Patents by Inventor Song Cai
Song Cai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10367126Abstract: A light-emitting device includes a base having an insulating part and a metal block; a light-emitting diode (LED) chip over the base; a water soluble paste between the LED chip and the base metal block for chip fixing and heat conduction; packaging glue covering the LED chip; and the LED chip bottom, water soluble paste and the base metal block form an all-metal thermal conducting path to achieve low a thermal resistance.Type: GrantFiled: May 29, 2015Date of Patent: July 30, 2019Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Junpeng Shi, Pei-Song Cai, Hao Huang, Zhenduan Lin, Chih-Wei Chao, Chen-Ke Hsu
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Publication number: 20190123252Abstract: A light-emitting diode (LED) device and a manufacturing method thereof are provided. The LED device includes a frame body, a first conductive extension structure, a second conductive extension structure, and a LED chip. The frame body includes an upper surface, a bottom, a recess on the opposite side of the bottom, and a first side surface and a second side surface opposite to each other. The first and second conductive extension structures are located in the frame body. The first and second conductive extension structures extend from the first side surface to the second side surface of the frame body. The frame body encapsulates a left side surface, a right side surface, a top surface, and a bottom surface of each of the first and second conductive extension structures. The LED chip is disposed in the recess and includes a first conductive pad and a second conductive pad.Type: ApplicationFiled: October 7, 2018Publication date: April 25, 2019Inventors: Lung-Kuan LAI, Pei-Song CAI, Jian-Chin LIANG, Hao-Chung CHAN, Hong-Zhi LIU
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Patent number: 9966514Abstract: A light emitting diode package structure allows for an improved light-emitting efficiency by including a first reflecting material layer with through holes; a flip chip on the first reflecting material layer, with the electrodes inlaid in the through holes of the first reflecting material layer; a first transparent material layer surrounding the side surface of the flip chip except the electrodes; and a second reflecting material layer surrounding the first transparent material layer. An interface between the first transparent material layer and the reflecting material layer is an inclined plane, an arc plane, or an irregular shape, to thereby facilitate upward light reflection of the flip chip. A wavelength conversion material layer is over the first reflecting material layer, the flip chip, and the second reflecting material layer.Type: GrantFiled: June 24, 2016Date of Patent: May 8, 2018Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Chen-Ke Hsu, Junpeng Shi, Pei-Song Cai, Zhenduan Lin, Hao Huang, Chenjie Liao, Chih-Wei Chao, Qiuxia Lin
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Patent number: 9890930Abstract: A light source module includes a substrate, a first illumination element, a second illumination element and a third illumination element. The first illumination element includes a blue LED chip disposed on the substrate and a first wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a first wavelength. The second illumination element includes a blue LED chip disposed on the substrate and a second wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a second wavelength. The third illumination element includes a blue LED chip.Type: GrantFiled: December 10, 2012Date of Patent: February 13, 2018Assignee: LEXTAR ELECTRONICS CORPORATIONInventors: Yun-Yi Tien, Pei-Song Cai, Jian-Chin Liang
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Publication number: 20170359618Abstract: A method for content projection and a mobile terminal are provided. The method includes that a mobile terminal runs a local playing service, a content projection control service and at least two protocol projection control services. A first projection instruction is acquired through the content projection control service, a first content played by the local playing service is intercepted, and the intercepted first content is transmitted to first protocol projection control service. The first content is transmitted to a first projection service through the first protocol projection control service by virtue of a first projection protocol.Type: ApplicationFiled: August 28, 2017Publication date: December 14, 2017Inventors: Xiangyi Chen, Yu Guo, Song Cai
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Publication number: 20170279023Abstract: A light-emitting diode (LED) package includes a substrate with upper and lower surfaces, including: a metal block; an electrically insulating region surrounding at least a portion of the metal block; an LED chip mounted on the substrate and in electrical communication with the metal block; and an encapsulant covering at least an upper surface of the LED chip. A light-emitting system includes a plurality of light-emitting diode (LED) chips; and a package support for the plurality of LED chips.Type: ApplicationFiled: June 13, 2017Publication date: September 28, 2017Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: JUN-PENG SHI, PEI-SONG CAI, HAO HUANG, XING-HUA LIANG, ZHEN-DUAN LIN, CHIH-WEI CHAO, CHEN-KE HSU
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Patent number: 9711704Abstract: A light-emitting diode (LED) package, including: a substrate with front and back surfaces, including: at least two metal blocks; an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and an electrical insulation region between the at least two metal blocks; an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate; wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate.Type: GrantFiled: August 9, 2016Date of Patent: July 18, 2017Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Jun-Peng Shi, Pei-Song Cai, Hao Huang, Xing-Hua Liang, Zhen-Duan Lin, Chih-Wei Chao, Chen-Ke Hsu
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Publication number: 20170005245Abstract: A light emitting diode package structure includes: a first reflecting material layer with through holes; a flip chip on the first reflecting material layer, with the electrodes inlaid in the through holes of the first reflecting material layer; a first transparent material layer surrounding the side surface of the flip chip except the electrodes; a second reflecting material layer surrounding the first transparent material layer, the interface between the first transparent material layer and the reflecting material layer is an inclined plane, an arc plane, or an irregular shape, to thereby facilitate upward light reflection of the flip chip; and a wavelength conversion material layer covered over the above structure.Type: ApplicationFiled: June 24, 2016Publication date: January 5, 2017Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: CHEN-KE HSU, JUNPENG SHI, PEI-SONG CAI, ZHENDUAN LIN, HAO HUANG, CHENJIE LIAO, CHIH-WEI CHAO, QIUXIA LIN
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Publication number: 20160351770Abstract: A light-emitting diode (LED) package, including: a substrate with front and back surfaces, including: at least two metal blocks; an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and an electrical insulation region between the at least two metal blocks; an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate; wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate.Type: ApplicationFiled: August 9, 2016Publication date: December 1, 2016Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Jun-Peng SHI, Pei-Song CAI, Hao HUANG, Xing-Hua LIANG, Zhen-Duan LIN, Chih-Wei CHAO, Chen-Ke HSU
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Patent number: 9437793Abstract: A package support including: metal frames connected together; one or more dielectric materials disposed in an inner gap of the metal frames; wherein: the package support has a frame region and a function region; wherein the function region has complete upper and lower surfaces configured to prevent leakage if at least one of the entire upper or lower surfaces is covered with an encapsulant material. A fabrication method allows for manufacturing the package support with a high cell density, relatively low price, high reflectivity, good heat dissipation, and high reliability. The LED package using the package support has a smaller size and improved dissipation properties.Type: GrantFiled: January 27, 2015Date of Patent: September 6, 2016Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Jun-Peng Shi, Pei-Song Cai, Hao Huang, Xing-Hua Liang, Zhen-Duan Lin, Chih-Wei Chao, Chen-Ke Hsu
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Publication number: 20160020373Abstract: A light-emitting device includes a base having an insulating part and a metal block; a light-emitting diode (LED) chip over the base; a water soluble paste between the LED chip and the base metal block for chip fixing and heat conduction; packaging glue covering the LED chip; and the LED chip bottom, water soluble paste and the base metal block form an all-metal thermal conducting path to achieve low a thermal resistance.Type: ApplicationFiled: May 29, 2015Publication date: January 21, 2016Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: JUNPENG SHI, PEI-SONG CAI, HAO HUANG, ZHENDUAN LIN, CHIH-WEI CHAO, CHEN-KE HSU
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Publication number: 20150372211Abstract: This application relates to a packaging structure, particularly to a light emitting diode package structure.Type: ApplicationFiled: February 20, 2015Publication date: December 24, 2015Inventors: Pei-Song Cai, Junpeng Shi, Xinghua Liang, Jeff Guan, Chen-Ke Xu
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Publication number: 20150243863Abstract: A package support including: metal frames connected together; one or more dielectric materials disposed in an inner gap of the metal frames; wherein: the package support has a frame region and a function region; wherein the function region has complete upper and lower surfaces configured to prevent leakage if at least one of the entire upper or lower surfaces is covered with an encapsulant material. A fabrication method allows for manufacturing the package support with a high cell density, relatively low price, high reflectivity, good heat dissipation, and high reliability. The LED package using the package support has a smaller size and improved dissipation properties.Type: ApplicationFiled: January 27, 2015Publication date: August 27, 2015Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: JUN-PENG SHI, PEI-SONG CAI, HAO HUANG, XING-HUA LIANG, ZHEN-DUAN LIN, CHIH-WEI CHAO, CHEN-KE HSU
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Patent number: 8803170Abstract: A light source module includes a substrate, a first LED package and a second LED package. The first and second LED packages are disposed on the substrate. The first LED package includes a first blue LED chip and a first phosphor. The first blue LED chip emits light in the range of the wavelength for blue light. The first phosphor is used to convert the wavelength of a portion of the light emitted from the first blue LED chip. The second LED package includes a second blue LED chip and a second phosphor. The second blue LED chip emits light in the range of the wavelength for blue light. The second phosphor is used to convert the wavelength of a portion of the light emitted from the second blue LED chip. The wavelength associated with the second phosphor is greater than that associated with the first phosphor.Type: GrantFiled: August 9, 2012Date of Patent: August 12, 2014Assignee: Lextar Electronics CorporationInventors: Pei-Song Cai, Yong-Hong Liao, Tzu-Pu Lin, Yun-Yi Tien, Jian-Chin Liang
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Patent number: D709040Type: GrantFiled: November 28, 2012Date of Patent: July 15, 2014Assignee: Lextar Electronics CorporationInventors: Shing-Kuo Chen, Pei-Song Cai, Bo-Yu Ko, Chun-Wei Wang
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Patent number: D709042Type: GrantFiled: June 5, 2013Date of Patent: July 15, 2014Assignee: Lextar Electronics CorporationInventor: Pei-Song Cai
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Patent number: D712851Type: GrantFiled: June 5, 2013Date of Patent: September 9, 2014Assignee: Lextar Electronics CorporationInventors: Pei-Song Cai, Shing-Kuo Chen, Chun-Wei Wang
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Patent number: D756942Type: GrantFiled: May 12, 2015Date of Patent: May 24, 2016Inventors: Junpeng Shi, Pei-Song Cai, Zhenduan Lin, Hao Huang
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Patent number: D761215Type: GrantFiled: May 12, 2015Date of Patent: July 12, 2016Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Junpeng Shi, Pei-Song Cai, Zhenduan Lin, Hao Huang
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Patent number: D768095Type: GrantFiled: October 8, 2015Date of Patent: October 4, 2016Assignee: XIAMENG SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Junpeng Shi, Pei-Song Cai, Zhenduan Lin, Hao Huang