Abstract: A resistive memory system, a driver circuit thereof and a method for setting resistances thereof are provided. The resistive memory system includes a memory array, a row selection circuit, a first control circuit and a second control circuit. The memory array has a plurality of resistive memory cells. The row selection circuit is used for activating the resistive memory cells. The first control circuit and the second control circuit are coupled to the resistive memory cells. When each of resistive memory cells is set, the first control circuit and the second control circuit respectively provide a set voltage and a ground voltage to the each of resistive memory cells to form a set current, and the set current is clamped by at least one of the first control circuit and the second control circuit.

Abstract: TSV repair circuit of a semiconductor device includes a first chip, a second chip, at least two TSV, at least two data path circuits and an output logic circuit. Each data path circuit comprises an input driving circuit, a TSV detection circuit, a memory device, a protection circuit and a power control circuit. The TSV detection circuit detects a TSV status, the memory device keeps the TSV status, the protection circuit determines whether to pull a first end of the TSV to a ground voltage according to the TSV status, and the power control circuit prevents a leakage current of a power voltage from flowing through a substrate.

Abstract: A memory storage circuit includes a volatile memory portion, a control portion, and a non-volatile memory portion. The volatile memory portion includes a first node and a second node to store a pair of complementary logic data. The control portion includes a first transistor and a second transistor. Gate electrodes of the first and second transistors are coupled to receive a store signal, and first electrodes of the first and second transistors are coupled to receive a control signal. The non-volatile memory portion includes a first resistive memory element and a second resistive memory element to store the pair of complementary logic data. The first resistive memory element is coupled between a second electrode of the first transistor and the first node, and the second resistive memory element is coupled between a second electrode of the second transistor and the second node.

Abstract: A memory storage circuit includes a volatile memory portion, a control portion, and a non-volatile memory portion. The volatile memory portion includes a first node and a second node to store a pair of complementary logic data. The control portion includes a first transistor and a second transistor. Gate electrodes of the first and second transistors are coupled to receive a store signal, and first electrodes of the first and second transistors are coupled to receive a control signal. The non-volatile memory portion includes a first resistive memory element and a second resistive memory element to store the pair of complementary logic data. The first resistive memory element is coupled between a second electrode of the first transistor and the first node, and the second resistive memory element is coupled between a second electrode of the second transistor and the second node.

Abstract: TSV repair circuit of a semiconductor device includes a first chip, a second chip, at least two TSV, at least two data path circuits and an output logic circuit. Each data path circuit comprises an input driving circuit, a TSV detection circuit, a memory device, a protection circuit and a power control circuit. The TSV detection circuit detects a TSV status, the memory device keeps the TSV status, the protection circuit determines whether to pull a first end of the TSV to a ground voltage according to the TSV status, and the power control circuit prevents a leakage current of a power voltage from flowing through a substrate.

Abstract: A configurable logic block (CLB) and an operation method of the CLB are provided. The CLB includes memory units and a selecting circuit. The memory unit includes a first resistive non-volatile memory (RNVM) element and a second RNVM element. Top electrodes (TEs) of the first and second RNVM elements are coupled to an output terminal of the memory unit. Bottom electrodes (BEs) of the first and second RNVM elements are respectively coupled to a first bias terminal and a second bias terminal of the memory unit. The selecting circuit selects one of the memory units according to an input logic value and determines an output logic value of the CLB according to an output logic value of the selected memory unit.

Abstract: A configurable logic block (CLB) and an operation method of the CLB are provided. The CLB includes memory units and a selecting circuit. The memory unit includes a first resistive non-volatile memory (RNVM) element and a second RNVM element. Top electrodes (TEs) of the first and second RNVM elements are coupled to an output terminal of the memory unit. Bottom electrodes (BEs) of the first and second RNVM elements are respectively coupled to a first bias terminal and a second bias terminal of the memory unit. The selecting circuit selects one of the memory units according to an input logic value and determines an output logic value of the CLB according to an output logic value of the selected memory unit.

Abstract: A resistive random-access memory device includes a memory array, a read circuit, a write-back logic circuit and a write-back circuit. The read circuit reads the data stored in a selected memory cell and accordingly generates a first control signal. The write-back logic circuit generates a write-back control signal according to the first control signal and a second control signal. The write-back circuit performs a write-back operation on the selected memory cell according to the write-back control signal and a write-back voltage, so as to change a resistance state of the selected memory cell from a low resistance state to a high resistance state, and generates the second control signal according to the resistance state of the selected memory cell.

Abstract: A circuit and a method for controlling the write timing of a non-volatile memory are provided. The method includes the following steps. First, a resistance state switching of at least one memory cell of the non-volatile memory executing a writing operation is monitored to output a control signal. The memory cell stores data states with different resistance states. A write timing is input to the memory cell through a timing control line. Next, the write timing is generated based on a clock signal and the control signal. The write timing is enabled at the beginning of a cycle of the clock signal, and is disabled when the memory cell finishes the resistance state switching.

Abstract: A phase change memory with an operating current that can be gradually increased or gradually decreased. The phase change memory has a phase change storage element, a transistor, and a control circuit. The transistor is operable to adjust the operating current flowing through the phase change storage element. The transistor has a first terminal coupled to a voltage source, a second terminal coupled to the phase change storage element, and a control terminal receiving a control signal from the control circuit. The control circuit is specially designed to limit the transistor in a linear region.

Abstract: A non-volatile static random access memory (NVSRAM) cell including a static random access circuit, first storage device, a second storage device, and a switch unit is provided. The static random access circuit has a first terminal and a second terminal respectively having a first voltage and a second voltage. Stored data in the first storage device and the second storage device are determined by the first voltage and the second voltage. The first storage device and the second storage device respectively have a first connection terminal and a second connection terminal. The switch unit is respectively coupled to the second connection terminals of the first storage device and the second storage device, and is controlled by a switching signal of a switch line to conduct the first storage device and the second storage device to a same bit line or a same complementary bit line.

Abstract: A measuring apparatus including a first chip, a first circuit layer, a first heater, a first stress sensor and a second circuit layer is provided. The first chip has a first through silicon via, a first surface and a second surface opposite to the first surface. The first circuit layer is disposed on the first surface. The first heater and the first stress sensor are disposed on the first surface and connected to the first circuit layer. The second circuit layer is disposed on the second surface. The first heater comprises a plurality of first switches connected in series to generate heat.

Abstract: A circuit and a method for controlling the write timing of a non-volatile memory are provided. The method includes the following steps. First, a resistance state switching of at least one memory cell of the non-volatile memory executing a writing operation is monitored to output a control signal. The memory cell stores data states with different resistance states. A write timing is input to the memory cell through a timing control line. Next, the write timing is generated based on a clock signal and the control signal. The write timing is enabled at the beginning of a cycle of the clock signal, and is disabled when the memory cell finishes the resistance state switching.

Abstract: A non-volatile random access memory (NV-RAM) and an operation method thereof are provided. The NV-RAM includes a latch unit, a switch, and a first to fourth non-volatile memory elements. First terminals of the first and the third non-volatile memory elements respectively couple to a first voltage and a second voltage. A second terminal of the first non-volatile memory element and a first terminal of the second non-volatile memory element are coupled to a first terminal of the latch unit. A second terminal of the third non-volatile memory element and a first terminal of the fourth non-volatile memory element are coupled to a second terminal of the latch unit. Second terminals of the second and the fourth non-volatile memory element are coupled to a first terminal of the switch. A second terminal of the switch is coupled to a third voltage.

Abstract: A non-volatile random access memory (NV-RAM) and an operation method thereof are provided. The NV-RAM includes a latch unit, a switch, and a first to fourth non-volatile memory elements. First terminals of the first and the third non-volatile memory elements respectively couple to a first voltage and a second voltage. A second terminal of the first non-volatile memory element and a first terminal of the second non-volatile memory element are coupled to a first terminal of the latch unit. A second terminal of the third non-volatile memory element and a first terminal of the fourth non-volatile memory element are coupled to a second terminal of the latch unit. Second terminals of the second and the fourth non-volatile memory element are coupled to a first terminal of the switch. A second terminal of the switch is coupled to a third voltage.

Abstract: A process variation detection apparatus and a process variation detection method are provided. The process variation detection apparatus includes a process variation detector and a compensation signal generator. The process variation detector includes a first process variation detection component, a second process variation detection component and a current comparator. The channel of the first process variation detection component is a first conductive type, and the channel of the second process variation detection component is a second conductive type, wherein the above-mentioned first conductive type is different from the second conductive type. The current comparator is connected to the first process variation detection component and the second process variation detection component for comparing the current difference between the two components and outputting a current comparison result.

Abstract: A non-volatile static random access memory (NVSRAM) cell including a static random access circuit, first storage device, a second storage device, and a switch unit is provided. The static random access circuit has a first terminal and a second terminal respectively having a first voltage and a second voltage. Stored data in the first storage device and the second storage device are determined by the first voltage and the second voltage. The first storage device and the second storage device respectively have a first connection terminal and a second connection terminal. The switch unit is respectively coupled to the second connection terminals of the first storage device and the second storage device, and is controlled by a switching signal of a switch line to conduct the first storage device and the second storage device to a same bit line or a same complementary bit line.

Abstract: A non-volatile static random access memory (NV-SRAM) including a latch unit, a first switch, a second switch, a first non-volatile memory (NVM), and a second NVM and an operation method thereof are provided. First terminals of the first and the second switch are respectively connected to a first and a second terminal of the latch unit. Second terminals of the first and the second switch are respectively connected to a first and a second bit line. Control terminals of the first and the second switch are connected to a word line. First terminals of the first and the second NVM are respectively connected to the first and the second terminal of the latch unit. Second terminals of the first and the second NVM are respectively connected to the first and the second bit line. Enable terminals of the first and the second NVM are connected to an enable line.

Abstract: A verification circuit for a phase change memory array is provided. A sensing unit senses a sensing voltage from a memory cell of the phase change memory array according to an enable signal. A comparator generates a comparing signal according to the sensing voltage and a reference voltage, so as to indicate whether the memory cell is in a reset state. A control unit generates a control signal according to the enable signal. An operating unit generates a first signal according to the control signal, so as to indicate whether the comparator is active. An adjustment unit provides a writing current to the cell, and increases the writing current according to the control signal until the comparing signal indicates that the memory cell is in a reset state.

Abstract: An embodiment of a writing system for a phase change memory based on a present application is disclosed. The writing system comprises a first phase change memory (PCM) cell, a second PCM cell, a first writing circuit and a verifying circuit. The first writing circuit executes a writing procedure, receives and writes a first data to the first PCM cell. The verifying circuit executes a verifying procedure and the circuit further comprises a processing unit and a second writing circuit. The processing unit reads and compares the data stored in the second PCM cell with a second data. The second writing circuit writes the second data to the second PCM cell when the data stored in the second PCM cell and the second data are not matched.