Light emitting diode package

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Description

FIG. 1 is a front perspective view of a light emitting diode package showing the new design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

Claims

The ornamental design for a light emitting diode package, as shown and described.

Referenced Cited
U.S. Patent Documents
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D517025 March 14, 2006 Asakawa
D520965 May 16, 2006 Omata
D563333 March 4, 2008 Kim et al.
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D624885 October 5, 2010 Lin et al.
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Patent History
Patent number: D695239
Type: Grant
Filed: Nov 27, 2012
Date of Patent: Dec 10, 2013
Assignee: Lextar Electronics Corporation (Hsinchu)
Inventors: Bo-Yu Ko (New Taipei), Chun-Wei Wang (New Taipei), Pei-Song Cai (Miao Li County)
Primary Examiner: Selina Sikder
Application Number: 29/438,204
Classifications