Abstract: A semiconductor package may include a circuit board, an interposer structure on the circuit board, a mold layer, and a first semiconductor chip and a second semiconductor chip spaced apart from each other in a first direction on a center region of the interposer structure and electrically connected to the interposer structure. The interposer structure may include a plurality of trenches in an edge region of the interposer structure and extending through the interposer structure. The mold layer may be in the plurality of trenches and may wrap the first and second semiconductor chips. The mold layer may include a penetrating portion in the plurality of trenches and a stack portion on the interposer structure. A bottom surface of the penetrating portion of the mold layer may be on a same plane as a bottom surface of the interposer structure.

Abstract: A display device includes a scan driver to supply scan signals to first and second scan lines, a data driver to supply a data signal to data lines, a sensor connected to sensing lines, and pixels including a light-emitting element, a driving transistor to control an amount of current supplied to the light-emitting element in response to a voltage of a first node, a switching transistor between a j-th data line and the first node, and including a gate electrode coupled to an i-th first scan line, and a sensing transistor coupled between a second node, which is between the light-emitting element and the driving transistor, and a k-th sensing line, and including a gate electrode coupled to an i-th second scan line, and wherein the sensor is to sense deterioration information of the light-emitting element in a state in which the switching and sensing transistors are turned on.

Abstract: A semiconductor package including a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip, and a third semiconductor chip disposed on the second semiconductor chip. A first pad is disposed on a top surface of the second semiconductor chip, and includes a first portion and a second portion protruding in a vertical direction from the first portion. A width of the first portion in a first horizontal direction is greater than a width of the second portion in the first horizontal direction. A second pad is disposed on a bottom surface of the third semiconductor chip facing the top surface of the second semiconductor chip, and a solder ball is disposed as surrounding a sidewall of the second portion of the first pad between the first pad and the second pad.

Abstract: The present disclosure relates to a DC-DC converter, a vehicle, and a control method including the same, and more particularly, to a DC-DC converter, a vehicle, and a control method including the same capable of effectively detecting and responding to an interlock failure of a connector.

Abstract: Disclosed are a method and apparatus for reusing wastewater. The method for reusing wastewater disclosed herein includes: generating a mixed wastewater by mixing multiple types of wastewater (S20); performing a first purification by passing the mixed wastewater through a flocculation-sedimentation unit (S40); performing a second purification by passing an effluent of the flocculation-sedimentation unit through a membrane bioreactor (MBR) (S60); performing a third purification by passing an effluent of the MBR through a reverse-osmosis membrane unit (S80); and reusing an effluent of the reverse-osmosis membrane unit as cooling water or industrial water (S100).

Abstract: A vehicle is provided that includes a DC converter having a first end connected to a fuel cell, a second end connected to a high-voltage battery, and at least one switching element connected between the first end and the second end, a fuel cell control unit which controls an activation state of a running command for start of the fuel cell based on an on-off state of vehicle start, and a converter controller which controls a running state of the DC converter according to an initial start sequence, a shutdown sequence, or a restart sequence for the fuel cell based on the activation state of the running command.

Abstract: A direct current to direct current (DC-DC) converter, a vehicle including the converter, and a controlling method thereof are proposed. The DC-DC converter is capable of efficiently detecting and responding to miscoupling of a connector. The DC-DC converter includes a first inlet corresponding to a first DC terminal, a transformation circuit connected to the first DC terminal and a second DC terminal while being located therebetween, and a converter controller, wherein when receiving a voltage command corresponding to the first DC terminal from an external controller, the converter controller is configured to determine whether or not a connector coupled to the first inlet is miscoupled thereto based on whether or not a voltage of the first DC terminal follows the voltage command.

Abstract: A method for manufacturing a semiconductor package includes mounting semiconductor chips on an interposer, forming a molding part between the semiconductor chips, surrounding a plurality of bumps between the semiconductor chips and the interposer with a first underfill, forming a sacrificial layer that covers the semiconductor chips, forming a wafer level molding layer that covers the sacrificial layer, performing a planarization process to expose upper sides of the semiconductor chips, form the sacrificial layer into a sacrificial pattern, and form the wafer level molding layer into a wafer level molding pattern, removing the sacrificial pattern, performing a sawing process to remove an outer edge of the semiconductor package, mounting the interposer on a side of a package board, surrounding a plurality of bumps between the package board and the interposer with a second underfill, and attaching a stiffener to an outer portion of the package board.

Abstract: A method for controlling a vehicle includes determining the number of driving legs according to an output current target value of a DC-DC converter; selecting one or more legs to be switched as many as the number of the driving legs from among a plurality of legs included in the DC-DC converter based on accumulated operation time for each of the plurality of legs; and controlling an output current value of the DC-DC converter to follow the output current target value by switching the selected one or more legs.

Abstract: A DC-DC converter, a vehicle including the converter, and a controlling method thereof are provided. The DC-DC converter includes a first capacitor connected to a first DC terminal, a second capacitor connected to a second DC terminal, a plurality of converting circuits each including at least an inductor and a plurality of switching elements, and connected to each other in parallel between the first capacitor and the second capacitor, and a controller configured to control an ON/OFF state of the plurality of switching elements provided of each of the converting circuits. When external power connection with respect to each of the first DC terminal and the second DC terminal is disconnected, the controller is configured to control states of the plurality of switching elements to sequentially provide a plurality of different discharge paths between opposite terminals of the second capacitor via the plurality of converting circuits.

Abstract: Antibodies that selectively bind to glycosylated PD-1 relative to unglycosylated PD-1 are provided. In some aspects, PD-1 polypeptides comprising glycosylated amino acid positions are also provided. Methods for making and using such antibodies and polypeptides (e.g., for the treatment of cancer) are also provided.

Abstract: A pixel circuit includes a first switch element turned on by a gate-on voltage of a first scan pulse to apply a data voltage to a first node; a second switch element turned on by a gate-on voltage of a second scan pulse to connect a second node to a third node; a third switch element turned on by a gate-on voltage of a light-emitting control pulse to apply a reference voltage to the first node; a fourth switch element turned on by the gate-on voltage of the light-emitting control pulse to connect the third node to a fourth node; and a fifth switch element turned on by a gate-on voltage of the second scan pulse to apply the reference voltage to the fourth node. A voltage higher than or equal to the pixel driving voltage is applied to the third node before generation of the first scan pulse.

Abstract: A DC-DC converter may include a first capacitor connected to a first DC end, a second capacitor connected to a second DC end, a power conversion circuit connected between the first capacitor and the second capacitor and including at least one switching element, and a controller determining, when the second capacitor is charged as the battery is connected to the second DC end, whether the at least one switching element has failed based on a first voltage that is a voltage between opposite ends of the first capacitor and a second voltage that is a voltage between opposite ends of the second capacitor.

Abstract: A method of distributedly storing data in a system comprising a plurality of edge nodes communicatively coupled to an end device and a central cloud. The method includes: receiving, by a first edge node, data transmitted by the end device; assigning, by the first edge node, a data tag to received data according to attributes of the received data and duplicating the received data to generate a tagged data copy; and transmitting, by the first edge node, the tagged data copy to at least one second edge node determined by a data distribution policy determined by the central cloud directly or through the central cloud, so that the at least one second edge node store the tagged data copy in a storage.

Abstract: A semiconductor package including a buffer structure including a first redistribution layer, a first buffer chip on the first redistribution layer, a second redistribution layer on the first buffer chip, and a first molding layer filling between the first redistribution layer and the second redistribution layer, and a first chip stack and a first semiconductor chip on the buffer structure and spaced apart from each other, wherein the first buffer chip overlaps at least a portion of the first semiconductor chip in a first direction from the buffer structure toward the first semiconductor chip, may be provided.

Abstract: A spectroscopy system that includes a light source portion configured to generate light having a plurality of wavelengths, a light transmitter configured to transmit the light to a target analyte, a light receiving portion configured to receive Raman-scattered light scattered from the target analyte, and a multi-wavelength spectroscopy portion that may acquire a spectrum by splitting the Raman-scattered light transmitted from the light receiving portion. The multi-wavelength spectroscopy portion includes a single diffraction grating configured to diffract the Raman-scattered light and a single concave mirror configured to focus the Raman-scattered light.

Abstract: The present embodiment may provide a touch sensing circuit including: an analog signal processing circuit including one or more adjustable filters configured to receive a touch sensing signal from a touch electrode of a panel and to transmit some of a frequency region of the touch sensing signal; and a touch control circuit configured to determine a change in capacitance of the touch electrode attributable to an object approaching the panel and to transmit a controlling signal to control the adjustable filters of the analog signal processing circuit. The adjustable filter of the present embodiment may include a variable resistor or a variable capacitor. A resistance value or capacitance value of the adjustable filter may be changed in response to the controlling signal, thus changing a frequency pass band of the touch sensing signal.

Abstract: The present disclosure provides a touch sensing circuit comprising an analog signal processing circuit configured to receive a plurality of sensing signals having different frequencies from touch electrodes; and a digital signal processing circuit configured to receive output data of the analog signal processing circuit and perform a discrete Fourier transform. In addition, the present disclosure provides a touch sensing circuit comprising the digital signal processing circuit of the touch sensing circuit that separates the plurality of sensing signals through the discrete Fourier transform and allowing a simultaneous sensing of a finger touch and a stylus pen touch.

Abstract: Provided is a composition comprising a dimethylchalcone derivative for prevention or treatment of metabolic diseases and, more specifically, to a compositioncomprising a derivative of 2?,4?-dihydroxy-6?-methoxy-3?,5?-dimethylchalcone as an active ingredient for the alleviation, prevention, or treatment of various metabolic diseases.

Abstract: A semiconductor chip is disclosed that includes a chip pad disposed in a first region of a chip body, a redistribution wiring test pad disposed in the first region of the chip body spaced apart from the chip pad and connected to the chip pad through a redistribution wiring structure, and a redistribution wiring connection pad disposed in the first region of the chip body or a second region of the chip body and connected to the chip pad through the redistribution wiring structure.