Abstract: A composition having a bismaleimide oligomer and preparation methods thereof are provided. The composition having a bismaleimide oligomer comprises a bismaleimide oligomer, wherein the bismaleimide oligomer is in an amount of more than 75 parts by weight, based on 100 parts by weight of the composition. Specifically, the bismaleimide oligomer is prepared by reacting bismaleimide monomers with batch-added barbituric acid.

Abstract: A thermally curable solder resist composition for a flexible printed circuit board is provided. The solder resist composition includes (a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin includes at least an aliphatic polyester modified epoxy resin having formula (I) or (II), in which, each of R1 and R2, independently, is a C6-38 saturated or an unsaturated carbon chain, R3 is ether, phenyl, a C6-38 heterocyclic or C6-38 saturated carbon chain, n is an integer of 1-10 and the aliphatic polyester modified epoxy resin had a molecular weight of 1000-5000; (b) 1-10 parts by weight of a curing agent; and (c) 1-10 parts by weight of a catalyst.

Abstract: A plurality of coaxial leads is made within a single via in a circuit substrate to enhance the density of vertical interconnection so as to match the demand for higher density multi-layers circuit interconnection between top circuit layer and bottom circuit layer of the substrate. Coaxial leads provide electromagnetic interference shielding among the plurality of coaxial leads in a single via.

Abstract: Gas sensing material and gas sensor employing the same are provided. The gas sensing material includes an inorganic metal oxide and an organic polymer, wherein the organic polymer includes a repeat unit having the structure of wherein R1 and R2 are an independent alkyl group, alkoxy group, alkoxycarbonyl group, aryl group, heteroaryl group, or aliphatic group.

Abstract: The invention discloses double-sided metal clad laminates and fabrication methods thereof. A plurality of polyamic acid coatings is co-extruded on a first metal foil and heat imidization to provide a multilayer polyimide film. A second metal foil is hot pressed on the multilayer polyimide film, thus providing a double-sided metal clad laminate. The polyamic acid coatings include a first, a second, and a third polyamic acid coating with surface tensions of S1, S2, and S3, respectively, satisfying relations of S1>S2>S3, wherein the first polyamic acid coating is the coating directly applied on the first metal foil.

Abstract: An organic/inorganic hybrid composition with electrostatic discharge protection properties, high thermal stability, good adhesion, low costs, and good processability is disclosed. The composition includes a thermosetting resin system, an inherently dissipative polymer, and non-insulating particles. The inherently dissipative polymer and the non-insulating particles are dispersed within the thermosetting resin system.

Abstract: The invention discloses a curable ink composition which comprises about 1-10 parts by weight of a curable epoxy resin system, about 1-30 parts by weight of ferroelectric ceramic powders, about 0.1-10 parts by weight of a polymeric dispersant, and about 50-96 parts by weight of a solvent. The ink composition is suitable for forming a high dielectric film by inkjet printing for built-in capacitors.

Abstract: A stepwise capacitor structure includes at least one stepwise conductive layer. The stepwise capacitor represents a feature of multiple capacitors. When currents flow through the stepwise capacitor, different current paths are presented in between an upper conductor and a bottom conductor of the stepwise capacitor in response to different current frequency; different inductor is induced in each path and decoupled by a stepwise capacitor structure as disclosed herein.

Abstract: A hybrid capacitor is provided which includes a substrate, at least one plate capacitor and at least one through hole capacitor. The substrate has through holes and the plate capacitors are on the substrate. At least one through hole capacitor and at least one plate capacitor are in parallel. The through hole capacitor at least includes an anode layer, a first dielectric layer, a first cathode layer and a second cathode layer. The anode layer is disposed on an inner surface of at least one through hole, and a surface of the anode layer is a porous structure. The first dielectric layer is disposed on the porous structure of the anode layer and covered with the first cathode layer. The first cathode layer is covered with the second cathode layer. A conductivity of the second cathode layer is larger than a conductivity of the first cathode layer.

Abstract: A flexible, low dielectric loss composition, used to fabricate a flexible substrate, is provided. The composition includes: SrTiO3 and/or Ba(Sr)TiO3 ceramic particle, with a particular size between 30 nm and 2 ?m, in an amount of 20-80% by weight of the composition; at least one flexile macromolecule in an amount of 1.0-50% by weight of the composition, wherein the macromolecules have functional groups of hydroxyl group, carboxyl group, allyl group, amino group, or chain aliphatic epoxy group; and a thermosetting organic resin.

Abstract: A hybrid capacitor is provided which includes a substrate, at least one plate capacitor and at least one through hole capacitor. The substrate has through holes and the plate capacitors are on the substrate. At least one through hole capacitor and at least one plate capacitor are in parallel. The through hole capacitor at least includes an anode layer, a first dielectric layer, a first cathode layer and a second cathode layer. The anode layer is disposed on an inner surface of at least one through hole, and a surface of the anode layer is a porous structure. The first dielectric layer is disposed on the porous structure of the anode layer and covered with the first cathode layer. The first cathode layer is covered with the second cathode layer. A conductivity of the second cathode layer is larger than a conductivity of the first cathode layer.

Abstract: A multi-tier capacitor structure has at least one multi-tier conductive layer. At least one conductive via passes through the multi-tier conductive layer. When currents flow through the conductive via, different current paths are presented in the conductive via in response to different current frequency; in other words, different inductor is induced. Therefore, a single plate capacitor structure has function of hierarchical decoupling capacitor effect.

Abstract: A capacitor device with a capacitance is introduced. The capacitor device includes at least one capacitive element. The at least capacitive element comprises a pair of first conductive layers being opposed to each other, at least one first dielectric layer formed on a surface of at least one of the first conductive layers, and a second dielectric layer being sandwiched between the first conductive layers. The first dielectric layer has a first dielectric constant and the second dielectric layer has a second dielectric constant. The capacitance of the capacitor device depends on dielectric parameters of the first dielectric layer and the second dielectric layer. The dielectric parameters comprise the first dielectric constant and thickness of the at least one first dielectric layer and the second dielectric constant and thickness of the second dielectric layer.

Abstract: A composition having a bismaleimide oligomer and preparation methods thereof are provided. The composition having a bismaleimide oligomer comprises a bismaleimide oligomer, wherein the bismaleimide oligomer is in an amount of more than 75 parts by weight, based on 100 parts by weight of the composition. Specifically, the bismaleimide oligomer is prepared by reacting bismaleimide monomers with batch-added barbituric acid.

Abstract: The present invention discloses an organic-inorganic hybrid composition with sufficient flexibility, a high dielectric constant, which can be used as a bonding layer having a high thermal stability and high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) an electrically conductive powder, such as an electrically conductive carbon black; d) at least one macromolecular flexibilizer; e) a macromolecular dispersant; and f) additives such as a diluent, an adhesive promoter, a hardener, a hardener promoter, and an organic solvent.

Abstract: An interleaving striped capacitor substrate structure for pressing-type print circuit boards is disclosed. To meet the high-frequency, high-speed, and high-density requirements in modern electronic systems, the interleaving striped capacitor substrate structure uses several dielectric materials of different dielectric coefficients to make a dielectric layer. One dielectric layer can be stacked on another to form a multi-layered capacitor substrate so that a single capacitor substrate can provide the highest capacitance required for the decoupling capacitor to suppress high-frequency noise signals, and the lower dielectric coefficient substrate required for high-speed signal transmission. This simultaneously achieves the effects of reducing high-frequency transmission time and suppressing high-frequency noise.

Abstract: The present invention discloses an organic-inorganic hybrid composition with a high dielectric constant, which can be used as a bonding layer having a high thermal stability and a high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) at least one macromolecular flexibilizer; d) a macromolecular dispersant; and e) additives such as a diluent, an adhesive promoter, a catalyst, and an organic solvent.

Abstract: The present invention discloses an organic-inorganic hybrid composition with sufficient flexibility, a high dielectric constant, which can be used as a bonding layer having a high thermal stability and high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) an electrically conductive powder, such as an electrically conductive carbon black; d) at least one macromolecular flexibilizer; e) a macromolecular dispersant; and f) additives such as a diluent, an adhesive promoter, a hardener, a hardener promoter, and an organic solvent.

Abstract: An interleaving striped capacitor substrate structure for pressing-type print circuit boards is disclosed. To meet the high-frequency, high-speed, and high-density requirements in modern electronic systems, the interleaving striped capacitor substrate structure uses several dielectric materials of different dielectric coefficients to make a dielectric layer. One dielectric layer can be stacked on another to form a multi-layered capacitor substrate so that a single capacitor substrate can provide the highest capacitance required for the decoupling capacitor to suppress high-frequency noise signals, and the lower dielectric coefficient substrate required for high-speed signal transmission. This simultaneously achieves the effects of reducing high-frequency transmission time and suppressing high-frequency noise.

Abstract: The present invention discloses an organic-inorganic hybrid composition with a high dielectric constant, which can be used as a bonding layer having a high thermal stability and a high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) at least one macromolecular flexibilizer; d) a macromolecular dispersant; and e) additives such as a diluent, an adhesive promoter, a catalyst, and an organic solvent.