between an upper conductor and a bottom conductor of the stepwise capacitor in response to different current frequency; different inductor is induced in each path and decoupled by a stepwise capacitor structure as disclosed herein.Type: GrantFiled: March 25, 2009Date of Patent: July 24, 2012Assignee: Industrial Technology Research InstituteInventors: Min-Lin Lee, Shih-Hsien Wu, Shinn-Juh Lai, Shur-Fen Liu
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Publication number: 20120156459Abstract: The disclosure provides a polyimide film laminate and a metal clad laminate employing the same. The polyimide film laminate includes a first polyimide film, a second polyimide film disposed on the first polyimide film, and a third polyimide film disposed on the second polyimide film. Particularly, the first polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m·K and a breakdown voltage greater than about 3KV, the second polyimide film has a thermal conductivity of more than about 1 watts/m·K, and the third polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m·K and a breakdown voltage greater than about 3KV.Type: ApplicationFiled: June 13, 2011Publication date: June 21, 2012Inventors: Charng-Shing Lu, Si-Yi Chin, Shur-Fen Liu, Jinn-Shing King
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Publication number: 20120121913Abstract: Disclosed is an adhesive composition including 100 parts by weight of lignin, 150 to 400 parts by weight of epoxy resin, and 7.5 to 200 parts by weight of flexibilizer. The lignin and the flexibilizer can be pre-reacted to enhance the physical properties, e.g. glass transition temperature (Tg) and flexural endurance (MIT), of the cured adhesive composition. Furthermore, the adhesive composition and a flexible metal foil can be laminated to form a flexible substrate.Type: ApplicationFiled: December 22, 2010Publication date: May 17, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Li-Ming CHANG, Meng-Huei CHEN, Shur-Fen LIU, Jinn-Shing KING, Yung-Chan LIN
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Patent number: 8138263Abstract: A flexible, low dielectric loss composition, used to fabricate a flexible substrate, is provided. The composition includes: SrTiO3 and/or Ba(Sr)TiO3 ceramic particle, with a particular size between 30 nm and 2 ?m, in an amount of 20-80% by weight of the composition; at least one flexile macromolecule in an amount of 1.0-50% by weight of the composition, wherein the macromolecules have functional groups of hydroxyl group, carboxyl group, allyl group, amino group, or chain aliphatic epoxy group; and a thermosetting organic resin.Type: GrantFiled: December 27, 2008Date of Patent: March 20, 2012Assignee: Industrial Technology Research InstituteInventors: Shur-Fen Liu, Meng-Huei Chen, Man-Chun Yu
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Patent number: 8101038Abstract: The invention discloses double-sided metal clad laminates and fabrication methods thereof. A plurality of polyamic acid coatings is co-extruded on a first metal foil and heat imidization to provide a multilayer polyimide film. A second metal foil is hot pressed on the multilayer polyimide film, thus providing a double-sided metal clad laminate. The polyamic acid coatings include a first, a second, and a third polyamic acid coating with surface tensions of S1, S2, and S3, respectively, satisfying relations of S1>S2>S3, wherein the first polyamic acid coating is the coating directly applied on the first metal foil.Type: GrantFiled: March 15, 2009Date of Patent: January 24, 2012Assignee: Industrial Technology Research InstituteInventors: Charng-Shing Lu, Shu-Chu Shih, Jinn-Shing King, Shur-Fen Liu
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Publication number: 20110306703Abstract: A thermally curable solder resist composition for a flexible printed circuit board is provided. The solder resist composition includes (a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin includes at least an aliphatic polyester modified epoxy resin having formula (I) or (II), in which, each of R1 and R2, independently, is a C6-38 saturated or an unsaturated carbon chain, R3 is ether, phenyl, a C6-38 heterocyclic or C6-38 saturated carbon chain, n is an integer of 1-10 and the aliphatic polyester modified epoxy resin had a molecular weight of 1000-5000; (b) 1-10 parts by weight of a curing agent; and (c) 1-10 parts by weight of a catalyst.Type: ApplicationFiled: August 24, 2011Publication date: December 15, 2011Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jhy-Long JENG, Jeng-Yu TSAI, Shur-Fen LIU, Jinn-Shing KING
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Patent number: 8035951Abstract: A capacitor device with a capacitance is introduced. The capacitor device includes at least one capacitive element. The at least capacitive element comprises a pair of first conductive layers being opposed to each other, at least one first dielectric layer formed on a surface of at least one of the first conductive layers, and a second dielectric layer being sandwiched between the first conductive layers. The first dielectric layer has a first dielectric constant and the second dielectric layer has a second dielectric constant. The capacitance of the capacitor device depends on dielectric parameters of the first dielectric layer and the second dielectric layer. The dielectric parameters comprise the first dielectric constant and thickness of the at least one first dielectric layer and the second dielectric constant and thickness of the second dielectric layer.Type: GrantFiled: August 23, 2010Date of Patent: October 11, 2011Assignee: Industrial Technology Research InstituteInventors: Shih-Hsien Wu, Shinn-Juh Lai, Min-Lin Lee, Shur-Fen Liu
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Publication number: 20110157775Abstract: A decoupling device includes a lead frame, a capacitor unit, a metal layer, and a high dielectric organic-inorganic composite material layer. The lead frame includes a cathode terminal portion and an anode terminal portion. The capacitor unit is disposed on the lead frame. The capacitor unit includes a cathode portion, an anode portion, and an insulation portion located between the cathode portion and the anode portion. The cathode portion is electrically connected to the cathode terminal portion, and the anode portion is electrically connected to the anode terminal portion. The high dielectric organic-inorganic composite material layer is connected to the capacitor unit in parallel via the metal layer.Type: ApplicationFiled: May 10, 2010Publication date: June 30, 2011Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Cheng-Liang Cheng, Chi-Lun Chen, Li-Duan Tsai, Min-Lin Lee, Shur-Fen Liu
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Publication number: 20110054124Abstract: Additives of a polyamic acid resin composition are disclosed, including an ester-phenol compound, an imidazole compound, and a heterocyclic aromatic amine compound other than the imidazole compound. The high cyclization temperature and long cyclization period of conventional polyamic acid resin compositions can be lowered and shorten by the additives of the invention.Type: ApplicationFiled: October 26, 2009Publication date: March 3, 2011Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Li-Ming Chang, Charng-Shing Lu, Shur-Fen Liu, Jinn-Shing King
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Publication number: 20110033074Abstract: A transparent speaker is suitable for being disposed on a display panel. The transparent speaker includes a transparent membrane, a transparent electrode plate, and spacers. Each transparent electrode plate has a plurality of openings. The display panel includes a plurality of pixels. The pixels emit optical signals. A Moire spatial period of the optical signals is less than 600 ?m after the optical signals pass through the transparent speaker. When the transparent speaker is disposed on the display panel, a user is able to watch an image on the display panel through the transparent speaker without being interfered by a Moire.Type: ApplicationFiled: July 8, 2010Publication date: February 10, 2011Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: You Chia Chang, Jyi Tyan Yeh, Chun Ti Chen, Shur Fen Liu, Jyh Long Jeng, Dar Ming Chiang
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Publication number: 20110019335Abstract: The disclosure provides a capacitor structure. A first dielectric layer is disposed over the first electrode layer. A second electrode layer is disposed over the first dielectric layer. At least one of the first electrode layer and the second electrode layer has a peak-valley like structure to create at least two different gap distances therebetween, thereby providing parallel combinations of at least two different capacitances.Type: ApplicationFiled: July 22, 2010Publication date: January 27, 2011Inventors: Shih-Hsien WU, Min-Lin LEE, Shinn-Juh LAI, Shur-Fen LIU, Meng-Hua CHEN, Chin-Hsien HUNG
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Publication number: 20100321862Abstract: A capacitor device with a capacitance is introduced. The capacitor device includes at least one capacitive element. The at least capacitive element comprises a pair of first conductive layers being opposed to each other, at least one first dielectric layer formed on a surface of at least one of the first conductive layers, and a second dielectric layer being sandwiched between the first conductive layers. The first dielectric layer has a first dielectric constant and the second dielectric layer has a second dielectric constant. The capacitance of the capacitor device depends on dielectric parameters of the first dielectric layer and the second dielectric layer. The dielectric parameters comprise the first dielectric constant and thickness of the at least one first dielectric layer and the second dielectric constant and thickness of the second dielectric layer.Type: ApplicationFiled: August 23, 2010Publication date: December 23, 2010Inventors: Shih-Hsien Wu, Shinn-Juh Lai, Min-Lin Lee, Shur-Fen Liu
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Publication number: 20100309607Abstract: The disclosed is a capacitor substrate structure to reduce the high leakage current and low insulation resistance issue of organic/inorganic hybrid materials with ultra-high dielectric constant. The insulation layer, disposed between two conductive layers, includes multi-layered dielectric layers. At least one of the dielectric layers has high dielectric constant, including high dielectric constant ceramic powder and conductive powder evenly dispersed in organic resin. The other dielectric layers can be organic resin, or further include high dielectric constant ceramic powder dispersed in the organic resin. The substrate has an insulation resistance of about 50 K? and leakage current of below 100 ?Amp under operational voltage.Type: ApplicationFiled: August 21, 2009Publication date: December 9, 2010Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Shur-Fen Liu, Meng-Huei Chen, Bih-Yih Chen, Yun-Tien Chen
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Patent number: 7804678Abstract: A capacitor device with a capacitance is introduced. The capacitor device includes at least one capacitive element. The at least capacitive element comprises a pair of first conductive layers being opposed to each other, at least one first dielectric layer formed on a surface of at least one of the first conductive layers, and a second dielectric layer being sandwiched between the first conductive layers. The first dielectric layer has a first dielectric constant and the second dielectric layer has a second dielectric constant. The capacitance of the capacitor device depends on dielectric parameters of the first dielectric layer and the second dielectric layer. The dielectric parameters comprise the first dielectric constant and thickness of the at least one first dielectric layer and the second dielectric constant and thickness of the second dielectric layer.Type: GrantFiled: August 23, 2007Date of Patent: September 28, 2010Assignee: Industrial Technology Research InstituteInventors: Shih-Hsien Wu, Shinn-Juh Lai, Min-Lin Lee, Shur-Fen Liu