Abstract: Provided are a method for predicting a mortality risk or a sepsis risk, implemented by a processor, to predict an emergency situation, and a device using the same. The method for predicting a mortality risk or a sepsis risk includes: receiving biological signal data for a subject from a biological signal prediction device; generating a risk sequence for the subject based on the biological signal data, by using a risk sequence generation model configured to generate a risk sequence based on the biological signal data; and predicting a risk for the subject based on the risk sequence.

Abstract: Disclosed is a touch panel LCD device for reducing power consumption, frequency noise, or audible noise by applying an LFD signal only to touch electrodes adjacent to touch electrodes for sensing touch and by grounding other touch electrodes and a method of driving the same. The touch panel liquid crystal display device includes touch electrodes arranged on a panel in a matrix form and multiplexers configured to drive the touch electrodes. Each of the multiplexers includes a output channels, a first switching block configured to output a touch sensing signal to a first output channel of the output channels, a second switching block configured to output a load free driving (LFD) signal to second output channels adjacent to the first channel among the output channels, and a third switching block configured to output a ground signal or a floating signal to third output channels among the plurality of output channels.

Abstract: A semiconductor chip includes a substrate. An electrode pad is disposed on the substrate. The electrode pad includes a low-k material layer. A first protection layer at least partially surrounds the electrode pad. The first protection layer includes a first opening at an upper portion thereof. A buffer pad is electrically connected to the electrode pad. A second protection layer at least partially surrounds the buffer pad. The second protection layer includes a second opening at an upper portion thereof. A pillar layer and a solder layer are sequentially stacked on the buffer pad. A thickness of the buffer pad is greater than a thickness of the electrode pad. A width of the first opening in a first direction parallel to an upper surface of the semiconductor substrate is equal to or greater than a width of the second opening in the first direction.

Abstract: An RF cavity filter is disclosed. The disclosed filter includes: a housing in which there is at least one cavity formed; a cover joined to an upper portion of the housing; at least one bolt inserted through at least one through hole formed in the cover; and at least one elastic element attached to the cover in an area below the through hole, where the bolt is inserted through the through hole to provide an external force on the elastic element, and the external force alters the shape of the elastic element. With the disclosed filter, pieces of metal debris created during tuning can be prevented from reaching the inside of the filter, and the degradation in the PIMD performance that would have otherwise occurred due to the pieces of debris can be avoided. Also, the filter can maintain a tuned state without the use of separate nuts.

Abstract: Provided is a method of manufacturing a porous protective layer for a gas sensor. The porous protective layer according to one Example of the present invention is manufactured by a method of manufacturing a porous protective layer for a gas sensor including (1) a step of introducing a composition for forming a porous protective layer including a pore former and a ceramic powder, which includes particles having a degree of deformation of 1.5 or more expressed by the following Relational Formula 1 according to the present invention, onto a sensing electrode for a gas sensor, and (2) a step of sintering the introduced composition for forming a porous protective layer.

Abstract: A particulate matter sensor and an exhaust gas purification system using the same are provided. A particular matter sensor according to some embodiments of the present invention includes a first insulation layer including a first electrode unit exposed on a first side thereof, which includes a plurality of first electrodes not electrically connected to each other, a second insulation layer arranged in parallel to the first insulation layer with a space therebetween, including a second electrode unit on a first side thereof, which includes a plurality of second electrodes electrically connected to each other, a temperature sensing unit formed on a first side of a third insulation layer located on a second side of the second insulation layer, and a heater unit formed on a first side of a fourth insulation layer located on a second side of the third insulation layer, the heater unit configured to heat the first and second electrode units.

Abstract: A semiconductor package including a heat spreading layer having at least one hole, a first semiconductor chip below the heat spreading layer, a redistribution structure below the first semiconductor chip, a first mold layer between the heat spreading layer and the redistribution structure, a shielding wall extending from the redistribution structure and the heat spreading layer and surrounding the first semiconductor chip, and a first conductive pillar extending from the redistribution structure into the hole may be provided.

Abstract: Provided is a flat plate-type oxygen sensor element. The flat plate-type oxygen sensor element according to an exemplary embodiment of the present invention includes: a first electrolyte layer having a sensing electrode exposed to a target gas; a second electrolyte layer on which a reference electrode is disposed; and a heating unit having a heating resistor surrounded by an insulating layer and disposed between the sensing electrode and the reference electrode, wherein the heating unit is disposed so that the heating resistor is located at a position ranging from 40 to 60% of a total height from an upper surface of the first electrolyte layer to a lower surface of the second electrolyte layer.

Abstract: A semiconductor package including a heat spreading layer having at least one hole, a first semiconductor chip below the heat spreading layer, a redistribution structure below the first semiconductor chip, a first mold layer between the heat spreading layer and the redistribution structure, a shielding wall extending from the redistribution structure and the heat spreading layer and surrounding the first semiconductor chip, and a first conductive pillar extending from the redistribution structure into the hole may be provided.

Abstract: Disclosed is a touch panel LCD device for reducing power consumption, frequency noise, or audible noise by applying an LFD signal only to touch electrodes adjacent to touch electrodes for sensing touch and by grounding other touch electrodes and a method of driving the same. The touch panel liquid crystal display device includes touch electrodes arranged on a panel in a matrix form and multiplexers configured to drive the touch electrodes. Each of the multiplexers includes a output channels, a first switching block configured to output a touch sensing signal to a first output channel of the output channels, a second switching block configured to output a load free driving (LFD) signal to second output channels adjacent to the first channel among the output channels, and a third switching block configured to output a ground signal or a floating signal to third output channels among the plurality of output channels.

Abstract: Disclosed are a touch panel LCD device capable of improving touch sensing performance by preventing non-uniformity of raw touch data of left and right sides and a method of driving the same. In the touch panel LCD device, a plurality of common lines arranged in a non-display area of a panel and configured to check characteristics of the panel is connected to a load free driving (LFD) signal line by a flexible printed circuit board (FPCB) when the common lines are attached to the FPCB.

Abstract: A semiconductor device includes a substrate, a contact pad arranged in the substrate, a bump arranged on the contact pad to be electrically connected with the contact pad, an insulating film arranged on the substrate to surround a side surface of the bump and to expose at least a portion of the contact pad to the bump, and a photosensitive film which is formed on the insulating film and comprises a polyimide, wherein the photosensitive film comprises a first region surrounding the side surface of the bump and having a first thickness measured in a vertical direction, and a second region arranged on the first region and having a second thickness thickermeasured in the vertical direction, wherein the second region is spaced apart from the bump in a horizontal direction, and wherein the second thickness is greater than a thickness two times thicker than a difference value between the second thickness and the first thickness.

Abstract: Disclosed is to provide a composition derived from a natural material and which has an excellent effect of enhancing cognitive function and a method for preparing the same. The extract and composition according to one aspect of the present disclosure are derived from a natural material and thus are safe. It can prevent, ameliorate and treat cognitive decline. Therefore, it allows to improve the quality of life of the elderly population without concerns about side effects and promote development of the related industry.

Abstract: A semiconductor package including a heat spreading layer having at least one hole, a first semiconductor chip below the heat spreading layer, a redistribution structure below the first semiconductor chip, a first mold layer between the heat spreading layer and the redistribution structure, a shielding wall extending from the redistribution structure and the heat spreading layer and surrounding the first semiconductor chip, and a first conductive pillar extending from the redistribution structure into the hole may be provided.

Abstract: A particulate matter sensor is provided. The particulate matter sensor includes: an insulating substrate; a first electrode unit, and a plurality of spaced electrodes; a second electrode unit and a heater unit. Wherein each of the spaced electrode includes a sensing unit, wherein the particulate matter is deposited on the sensing unit, and a capacitor unit is configured on the spaced electrode for measuring capacitance. The plurality of spaced electrodes and the rim electrode are electrically connected when particulate matter is deposited, and thereby the capacitance between the first electrode unit and the second electrode unit can be measured.

Abstract: An RF filter for improving PIMD performance includes: a housing having at least one cavity and a dielectric resonator held in the cavity; washers shaped as circular plates and made of metal that are joined to an upper and lower portion of the dielectric resonator; and a cover joined to the housing. A protrusion may be formed on one side of the washer to contact the cover or the housing, where the washer protrusion may increase in height along a direction moving away from the center.

Abstract: An RF filter for improving PIMD performance includes: a housing having at least one cavity and a dielectric resonator held in the cavity; washers shaped as circular plates and made of metal that are joined to an upper and lower portion of the dielectric resonator; and a cover joined to the housing. A protrusion may be formed on one side of the washer to contact the cover or the housing, where the washer protrusion may increase in height along a direction moving away from the center.

Abstract: An RF cavity filter is disclosed. The disclosed filter includes: a housing in which there is at least one cavity formed; a cover joined to an upper portion of the housing; at least one bolt inserted through at least one through hole formed in the cover; and at least one elastic element attached to the cover in an area below the through hole, where the bolt is inserted through the through hole to provide an external force on the elastic element, and the external force alters the shape of the elastic element. With the disclosed filter, pieces of metal debris created during tuning can be prevented from reaching the inside of the filter, and the degradation in the PIMD performance that would have otherwise occurred due to the pieces of debris can be avoided. Also, the filter can maintain a tuned state without the use of separate nuts.