Patents by Inventor Son Nguyen

Son Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170275449
    Abstract: The invention relates to an aqueous pigmented coating composition containing at least one polymer P1 in the form of an aqueous polymer dispersion, and at least one water-soluble polymer P2 that is composed of ethylenically unsaturated monomers M and contains at least 30% by weight of polymerized N-vinylpyrrolidone in relation to the total amount of monomers M. The invention further relates to the use of the aqueous pigmented coating compositions of the invention for coating tannin-containing substrates, a coating method, and the coated substrates.
    Type: Application
    Filed: August 25, 2015
    Publication date: September 28, 2017
    Applicant: BASF SE
    Inventors: Audrey FUJII-COSYNS, Arno TUCHBREITER, Frank FISCHER, Son NGUYEN-KIM
  • Patent number: 9706996
    Abstract: Described herein are devices and methods for delivering implants that comprise multiple coupled anchors. The anchors are secured to tissue using a multi-opening guide tunnel that is configured to releasably retain one or more portions of the implant located between two of the anchors. The releasable retention of one or more intervening portions of the implant maintains the position of the implant and the guide tunnel until the implant is secured to the tissue. The multi-opening guide tunnel permits securement of the multiple anchors without requiring repositioning of the guide tunnel for each anchor.
    Type: Grant
    Filed: June 19, 2014
    Date of Patent: July 18, 2017
    Assignee: Ancora Heart, Inc.
    Inventors: Huu Nguyen, Son Nguyen, Eugene Serina, Tammy Y. Tam
  • Patent number: 9596781
    Abstract: A rack housing that holds a plurality of insertion components includes a plurality of insertion positions that hold the plurality of insertion components in a first area of the rack housing adjacent to a first housing side, a reduced pressure shaft in a second area of the rack housing adjacent to the first area, wherein between the reduced pressure shaft and the insertion components, first openings are provided to thereby remove air heated by the insertion components into the reduced pressure shaft, at least two second openings that suction off heated air from the reduced pressure shaft, and at least two non-return arrangements located in the reduced pressure shaft and correlated to the two second openings, the non-return arrangements preventing entry of air through the correlated second opening if no air is suctioned off through this second opening.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: March 14, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Bernhard Schrader, Van Son Nguyen
  • Publication number: 20170014229
    Abstract: An implantable prosthetic valve can comprise an annular frame comprising an inflow end and an outflow end and being radially collapsible and expandable between a radially collapsed configuration and a radially expanded configuration, the frame defining an axial direction extending from the inflow end to the outflow end, a leaflet structure positioned within the frame and secured thereto, and an annular outer skirt positioned around an outer surface of the frame, wherein the outer skirt comprises an inflow edge secured to the frame at a first location, an outflow edge comprising a plurality of alternating projections and notches, wherein the projections are secured to the frame at a second location, and the notches are not directly secured to the frame, an intermediate portion between the inflow edge and the outflow edge that comprises a plurality of openings.
    Type: Application
    Filed: July 13, 2016
    Publication date: January 19, 2017
    Inventors: Diana Nguyen-Thien-Nhon, Timothy A. Geiser, Larry L. Wood, Dinesh L. Sirimanne, Son Nguyen, Tamir S. Levi, Nikolay Gurovich, Michael Bukin
  • Publication number: 20160375809
    Abstract: A bodily support assembly includes a panel that may be positioned on a chair such that the panel extends along each of a seat, a back rest and a head rest of the chair thereby facilitating a user to sit on the panel. A pad is coupled to the panel such that the pad may be sat upon. A plurality of supports is provided and each of the supports is coupled to the panel. A pump is coupled to the panel and the pump selectively inflates each of the supports. A plurality of valves is provided and each of the valves is fluidly attached to an associated one of the supports to selectively deflate the associated support. A first strap, a second strap and a pair of third straps are coupled to the panel. Each of the first, second and third straps may be secured to the chair.
    Type: Application
    Filed: June 26, 2015
    Publication date: December 29, 2016
    Inventor: Son Nguyen
  • Publication number: 20160373394
    Abstract: A computer-implemented document management method is discussed. The method includes displaying in a messaging application a plurality of folders for storing electronic mail messages, analyzing content one or more of the electronic mail messages to locate identifiers associated with matters in a document management system, and generating a user-selectable object that, when selected, automatically causes the generation of a document management display for a user of the messaging application.
    Type: Application
    Filed: September 6, 2016
    Publication date: December 22, 2016
    Inventors: G. Roger Lee, Son Nguyen, Beau F. Mersereau, John A. Dragseth
  • Publication number: 20160276216
    Abstract: Compositions of matter, compounds, articles of manufacture and processes to reduce or substantially eliminate EM and/or stress migration, and/or TDDB in copper interconnects in microelectronic devices and circuits, especially a metal liner around copper interconnects comprise an ultra thin layer or layers of Mn alloys containing at least one of W and/or Co on the metal liner. This novel alloy provides EM and/or stress migration resistance, and/or TDDB resistance in these copper interconnects, comparable to thicker layers of other alloys found in substantially larger circuits and allows the miniaturization of the circuit without having to use thicker EM and/or TDDB resistant alloys previously used thereby enhancing the miniaturization, i.e., these novel alloy layers can be miniaturized along with the circuit and provide substantially the same EM and/or TDDB resistance as thicker layers of different alloy materials previously used that lose some of their EM and/or TDDB resistance when used as thinner layers.
    Type: Application
    Filed: May 10, 2016
    Publication date: September 22, 2016
    Inventors: DANIEL EDELSTEIN, Alfred Grill, Seth L. Knupp, Son Nguyen, Takeshi Nogami, Vamsi K. Paruchuri, Hosadurga K. Shobha, Chih-Chao Yang
  • Publication number: 20160276280
    Abstract: Compositions of matter, compounds, articles of manufacture and processes to reduce or substantially eliminate EM and/or stress migration, and/or TDDB in copper interconnects in microelectronic devices and circuits, especially a metal liner around copper interconnects comprise an ultra thin layer or layers of Mn alloys containing at least one of W and/or Co on the metal liner. This novel alloy provides EM and/or stress migration resistance, and/or TDDB resistance in these copper interconnects, comparable to thicker layers of other alloys found in substantially larger circuits and allows the miniaturization of the circuit without having to use thicker EM and/or TDDB resistant alloys previously used thereby enhancing the miniaturization, i.e., these novel alloy layers can be miniaturized along with the circuit and provide substantially the same EM and/or TDDB resistance as thicker layers of different alloy materials previously used that lose some of their EM and/or TDDB resistance when used as thinner layers.
    Type: Application
    Filed: May 10, 2016
    Publication date: September 22, 2016
    Applicant: International Business Machines Corporation
    Inventors: DANIEL EDELSTEIN, Alfred Grill, Seth L. Knupp, Son Nguyen, Takeshi Nogami, Vamsi K. Paruchuri, Hosadurga K. Shobha, Chih-Chao Yang
  • Publication number: 20160268160
    Abstract: Compositions of matter, compounds, articles of manufacture and processes to reduce or substantially eliminate EM and/or stress migration, and/or TDDB in copper interconnects in microelectronic devices and circuits, especially a metal liner around copper interconnects comprise an ultra thin layer or layers of Mn alloys containing at least one of W and/or Co on the metal liner. This novel alloy provides EM and/or stress migration resistance, and/or TDDB resistance in these copper interconnects, comparable to thicker layers of other alloys found in substantially larger circuits and allows the miniaturization of the circuit without having to use thicker EM and/or TDDB resistant alloys previously used thereby enhancing the miniaturization, i.e., these novel alloy layers can be miniaturized along with the circuit and provide substantially the same EM and/or TDDB resistance as thicker layers of different alloy materials previously used that lose some of their EM and/or TDDB resistance when used as thinner layers.
    Type: Application
    Filed: May 10, 2016
    Publication date: September 15, 2016
    Inventors: DANIEL EDELSTEIN, Alfred Grill, Seth L. Knupp, Son Nguyen, Takeshi Nogami, Vamsi K. Paruchuri, Hosadurga K. Shobha, Chih-Chao Yang
  • Patent number: 9441442
    Abstract: An apparatus for engaging and moving a ram block. In some embodiments, the apparatus, or ram block changer, includes a support bracket coupled to a blowout preventer and an articulated arm releasably coupled to the ram block. The ram block changer may further include a pivot coupling assembly having a first axis of rotation. The pivot coupling assembly extends through the support bracket and the articulated arm, wherein the articulated arm is rotatable about the first axis of rotation relative to the support bracket. The articulated arm may include a first member receiving the pivot coupling assembly therethrough, a second member coupled to the ram block, and a second pivot coupling assembly having a second axis of rotation spaced apart from the first axis of rotation and extending through the first and second members. The second member is rotatable about the second axis of rotation relative to the first member.
    Type: Grant
    Filed: April 2, 2014
    Date of Patent: September 13, 2016
    Assignee: National Oilwell Varco, L.P.
    Inventors: Tan Le, Son Nguyen, Dung Tran, Scott Lee
  • Publication number: 20160256149
    Abstract: Disclosed herein are devices and methods for assessing the surface of a target cardiac tissue and for delivering a tissue anchor to cardiac tissue at a preselected depth within the myocardium in a beating heart procedure. In one variation, an anchor delivery device comprises an elongate body, a tissue anchor disposed within a first longitudinal lumen of the elongate body, and a tissue depth indicator slidable within a second longitudinal lumen of the elongate body. The tissue depth indicator has a first configuration that indicates the boundary of the surface of the target tissue and a second configuration that indicates when the distal tip of the elongate body has been advanced to a preselected depth into the target tissue. In some variations, a tissue depth indicator may also be configured to resist or limit the penetration of the delivery device into tissue after a preselected depth has been reached.
    Type: Application
    Filed: March 4, 2016
    Publication date: September 8, 2016
    Inventors: Russel SAMPSON, Charles ADAM, Son NGUYEN, David Scott BARON
  • Publication number: 20160204009
    Abstract: A semiconductor processing system may include a substrate pedestal. The system may also include at least one fluid channel having a delivery portion configured to deliver a temperature controlled fluid to the substrate pedestal, and having a return portion configured to return the temperature controlled fluid from the substrate pedestal. The system may also include a heater coupled with the delivery portion of the at least one fluid channel. The system may also include a temperature measurement device coupled with the return portion of the at least one fluid channel, and the temperature measurement device may be communicatively coupled with the heater.
    Type: Application
    Filed: January 9, 2015
    Publication date: July 14, 2016
    Inventors: Son Nguyen, Dmitry Lubomirsky, Chungman Kim, Kirby H. Floyd
  • Patent number: 9374996
    Abstract: The present invention provides a composition comprising a pesticide and a copolymer, which contains in polymerized form acrylic acid and/or methacrylic acid (monomer A); a mono C12-C22 alkyl terminated poly(C2-6 alkylene glycol)(meth)acrylate (monomer B); and a C1-C8 alkyl(meth)acrylate (monomer C). Further on, it provides a process for preparing said composition by contacting the pesticide and the copolymer; a method for controlling phytopathogenic fungi and/or unwanted plant growth and/or unwanted insect or mite infestation and/or for regulating the growth of plants, wherein said composition is caused to act on the respective pests, their habitat or the plants to be protected from the respective pest, to the soil and/or to unwanted plants and/or the crop plants and/or their habitat; and a plant propagation material comprising said composition.
    Type: Grant
    Filed: March 22, 2013
    Date of Patent: June 28, 2016
    Assignee: BASF SE
    Inventors: Murat Mertoglu, Ann-Kathrin Marguerre, Vandana Kurkal-Siebert, Son Nguyen-Kim
  • Publication number: 20160068650
    Abstract: A polysaccharide based aerogel comprising a network of polysaccharide fibers with pores therebetween, wherein the sizes of the pores are in the micrometer range.
    Type: Application
    Filed: May 2, 2014
    Publication date: March 10, 2016
    Inventors: Hai Minh Duong, Beng Chye Vincent Tan, Truong Son Nguyen, Shao Kai NG
  • Patent number: 9219037
    Abstract: A porous SiCOH dielectric film in which the stress change caused by increased tetrahedral strain is minimized by post treatment in unsaturated Hydrocarbon ambient. The p-SiCOH dielectric film has more —(CHx) and less Si—O—H and Si—H bonding moieties. Moreover, a stable pSiOCH dielectric film is provided in which the amount of Si—OH (silanol) and Si—H groups at least within the pores has been reduced by about 90% or less by the post treatment. A p-SiCOH dielectric film is produced that is flexible since the pores include stabilized crosslinking —(CHx)— chains wherein x is 1, 2 or 3 therein. The dielectric film is produced utilizing an annealing step subsequent deposition that includes a gaseous ambient that includes at least one C—C double bond and/or at least one C—C triple bond.
    Type: Grant
    Filed: September 4, 2012
    Date of Patent: December 22, 2015
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Stephen M. Gates, Alfred Grill, Son Nguyen, Satyanarayana V. Nitta, Thomas M. Shaw
  • Publication number: 20150357236
    Abstract: Compositions of matter, compounds, articles of manufacture and processes to reduce or substantially eliminate EM and/or stress migration, and/or TDDB in copper interconnects in microelectronic devices and circuits, especially a metal liner around copper interconnects comprise an ultra thin layer or layers of Mn alloys containing at least one of W and/or Co on the metal liner. This novel alloy provides EM and/or stress migration resistance, and/or TDDB resistance in these copper interconnects, comparable to thicker layers of other alloys found in substantially larger circuits and allows the miniaturization of the circuit without having to use thicker EM and/or TDDB resistant alloys previously used thereby enhancing the miniaturization, i.e., these novel alloy layers can be miniaturized along with the circuit and provide substantially the same EM and/or TDDB resistance as thicker layers of different alloy materials previously used that lose some of their EM and/or TDDB resistance when used as thinner layers.
    Type: Application
    Filed: June 8, 2014
    Publication date: December 10, 2015
    Inventors: Daniel Edelstein, Alfred Grill, Seth L. Knupp, Son Nguyen, Takeshi Nogami, Vamsi K. Paruchuri, Hosadurga K. Shobha, Chih-Chao Yang
  • Publication number: 20150315323
    Abstract: Provided are: a copolymer for rheological or cosmetic compositions and a composition thereof, and methods of making and using the same. Said copolymer comprises a) a first acrylic ester as monomer A, said monomer A being a branched acrylic ester; b) at least one further acrylic ester as monomer B, said monomer B being a linear acrylic ester; c) a cyclic N-vinyl amide as monomer C; d) at least one compound comprising a radically polymerizable ?.?-ethylenically un-saturated double bond and at least one cationic and/or cationogenic moiety said compound being monomer D; e) at least one monoethylenically unsaturated carboxylic acid as monomer E; with the monomer B in its polymerized form having a glass transition temperature of 24° C. or lower and making at most one third of the weight amount of monomer A.
    Type: Application
    Filed: November 20, 2013
    Publication date: November 5, 2015
    Inventors: Son Nguyen-Kim, David Graham, Holger Türk
  • Patent number: 9105642
    Abstract: A dielectric stack and method of depositing the stack to a substrate using a single step deposition process. The dielectric stack includes a dense layer and a porous layer of the same elemental compound with different compositional atomic percentage, density, and porosity. The stack enhances mechanical modulus strength and enhances oxidation and copper diffusion barrier properties. The dielectric stack has inorganic or hybrid inorganic-organic random three-dimensional covalent bonding throughout the network, which contain different regions of different chemical compositions such as a cap component adjacent to a low-k component of the same type of material but with higher porosity.
    Type: Grant
    Filed: May 23, 2014
    Date of Patent: August 11, 2015
    Assignee: International Business Machines Corporation
    Inventors: Griselda Bonilla, Alfred Grill, Thomas J. Haigh, Jr., Satyanarayana V. Nitta, Son Nguyen
  • Patent number: 9089128
    Abstract: The present invention relates to a use of a copolymer comprising N-vinyllactam, and vinylimidazol or a quaternized vinylimidazol in polymerized form as dispersing agent in an aqueous composition containing a water-insoluble pesticide. Further on, it relates to an aqueous composition which contains a copolymer comprising in polymerized form at least 20 mol % N-vinyllactam, and at least 1 mol % vinylimidazol or a quaternized vinylimidazol, a water-insoluble pesticide, and a dissolved salt. The invention also relates to a method for preparing the said composition by mixing water, the water-insoluble pesticide, the salt and the copolymer.
    Type: Grant
    Filed: August 3, 2011
    Date of Patent: July 28, 2015
    Assignee: BASF SE
    Inventors: Murat Mertoglu, Matthias Bratz, Jürgen Jakob, Winfried Mayer, Stefan Fischer, Son Nguyen Kim, Charles W. Finch
  • Publication number: 20150198273
    Abstract: A tube fitting including a first coupling member having at least a snap coupling, and a second coupling member having a first quick-connect side having a mating snap coupling disposed at a first end of the second coupling member, and a second quick-connect side configured for threaded engagement disposed at a second end of the second coupling member, the second end being opposite the first end, wherein the mating snap coupling is configured to engage the snap coupling to effect coupling of the first and second coupling member.
    Type: Application
    Filed: January 14, 2014
    Publication date: July 16, 2015
    Applicant: The Boeing Company
    Inventors: Brent Campbell, Ronald Clements, Tammy McLeod, Son Nguyen, Alexandra Sonnabend