Abstract: A semiconductor device includes an internal circuit and a power mesh configured to transmit an operating voltage to the internal circuit. The power mesh includes first power lines extending in a first direction and arranged in a second direction intersecting with the first direction, when viewed from a top; second power lines sharing lanes with the first power lines and at least partially overlapping with the first power lines in the second direction; first power straps extending in the second direction and coupled to the first power lines; and second power straps extending in the second direction and coupled to the second power lines. Each of the first and second power lines may have a width of the same size as a width of each lane in sections where they do not overlap, and may have a width of a size smaller than the width of each lane in sections where they overlap.

Abstract: A semiconductor memory device includes a cell wafer including a first plane and a second plane which are disposed to be adjacent to each other in a first direction and each include a plurality of memory cells; and a peripheral wafer including a row decoder which simultaneously controls the first and second planes and first and second page buffer circuits which control the first and second planes, respectively. The cell wafer includes, on one surface thereof bonded to the peripheral wafer, a first pad which is coupled in common with the first plane and the second plane, and the peripheral wafer includes, on one surface thereof bonded to the cell wafer, a second pad which is coupled with the row decoder and is bonded to the first pad.

Abstract: A semiconductor memory device includes a memory cell array; a page buffer circuit including a plurality of page buffers which are coupled to the memory cell array through a plurality of bit lines which extend in a second direction intersecting with a first direction; and a cache latch circuit including a plurality of cache latches which are coupled to the plurality of page buffers. The plurality of cache latches have a two-dimensional arrangement in the first direction and the second direction. Among the plurality of cache latches, an even cache latch and an odd cache latch which share a data line and an inverted data line are disposed adjacent to each other in the first direction.

Abstract: A semiconductor memory device includes a stack disposed over a first substrate; an etch barrier including a plurality of dummy channels which pass through the stack and surround a coupling region; and a plurality of channels passing through the stack in a cell region outside the coupling region. The stack has a structure in which first dielectric layers and second dielectric layers are alternately stacked, inside the coupling region, and has a structure in which the first dielectric layers and electrode layers are alternately stacked, outside the coupling region.

Abstract: Disclosed is a semiconductor memory device. The semiconductor memory device may include: a memory cell array; and a cache latch circuit configured to exchange data with the memory cell array through a plurality of bit lines extended in a second direction crossing a first direction, and comprising a plurality of cache latches arranged in a plurality of column in the first direction and in a plurality of rows in the second direction. Each of the cache latches may be coupled to any one of a plurality of input/output (IO) pins. Cache latches coupled to the IO pins at the same time may constitute one IO cache latch unit. The cache latches included in the one IO cache latch unit may be arranged in 2×2 array units.

Abstract: A semiconductor memory device includes an electrode structure including a plurality of electrode layers and a plurality of interlayer dielectric layers which are alternately stacked on a substrate defined with a plurality of cell areas and a plurality of coupling areas in a first direction; a hard mask pattern disposed on the electrode structure, and having a plurality of opening holes in the coupling areas; and a plurality of contact holes defined in the electrode structure under the plurality of opening holes, and exposing pad areas of the electrode layers, respectively. The plurality of opening holes are disposed by being distributed in a plurality of rows arranged in a second direction intersecting with the first direction.

Abstract: A semiconductor memory device includes a stack disposed over a substrate defined with cell and connection areas; channel structures passing through the stack in the cell area; and slits defined in the stack. The stack includes first dielectric layers separately staked in the cell and connection areas; electrode layers disposed alternately with the first dielectric layers in the cell area and a periphery of the connection area adjacent to the slits; and second dielectric layers disposed alternately with the first dielectric layers in a central part of the connection area distant from the slits. A distance between the slits in the connection area is larger than a distance between the slits in the cell area, and, at a boundary between the periphery and the central part of the connection area, the electrode layers and the second dielectric layers disposed at the same layers are in contact with each other.

Abstract: A semiconductor memory device includes a stack disposed over a substrate defined with cell and connection areas; channel structures passing through the stack in the cell area; and slits defined in the stack. The stack includes first dielectric layers separately staked in the cell and connection areas; electrode layers disposed alternately with the first dielectric layers in the cell area and a periphery of the connection area adjacent to the slits; and second dielectric layers disposed alternately with the first dielectric layers in a central part of the connection area distant from the slits. A distance between the slits in the connection area is larger than a distance between the slits in the cell area, and, at a boundary between the periphery and the central part of the connection area, the electrode layers and the second dielectric layers disposed at the same layers are in contact with each other.

Abstract: A semiconductor memory device includes a memory cell array; and a page buffer circuit coupled to the memory cell array through a plurality of bit lines which extend in a second direction intersecting with a first direction. The page buffer circuit includes a plurality of bit line select transistors coupled to the plurality of bit lines; a plurality of latches coupled to the plurality of bit line select transistors, respectively; and a plurality of erase bias pass transistors coupled to the plurality of bit lines, and configured to transfer an erase voltage to the bit lines. The plurality of erase bias pass transistors and the plurality of bit line select transistors are disposed in different regions, and are not adjacent to each other.

Abstract: A memory device includes a plurality of bit lines extending in a first direction and arranged in a second direction perpendicular to the first direction; a page buffer circuit including a plurality of page buffers which are electrically coupled to the plurality of bit lines; and a cache circuit including a plurality of caches which are electrically coupled to the plurality of page buffers, wherein the page buffer circuit is divided into a plurality of page buffer regions and is laid out at both sides of the cache circuit in the first direction.

Abstract: A semiconductor memory device includes a plurality of bit lines electrically coupled to a memory cell array and extending in a first direction; bit line contact pads formed on a first plane over a substrate and respectively coupled to the bit lines through bit line contacts; and first contact pads formed on the first plane, respectively coupled to the bit line contact pads through redistribution lines, and electrically coupled to a page buffer circuit which is disposed on the substrate, through first contacts, wherein at least two first contact pads corresponding to at least two bit line contact pads which are disposed in a line in a second direction crossing with the first direction are disposed in a line in the first direction.

Abstract: A semiconductor device includes an internal circuit and a power mesh configured to transmit an operating voltage to the internal circuit. The power mesh includes first power lines extending in a first direction and arranged in a second direction intersecting with the first direction, when viewed from a top; second power lines sharing lanes with the first power lines and at least partially overlapping with the first power lines in the second direction; first power straps extending in the second direction and coupled to the first power lines; and second power straps extending in the second direction and coupled to the second power lines. Each of the first and second power lines may have a width of the same size as a width of each lane in sections where they do not overlap, and may have a width of a size smaller than the width of each lane in sections where they overlap.

Abstract: A semiconductor memory device includes a cell wafer including a first plane and a second plane which are disposed to be adjacent to each other in a first direction and each include a plurality of memory cells; and a peripheral wafer including a row decoder which simultaneously controls the first and second planes and first and second page buffer circuits which control the first and second planes, respectively. The cell wafer includes, on one surface thereof bonded to the peripheral wafer, a first pad which is coupled in common with the first plane and the second plane, and the peripheral wafer includes, on one surface thereof bonded to the cell wafer, a second pad which is coupled with the row decoder and is bonded to the first pad.

Abstract: A semiconductor memory device comprises a memory cell array disposed on a substrate, a plurality of bit lines disposed on the a memory cell array, each bit line extending in a first direction parallel to the top surface of the substrate and divided into a first bit line section and a second bit line section, and a plurality of source line pads disposed at the same layer as the bit lines between the first bit line sections of the bit lines and the second bit line sections of the bit lines.

Abstract: A memory device includes a plurality of bit lines; a page buffer circuit including a plurality of page buffers which are electrically coupled to the plurality of bit lines; and a cache circuit including a plurality of caches which are electrically coupled to the plurality of page buffers, wherein a number of stages of the page buffer circuit is less than a number of stages of the cache circuit.

Abstract: A semiconductor memory device includes a stacked structure including a plurality of conductive layers and a plurality of interlayer insulating layers, which are alternately stacked on a substrate; stepped grooves provided in the stacked structure, the stepped grooves having different depths from each other; and an opening portion penetrating the stacked structure to contact the substrate and having steps on sidewalls, the steps having heights corresponding to depth differences between stepped grooves.

Abstract: A semiconductor memory device includes a memory chip defined with a first pad on one surface thereof; and a circuit chip defined with a second pad which is coupled with the first pad, on one surface thereof bonded with the one surface of the memory chip. The memory chip comprising: a memory cell array; a bit line disposed in a first wiring layer between the one surface and the memory cell array, and separated into a first bit line section and a second bit line section; and a power pad disposed in a space between the first bit line section and the second bit line section in the first wiring layer, and coupled with the first pad.

Abstract: A semiconductor memory device includes a memory structural body including first and second planes each of which includes memory cells coupled to word lines extending in a first direction and bit lines extending in a second direction and which are disposed along the first direction; and a logic structural body disposed between a substrate and the memory structural body, and including a row decoder. The row decoder includes a pass transistor circuit which is coupled in common to the first and second planes and a block switch circuit which controls the pass transistor circuit. The block switch circuit is disposed in first and second plane regions of the logic structural body which overlap with the first and second planes in a third direction perpendicular to the first and second directions, and the pass transistor circuit is disposed in an interval region between the first and second plane regions.

Abstract: A semiconductor memory device includes a plurality of bit lines electrically coupled to a memory cell array and extending in a first direction; bit line contact pads formed on a first plane over a substrate and respectively coupled to the bit lines through bit line contacts; and first contact pads formed on the first plane, respectively coupled to the bit line contact pads through redistribution lines, and electrically coupled to a page buffer circuit which is disposed on the substrate, through first contacts, wherein at least two first contact pads corresponding to at least two bit line contact pads which are disposed in a line in a second direction crossing with the first direction are disposed in a line in the first direction.

Abstract: A semiconductor memory device includes a logic structure including a peripheral circuit element which is formed over a substrate, a bottom dielectric layer which covers the peripheral circuit element and a bottom wiring line which is disposed in the bottom dielectric layer and is coupled to the peripheral circuit element; a memory structure stacked over the logic structure in a first direction perpendicular to a top surface of the substrate; a bit line disposed over a first top dielectric layer which covers the memory structure, extending in a second direction parallel to the top surface of the substrate, and divided into first and second bit line sections; and a power pad disposed over the first top dielectric layer between the first bit line section and the second bit line section, and coupled to the bottom wiring line through a power coupling contact which passes through the memory structure.