Patents by Inventor Song Cai

Song Cai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8735894
    Abstract: The invention provides a light emitting diode package structure, including: a light emitting diode chip formed on a substrate; a composite coating layer formed on the light emitting diode chip, wherein the composite coating layer comprises a first coating layer and a second coating layer, and the composite coating layer has a reflectivity greater than 95% at the wavelength of 500-800 nm; a cup body formed on the substrate, wherein the cup body surrounds the light emitting diode chip; and an encapsulation housing covering the light emitting diode chip, wherein the encapsulation housing comprises a wavelength transformation material.
    Type: Grant
    Filed: March 15, 2012
    Date of Patent: May 27, 2014
    Assignee: Lextar Electronics Corporation
    Inventors: Pei-Song Cai, Tzu-Pu Lin, Szu-Wei Fu
  • Patent number: 8735929
    Abstract: A light-emitting diode (LED) package comprising a carrier, an LED chip and a phosphor glue is provided. The carrier has a recess, an upper surface, and a ring-shape rough surface connected to a top edge of the recess. The LED chip is disposed within the recess. The phosphor glue fills up the recess and over the upper surface of the carrier. An edge of the phosphor glue contacts the ring-shape rough surface.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: May 27, 2014
    Assignee: Lextar Electronics Corporation
    Inventors: Pei-Song Cai, Yun-Yi Tien, Tzu-Pu Lin, Chun-Wei Wang, Jian-Chin Liang
  • Publication number: 20130322067
    Abstract: A light source module includes a substrate, a first illumination element, a second illumination element and a third illumination element. The first illumination element includes a blue LED chip disposed on the substrate and a first wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a first wavelength. The second illumination element includes a blue LED chip disposed on the substrate and a second wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a second wavelength. The third illumination element includes a blue LED chip.
    Type: Application
    Filed: December 10, 2012
    Publication date: December 5, 2013
    Applicant: LEXTAR ELECTRONICS CORPORATION
    Inventors: Yun-Yi Tien, Pei-Song Cai, Jian-Chin Liang
  • Patent number: 8572616
    Abstract: An apparatus, system, and method are disclosed for managing computer jobs with prerequisite jobs in a main frame computing system. A determination module is included that determines a job grouping of jobs for processing by a computer with a mainframe operating system. A grouping module is included to generate generating a job grouping structure associated with the job grouping. The job grouping structure comprises one or more prerequisite jobs and a dependent job that depends on successful completion of each prerequisite job associated with the dependent job. A management module is included to submit the jobs in the job grouping structure to the computer for processing. The jobs are submitted such that each prerequisite job of the dependent job successfully completes prior to submission of the dependent job.
    Type: Grant
    Filed: May 25, 2006
    Date of Patent: October 29, 2013
    Assignee: International Business Machines Corporation
    Inventors: Jin Song Cai, Pedro Sanchez Vera
  • Publication number: 20130270594
    Abstract: A light-emitting diode (LED) package comprising a carrier, an LED chip and a phosphor glue is provided. The carrier has a recess, an upper surface, and a ring-shape rough surface connected to a top edge of the recess. The LED chip is disposed within the recess. The phosphor glue fills up the recess and over the upper surface of the carrier. An edge of the phosphor glue contacts the ring-shape rough surface.
    Type: Application
    Filed: April 12, 2013
    Publication date: October 17, 2013
    Applicant: Lextar Electronics Corporation
    Inventors: Pei-Song Cai, Yun-Yi Tien, Tzu-Pu Lin, Chun-Wei Wang, Jian-Chin Liang
  • Publication number: 20130240921
    Abstract: A light source module includes a substrate, a first LED package and a second LED package. The first and second LED packages are disposed on the substrate. The first LED package includes a first blue LED chip and a first phosphor. The first blue LED chip emits light in the range of the wavelength for blue light. The first phosphor is used to convert the wavelength of a portion of the light emitted from the first blue LED chip. The second LED package includes a second blue LED chip and a second phosphor. The second blue LED chip emits light in the range of the wavelength for blue light. The second phosphor is used to convert the wavelength of a portion of the light emitted from the second blue LED chip. The wavelength associated with the second phosphor is greater than that associated with the first phosphor.
    Type: Application
    Filed: August 9, 2012
    Publication date: September 19, 2013
    Applicant: LEXTAR ELECTRONICS CORPORATION
    Inventors: Pei-Song Cai, Yong-Hong Liao, Tzu-Pu Lin, Yun-Yi Tien, Jian-Chin Liang
  • Publication number: 20120264239
    Abstract: A light-tuning method is provided. In the method, a filter material is first selected for filtering out unwanted light of a specific wavelength to obtain a transmittance spectrum. The transmittance spectrum is multiplied by an eye sensitivity function to obtain a filtered spectrum. The filtered spectrum has a wavelength range between 450 nm and 650 nm. According to a full width at half maximum (FWHM) wavelength range of the filtered eye sensitivity function, a phosphor is selected and a light-emitting spectrum of the phosphor is determined so that between the light-emitting spectrum of the phosphor and the filtered eye sensitivity function is an optimal matching degree.
    Type: Application
    Filed: April 13, 2012
    Publication date: October 18, 2012
    Applicant: LEXTAR ELECTRONICS CORPORATION
    Inventors: Pei-Song Cai, Yun-Yi Tien, Tzu-Pu Lin
  • Publication number: 20120235198
    Abstract: The invention provides a light emitting diode package structure, including: a light emitting diode chip formed on a substrate; a composite coating layer formed on the light emitting diode chip, wherein the composite coating layer comprises a first coating layer and a second coating layer, and the composite coating layer has a reflectivity greater than 95% at the wavelength of 500-800 nm; a cup body formed on the substrate, wherein the cup body surrounds the light emitting diode chip; and an encapsulation housing covering the light emitting diode chip, wherein the encapsulation housing comprises a wavelength transformation material.
    Type: Application
    Filed: March 15, 2012
    Publication date: September 20, 2012
    Applicant: LEXTAR ELECTRONICS CORPORATION
    Inventors: Pei-Song Cai, Tzu-Pu Lin, Szu-Wei Fu
  • Publication number: 20070277174
    Abstract: An apparatus, system, and method are disclosed for managing computer jobs with prerequisite jobs in a main frame computing system. A determination module is included that determines a job grouping of jobs for processing by a computer with a mainframe operating system. A grouping module is included to generate generating a job grouping structure associated with the job grouping. The job grouping structure comprises one or more prerequisite jobs and a dependent job that depends on successful completion of each prerequisite job associated with the dependent job. A management module is included to submit the jobs in the job grouping structure to the computer for processing. The jobs are submitted such that each prerequisite job of the dependent job successfully completes prior to submission of the dependent job.
    Type: Application
    Filed: May 25, 2006
    Publication date: November 29, 2007
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jin Song Cai, Pedro Sanchez Vera
  • Patent number: D693780
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: November 19, 2013
    Assignee: Lextar Electronics Corporation
    Inventors: Shing-Kuo Chen, Pei-Song Cai, Bo-Yu Ko, Chun-Wei Wang
  • Patent number: D695239
    Type: Grant
    Filed: November 27, 2012
    Date of Patent: December 10, 2013
    Assignee: Lextar Electronics Corporation
    Inventors: Bo-Yu Ko, Chun-Wei Wang, Pei-Song Cai