Abstract: A technique is presented for fast input of multi-character compound consonants and vowels on a touch computing device. The technique provides for fast input of multi-character compound consonants and vowels by enabling a user to touch an initial character on a first layout of characters, then slide his/her finger in different directions and/or different distances according to a second layout of characters. The second layout of characters can be based on the first touched character and therefore can have a limited set of characters, e.g., fewer characters in comparison to the first layout of characters. A syllable formed after input of both a consonant and a vowel, represented as one character set, e.g., in the Roman alphabet, can then be transliterated into another language, e.g., Chinese.

Abstract: In one example, a computing device includes at least one processor configured to output for display, a graphical keyboard. The at least one processor may also be configured to model, in a first lattice, a plurality of candidate character strings that include symbols of a first alphabet. The first lattice may indicate spatial probabilities of the plurality of candidate character strings. The at least one processor may be configured to determine, using a second lattice that indicates probabilities of one or more words of a second language based at least in part on the spatial probabilities of the plurality of candidate character strings, a probability that the at least one of the plurality of candidate character strings corresponds to at least one word included in the second language. The at least one processor may be configured to output for display, the one or more symbols representing at least one word.

Abstract: Methods, systems, and computer program products for generating a search of attachments are described. A search request based on a business template is obtained, the business template comprising a node containing an identity of an entity to which the attachment is attached and an attachment sub-node. A search request based on an attachment template is obtained, the attachment template comprising a root node referring to the attachment sub-node of the business template and a node containing an identity of the attachment. A search is performed based on the business template and the attachment template.

Abstract: A technique is presented for fast input of multi-character compound consonants and vowels on a touch computing device. The technique provides for fast input of multi-character compound consonants and vowels by enabling a user to touch an initial character on a first layout of characters, then slide his/her finger in different directions and/or different distances according to a second layout of characters. The second layout of characters can be based on the first touched character and therefore can have a limited set of characters, e.g., fewer characters in comparison to the first layout of characters. A syllable formed after input of both a consonant and a vowel, represented as one character set, e.g., in the Roman alphabet, can then be transliterated into another language, e.g., Chinese.

Abstract: A technique is presented for fast input of multi-character compound consonants and vowels on a touch computing device. The technique provides for fast input of multi-character compound consonants and vowels by enabling a user to touch an initial character on a first layout of characters, then slide his/her finger in different directions and/or different distances according to a second layout of characters. The second layout of characters can be based on the first touched character and therefore can have a limited set of characters, e.g., fewer characters in comparison to the first layout of characters. A syllable formed after input of both a consonant and a vowel, represented as one character set, e.g., in the Roman alphabet, can then be transliterated into another language, e.g., Chinese.

Abstract: A technique is presented for fast input of multi-character compound consonants and vowels on a touch computing device. The technique provides for fast input of multi-character compound consonants and vowels by enabling a user to touch an initial character on a first layout of characters, then slide his/her finger in different directions and/or different distances according to a second layout of characters. The second layout of characters can be based on the first touched character and therefore can have a limited set of characters, e.g., fewer characters in comparison to the first layout of characters. A syllable formed after input of both a consonant and a vowel, represented as one character set, e.g., in the Roman alphabet, can then be transliterated into another language, e.g., Chinese.

Abstract: A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second region on a substrate simultaneously. The wire-bonding method includes following steps. First, initial position coordinates of the first region and the second region are obtained. Next, it is determined whether a space between the first region and the second region is greater than a predetermined space. When the space between the first region and the second region is greater than the predetermined space, the first wire-bonder and the second wire-bonder respectively bond the first chips and the second chips simultaneously.

Abstract: A die bonder and a die bonding method thereof are provided. The die bonder includes a wafer platform, an arranging platform, a conveyer, at least one first pick-up device and a second pick-up device. The wafer platform is for placing a wafer with several dies. The conveyer is for carrying and conveying a substrate. The first pick-up device is for picking up one of the dies and placing each die on the arranging platform. The second pick-up device is for picking up the dies on the arranging platform and placing the dies on the substrate at the same time.

Abstract: A packaging substrate and a manufacturing method thereof are provided. The manufacturing method includes following steps. First, a first packaging substrate including several first substrate units and at least one defected substrate unit is provided. Next, the defected substrate unit is separated from the packaging substrate, and at least one opening is formed in a frame of the first packaging substrate correspondingly. Then, a second substrate unit is provided. The shape of the second substrate unit is different from the shape of the opening. Afterwards, the second substrate unit is disposed in the opening.

Abstract: A packaging substrate and a manufacturing method thereof are provided. The manufacturing method includes following steps. First, a first packaging substrate including several first substrate units and at least one defected substrate unit is provided. Next, the defected substrate unit is separated from the packaging substrate, and at least one opening is formed in a frame of the first packaging substrate correspondingly. Then, a second substrate unit is provided. The shape of the second substrate unit is different from the shape of the opening. Afterwards, the second substrate unit is disposed in the opening.

Abstract: A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second region on a substrate simultaneously. The wire-bonding method includes following steps. First, initial position coordinates of the first region and the second region are obtained. Next, it is determined whether a space between the first region and the second region is greater than a predetermined space. When the space between the first region and the second region is greater than the predetermined space, the first wire-bonder and the second wire-bonder respectively bond the first chips and the second chips simultaneously.